Patents by Inventor Masahiro Sakuma

Masahiro Sakuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5157001
    Abstract: According to the invention, a protective film which is separated from an integrated circuit part and partly buried in the semiconductor wafer is formed in the surface region of semiconductor wafer along a scribing line between adjacent integrated circuit parts. Upon cutting or dicing along the scribing lines, a portion of the protective film may remain along the edges thereof. Thus, the periphery of the semiconductor chips produced by dicing is protected by the protective film, and if an external force is applied to the periphery of the semiconductor chip in the dicing process or die-bonding process, the force is absorbed by the protective film and is hence lessened.
    Type: Grant
    Filed: September 14, 1990
    Date of Patent: October 20, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Masahiro Sakuma