Abstract: The present invention concerns an electrolyte supplying apparatus including a tank which stores an electrolyte, a supply-receiving unit to which the electrolyte in the tank is supplied, a pipe which connects the tank and the supply-receiving unit, a gas pressure feeding unit which feeds an inert gas under pressure into the tank so that the electrolyte in the tank is supplied to the supply-receiving unit via the pipe by increasing an internal pressure of the tank, and a mass flowmeter which is provided in the pipe and detects a mass flow rate of a fluid flowing in the pipe.

Abstract: There is provided a three-dimensional integrated circuit manufacturing method for temporarily attaching a chip to a transcription substrate, and securely detaching the chip from the transcription substrate when the chip is transferred to a supporting substrate. When a chip is temporarily attached to a transcription substrate, by evaporating a liquid existing between the chip and the transcription substrate, the solids of the chip and the transcription substrate can be attached to each other. Accordingly, the chip can be temporarily attached to the transcription substrate so as not to be deviated from its own position. Further, by setting adhesive strength between the chip and a supporting substrate to be higher than that between the chip and the transcription substrate, the chip can be securely detached from the transcription substrate when the chip is transferred from the transcription substrate to the supporting substrate.

Abstract: A mounting method of mounting an element on a substrate, includes a first hydrophilization process of hydrophilizing a region on a surface of the substrate where the element is to be joined; a second hydrophilization process of hydrophilizing the surface of the element; a mounting process of mounting the element on a mounting part such that the hydrophilized surface of the element faces upwards; a coating process of coating a liquid on the hydrophilized surface of the element; and an arrangement process of arranging the substrate above the mounting part such that the region on the surface of the substrate where the element is to be joined faces downwards. The method further includes a contact process of bringing the substrate arranged above the mounting part close to the mounting part on which the element is mounted to bring the liquid into contact with the surface of the substrate.

Abstract: A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.

Abstract: A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.

Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract: There is provided a three-dimensional integrated circuit manufacturing method for temporarily attaching a chip to a transcription substrate, and securely detaching the chip from the transcription substrate when the chip is transferred to a supporting substrate. When a chip is temporarily attached to a transcription substrate, by evaporating a liquid existing between the chip and the transcription substrate, the solids of the chip and the transcription substrate can be attached to each other. Accordingly, the chip can be temporarily attached to the transcription substrate so as not to be deviated from its own position. Further, by setting adhesive strength between the chip and a supporting substrate to be higher than that between the chip and the transcription substrate, the chip can be securely detached from the transcription substrate when the chip is transferred from the transcription substrate to the supporting substrate.

Abstract: A bonding apparatus includes a first holding section which places and holds a first member on an upper surface, and a second holding section which adsorbs and holds a second member on a lower surface. The second holding section is configured such that a center section bends due to a predetermined pressure. The second holding section includes an intake mechanism which sucks atmosphere of a bonding space between the first holding section and the second holding section. A protrusion which protrudes downward along an outer circumferential lower surface of the second holding section is formed on the outer circumferential lower surface. A sealing member which holds an air-tightness of the bonding space and has elasticity is formed in a lower surface of the protrusion. A height adjusting mechanism which abuts on the protrusion and can adjust the vertical distance between the first member and the second member is formed on a side surface of the first holding section.

Abstract: Disclosed is a therapeutic material for cerebral infarction, which can recover a vascular disorder in an area affected by cerebral infarction to improve the brain function. The therapeutic material for cerebral infarction includes a dental pulp stem cell comprising at least one member selected from a CD105-positive cell, an SP cell, a CD24-positive cell, a CD133-positive cell, a CD271-positive cell and a CD150-positive cell. The therapeutic material may additionally include a protein secreted from a dental pulp cell. A transplanted dental pulp stem cell cannot be differentiated directly into a neural progenitor cell or a neurocyte, but is involved indirectly in the promotion of differentiation to eliminate an area affected by cerebral infarction, thereby recovering the affected area into a normal area.

Abstract: A microlens array sheet includes a light-shielding base having a first surface and a second surface opposite to the first surface and a microlens array attached to the first surface of the light-shielding base, the array having a plurality of microlens. The light-shielding base has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the first surface side is larger than another size of each aperture on the second surface side. Instead of the light-shielding base, the microlens array sheet may include a transparent base having a first surface and a second surface opposite to the first surface and a light-shielding layer, having a third surface and a fourth surface opposite to the third surface, provided on the second surface of the transparent base. The microlens array is attached to the first surface of the transparent base. The light-shielding layer has a plurality of apertures that correspond to the microlenses.

