Patents by Inventor Masaichi Inaba

Masaichi Inaba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9258903
    Abstract: It is an object to form a conductive intermediate layer having a function of maximally preventing a solder leaching phenomenon with a low environment load and with good productivity. There are provided an insulative base material 2, a wiring circuit pattern 3 formed on at least one surface of the insulative base material 2, an electronic part mounting land 31 which is formed as part of the wiring circuit pattern 3 and on which an electronic part 7 is to be mounted, and a conductive intermediate layer 5 made of a sintered conductive ink film on the electronic part mounting land 31.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: February 9, 2016
    Assignee: NIPPON MEXTRON, LTD.
    Inventors: Masaichi Inaba, Masayuki Iwase
  • Publication number: 20120103678
    Abstract: It is an object to form a conductive intermediate layer having a function of maximally preventing a solder leaching phenomenon with a low environment load and with good productivity. There are provided an insulative base material 2, a wiring circuit pattern 3 formed on at least one surface of the insulative base material 2, an electronic part mounting land 31 which is formed as part of the wiring circuit pattern 3 and on which an electronic part 7 is to be mounted, and a conductive intermediate layer 5 made of a sintered conductive ink film on the electronic part mounting land 31.
    Type: Application
    Filed: September 29, 2010
    Publication date: May 3, 2012
    Inventors: Masaichi Inaba, Masayuki Iwase
  • Patent number: 5961334
    Abstract: A connection structure of a suspension for a magnetic head suitable for assembly automation is provided. The connection structure of a suspension for a magnetic head comprises a suspension (1) for a magnetic head which includes a circuit wiring pattern (4) for connecting to the terminal side of a magnetic head and is clasped by and supported between an actuator arm (9) and a base plate (10), a relay board (7) for connecting the circuit wiring pattern to a read/write amplifier-board, and a connecting portion consisting of a pair of terminals (6) and (8) provided at portions of the suspension for a magnetic head and the relay board which are clasped by the actuator arm and the base plate, and wherein the connecting portion is formed by positioning the pair of terminals opposite one another and bringing them into mutual contact.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: October 5, 1999
    Assignee: Nippon Mektron, Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5914179
    Abstract: A desired circuit wiring pattern is formed by plating a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: June 22, 1999
    Assignee: Nippon Mektron Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5857257
    Abstract: A method of manufacturing a magnetic head suspension having a circuit wiring pattern member such that a circuit wiring pattern is formed integral with a suspension via a flexible insulating base member, comprising the steps of: preparing a laminated plate composed of a flexible insulating base member (2), a conductive layer (6 or 3) formed on one surface thereof, and an elastic metal layer (5 or 1) formed on the other surface thereof; forming a desired circuit wiring pattern (3) in the conductive layer (6) of the laminated plate and an elastic suspension (1) in the elastic metal layer (5) thereof simultaneously, in accordance with photo-fabrication method including both-side simultaneous exposure method; forming a bonding metal layer (10) on the circuit wiring pattern (3) by plating; forming a cover coat layer (11) so as to cover the bonding metal layer; further forming a metal mask (13 or 13A) by forming a surface metal layer (12) on the cover coat layer and by etching the surface metal layer (12) or else by
    Type: Grant
    Filed: May 19, 1997
    Date of Patent: January 12, 1999
    Assignee: Nippon Mektron, Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5854724
    Abstract: A magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension for supporting the magnetic head element. The suspension is equipped integrally with a circuit wiring pattern via a flexible insulating base material. The flexible insulating base material is made as wide as the circuit wiring pattern. The top surface of the circuit wiring pattern has a surface protecting layer which is wider than the circuit wiring pattern.
    Type: Grant
    Filed: August 2, 1996
    Date of Patent: December 29, 1998
    Assignee: Nippon Mektron, Ltd.
    Inventors: Masaichi Inaba, Hirofumi Matsumoto, Yasuyuki Tanaka
  • Patent number: 5844753
    Abstract: A flexible circuit board, an end of which is uniformly connected to the inside of a springy metal layer, which has been bent to a U shape, and the rest of which extends in a predetermined width away from the springy metal layer. The flexible circuit board is equipped with bump-shaped connecting terminals on the opposed bent sections, each connecting terminal having a first side connected to the ends of the circuit wiring pattern formed on the flexible circuit board and a second generally opposed side projecting outwardly from the flexible circuit board. The bump-shaped terminals are electrically connected to the terminal of the magnetic head suspension, which is made integral with circuit wiring, by the clamping force of the springy metal layer.
