Abstract: An ultrasonic element includes at least one cMUT provided to a substrate, wherein the cMUT includes a first electrode provided to the substrate, a frame member having a cavity, a second electrode disposed to face the first electrode with the cavity interposed between the second electrode and the first electrode, and a protective layer covering the second electrode, a length of the cavity in an X axis direction being longer than a width of the cavity in a Y axis direction, the protective layer having a convex region extending in the X axis direction, a width of the convex region in the Y axis direction varying.

Abstract: An ultrasonic element includes at least one cMUT provided to a substrate, wherein the cMUT includes a first electrode provided to the substrate, a frame member having a cavity, a second electrode disposed to face the first electrode with the cavity interposed between the second electrode and the first electrode, and a protective layer covering the second electrode, a length of the cavity in an X axis direction being longer than a width of the cavity in a Y axis direction, the protective layer having a convex region extending in the X axis direction, a width of the convex region in the Y axis direction varying.

Abstract: A manufacturing method of a semiconductor substrate provided with a through hole electrode is proposed. In accordance with the methods, it is possible to effectively form a through hole electrode in a semiconductor substrate in which a device and a wiring pattern have been already fabricated. This manufacturing method includes the steps of forming a first silicon oxide film 12 on a principal surface of the semiconductor substrate 11, forming a small hole 13 through the semiconductor substrate 11 from the opposite the step to reach to the first silicon oxide film 12, covering the inside of the small hole 13 with the second silicon oxide film 14, forming a first thin metal film 15 and a second thin metal film 16 on the first silicon oxide film 12, partially removing the first silicon oxide film 12 corresponding to the end of the small hole 13, and filling the small hole 13 with the conductive material to form a through hole electrode 17.

Abstract: A two-dimensional driving actuator comprises a flat spring structure, and a driver for driving the flat spring structure. The flat spring structure includes a moving plate, a moving inner frame surrounding the moving plate, first torsion bars coupling the moving plate and the moving inner frame so as to allow the moving plate to be vibrated relative to the moving inner frame, a fixed outer frame surrounding the moving inner frame, and second torsion bars coupling the moving inner frame and the fixed outer frame so as to allow the moving inner frame to be vibrated relative to the fixed outer frame. The flat spring structure is manufactured from a single semiconductor substrate. The first and second torsion bars are made of different materials.

Abstract: There is disclosed an optical deflector comprising an oscillating member including a movable plate allowed to oscillate, the movable plate including a coil extending along its periphery, and a magnetic field generation portion, such that the movable plate oscillates in accordance with a force generated by an interaction of a current flowing through the coil with the magnetic field generated by the magnetic field generation portion, wherein the movable plate has first and second surfaces extending in substantially parallel with each other, an imaginary plane including the first surface of the movable plate in a neutral position defines two spaces, one including the second surface of the movable plate and the other not including the second surface, and the magnetic field generation portion is positioned in the space including the second surface of the movable plate.

Abstract: A manufacturing method of a semiconductor substrate provided with a through hole electrode is proposed. In accordance with the methods, it is possible to effectively form a through hole electrode in a semiconductor substrate in which a device and a wiring pattern have been already fabricated. This manufacturing method includes the steps of forming a first silicon oxide film 12 on a principal surface of the semiconductor substrate 11, forming a small hole 13 through the semiconductor substrate 11 from the opposite the step to reach to the first silicon oxide film 12, covering the inside of the small hole 13 with the second silicon oxide film 14, forming a first thin metal film 15 and a second thin metal film 16 on the first silicon oxide film 12, partially removing the first silicon oxide film 12 corresponding to the end of the small hole 13, and filling the small hole 13 with the conductive material to form a through hole electrode 17.

Abstract: An optical scanner has a coil and a reflection face. This optical scanner also has: a movable plate positioned at its neutral position in a stop state; torsion bars connected to the movable plate; a support body turnably supporting the movable plate by means of the torsion bars; and a restriction member disposed at a position spaced with a predetermined distance from a surface of the movable plate. The restriction member comes into physical contact with the movable plate when a shock is applied to the optical scanner. The restriction member restricts a displacement of the movable plate equal to or greater than a predetermined quantity. The movable plate is turned with the torsion bars being a turning axis.

Abstract: A light scanning optical device comprises a light source for entirely illuminating a subject, a converging optical system for converging light returning from a specific minute region of the subject, a light detector for detecting the light converged by the converging optical system, and a scanning mirror for scanning the minute region, the scanning mirror being produced by a semiconductor manufacturing process.

Abstract: There is disclosed an optical deflector comprising an oscillating member including a movable plate allowed to oscillate, the movable plate including a coil extending along its periphery, and a magnetic field generation portion, such that the movable plate oscillates in accordance with a force generated by an interaction of a current flowing through the coil with the magnetic field generated by the magnetic field generation portion, wherein the movable plate has first and second surfaces extending in substantially parallel with each other, an imaginary plane including the first surface of the movable plate in a neutral position defines two spaces, one including the second surface of the movable plate and the other not including the second surface, and the magnetic field generation portion is positioned in the space including the second surface of the movable plate.

Abstract: A two-dimensional driving actuator comprises a flat spring structure, and a driver for driving the flat spring structure. The flat spring structure includes a moving plate, a moving inner frame surrounding the moving plate, first torsion bars coupling the moving plate and the moving inner frame so as to allow the moving plate to be vibrated relative to the moving inner frame, a fixed outer frame surrounding the moving inner frame, and second torsion bars coupling the moving inner frame and the fixed outer frame so as to allow the moving inner frame to be vibrated relative to the fixed outer frame. The flat spring structure is manufactured from a single semiconductor substrate. The first and second torsion bars are made of different materials.

Abstract: An optical scanner has a coil and a reflection face. This optical scanner also has: a movable plate positioned at its neutral position in a stop state; torsion bars connected to the movable plate; a support body turnably supporting the movable plate by means of the torsion bars; and a restriction member disposed at a position spaced with a predetermined distance from a surface of the movable plate. The restriction member comes into physical contact with the movable plate when a shock is applied to the optical scanner. The restriction member restricts a displacement of the movable plate equal to or greater than a predetermined quantity. The movable plate is turned with the torsion bars being a turning axis.