Abstract: An optical unit for use in a backlight device of a liquid crystal display apparatus, has a first light-collecting and -diffusing optical component, a light-collecting optical component, and a second light-collecting and -diffusing optical component, provided in this order on the optical path of light emitted from a light source. Each light-collecting and -diffusing optical component has a surface provided on which are a plurality of microlenses each having a shape of a hemisphere- or semi-oval-like protrusion, with light collecting and diffusing functions. The light-collecting optical component has a surface provided on which are a plurality of prisms each having a saw-teeth like section, with a light collecting function. Each surface is provided on a light-emitting side of the optical unit.

Abstract: An optical unit for use in a backlight device of a liquid crystal display apparatus, has a first light-collecting and -diffusing optical component, a light-collecting optical component, and a second light-collecting and -diffusing optical component, provided in this order on the optical path of light emitted from a light source. Each light-collecting and -diffusing optical component has a surface provided on which are a plurality of microlenses each having a shape of a hemisphere- or semi-oval-like protrusion, with light collecting and diffusing functions. The light-collecting optical component has a surface provided on which are a plurality of prisms each having a saw-teeth like section, with a light collecting function. Each surface is provided on a light-emitting side of the optical unit.

Abstract: A microlens array sheet includes a light-shielding base having a first surface and a second surface opposite to the first surface and a microlens array attached to the first surface of the light-shielding base, the array having a plurality of microlens. The light-shielding base has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the first surface side is larger than another size of each aperture on the second surface side. Instead of the light-shielding base, the microlens array sheet may include a transparent base having a first surface and a second surface opposite to the first surface and a light-shielding layer, having a third surface and a fourth surface opposite to the third surface, provided on the second surface of the transparent base. The microlens array is attached to the first surface of the transparent base. The light-shielding layer has a plurality of apertures that correspond to the microlenses.

Abstract: A microlens array sheet includes a light-shielding base having a first surface and a second surface opposite to the first surface and a microlens array attached to the first surface of the light-shielding base, the array having a plurality of microlens. The light-shielding base has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the first surface side is larger than another size of each aperture on the second surface side. Instead of the light-shielding base, the microlens array sheet may include a transparent base having a first surface and a second surface opposite to the first surface and a light-shielding layer, having a third surface and a fourth surface opposite to the third surface, provided on the second surface of the transparent base. The microlens array is attached to the first surface of the transparent base. The light-shielding layer has a plurality of apertures that correspond to the microlenses.

Abstract: The micro-lens array in which a plural of convexly-protruded micro-lens are closely arranged two-dimensionally and a plural of convex sub-lenses having a curvature-radius smaller than that of the micro-lens are protrusively formed on the surface of each micro-lens has a large view angle, since Dsav/D is in a range from 0.1 to 0.3 where D is the micro-lens bottom face width obtained by halving the summation of the maximum and the minimum width which are measured along the line passing through the center of the bottom face of the micro-lens; Ds is the sub-lens bottom face width obtained by halving the summation of the maximum and the minimum width which are measured along the line passing through the center of the bottom face of the sub-lens; and Dsav is the average sub-lens bottom face width obtained by averaging a plural of the sub-lens bottom face widths Ds.

Abstract: A prober which tests an object to be tested under temperature control is provided. This prober includes a stage base, Z stage, X-Y stage having a frame structure, substrate fixing mechanism arranged on the X-Y stage, a probe card arranged to oppose the substrate fixing mechanism, and a probing stage fixed on the Z stage and arranged in the frame structure of the X-Y stage such that its axis coincides with an extension line vertically extending from the probe center of the probe card. The probing stage includes a probing elevating mechanism, and a temperature controller to heat and cool the object to be tested. The probing stage supports the substrate of the object to be tested from the bottom surface, and controls the temperature of the object to be tested.

Abstract: The micro-lens array in which a plural of convexly-protruded micro-lens are closely arranged two-dimensionally and a plural of convex sub-lenses having a curvature-radius smaller than that of the micro-lens are protrusively formed on the surface of each micro-lens has a large view angle, since Dsav/D is in a range from 0.1 to 0.3 where D is the micro-lens bottom face width obtained by halving the summation of the maximum and the minimum width which are measured along the line passing through the center of the bottom face of the micro-lens; Ds is the sub-lens bottom face width obtained by halving the summation of the maximum and the minimum width which are measured along the line passing through the center of the bottom face of the sub-lens; and Dsav is the average sub-lens bottom face width obtained by averaging a plural of the sub-lens bottom face widths Ds.