    Type: Grant
    Filed: June 18, 1997
    Date of Patent: December 1, 1998
    Assignee: Nippon Mektron Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5809634
    Abstract: A method of manufacturing a magnetic head suspension having a circuit wiring pattern member, comprises the steps of: preparing a laminated plate composed of a flat flexible insulating base member (2), a conductive layer (9 or 3) formed on one surface thereof, and an elastic metal layer (8 or 1) formed on the other surface thereof; photo-etching the conductive layer of the laminated plate, to form a metal mask (9) of a desired flexible insulating base member shape; removing the exposed flexible insulating base member (2) to such a thickness that the elastic metal layer (8 or 1) is at least not exposed; photo-etching the formed metal mask (9), to form a desired circuit wiring pattern (3); further etching the flexible insulating base member (2), to remove a part of the flexible insulating base member (2) still remaining on the surface of the elastic metal layer (8 or 1) in the preceding step, by using the formed circuit wiring pattern (3) as a mask; forming a surface protecting layer (4) on the surface of the fo
    Type: Grant
    Filed: May 5, 1997
    Date of Patent: September 22, 1998
    Assignee: Nippon Mektron, Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5771569
    Abstract: A magnetic head suspension, wherein the interconnection wiring is integrated with a spring-like metal suspension member, is manufactured by first preparing a laminated plate comprised of a flexible insulating base sandwiched between a resilient metal layer and a layer of an electrical conductor. The electrical conductor layer and resilient metal layer are respectively formed into the desired circuit wiring pattern and a suspension member, unnecessary portions of the insulating base are removed, the wiring pattern is provided with a protective layer and the suspension member is mechanically formed into a desired final configuration.
    Type: Grant
    Filed: December 27, 1996
    Date of Patent: June 30, 1998
    Assignee: Nippon Mektron, Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5759417
    Abstract: A desired circuit wiring pattern is formed by forming by plating means a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching means using a resist layer. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: June 2, 1998
    Assignee: Nippon Mektron, Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5737837
    Abstract: A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the conductive layer by photoetching and the springy metal layer is formed into a predetermined shape by etching. The circuit wiring pattern is provided with a surface protecting layer which leaves holes exposed at the ends of the circuit wiring pattern. Then, the holes are filled with conductive metal to form bump-shaped terminals such that the ends on one side jut out of the surface protecting layer. Lastly, the springy metal layer is bent into a predetermined shape so that the bump-shaped terminals face against each other. Alternative process are also disclosed.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: April 14, 1998
    Assignee: Nippon Mektron Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 5666717
    Abstract: A method of manufacturing a magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension which includes the steps of (1) forming a flexible insulating base material on one surface of a springy metal layer by using a non-photosensitive polyimide resin layer or a photosensitive insulating resin layer; (2) producing a circuit wiring pattern on the top of the flexible insulating base material by plating and by using an electrically conductive metal thin film; (3) for forming a surface protecting layer on the surface of the circuit wiring pattern; (4) the springy metal layer; and (5) bending the springy metal layer to form a desired suspension.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: September 16, 1997
    Assignee: Nippon Mektron, Ltd.
    Inventors: Hirofumi Matsumoto, Mitsunobu Shoumura, Norimasa Fujita, Masaichi Inaba, Yasuyuki Tanaka
  • Patent number: 5446245
    Abstract: A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: August 29, 1995
    Assignee: Nippon Mektron, Ltd.
    Inventors: Takeshi Iwayama, Atsushi Miyagawa, Masaichi Inaba
  • Patent number: 5444188
    Abstract: A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.
    Type: Grant
    Filed: September 8, 1993
    Date of Patent: August 22, 1995
    Assignee: Nippon Mektron, Ltd.
    Inventors: Takeshi Iwayama, Atsushi Miyagawa, Masaichi Inaba
  • Patent number: 5408052
    Abstract: A flexible multi-layer circuit wiring board which is capable of constituting finger lead-like terminals that are little liable to be deformed even when the circuit conductors protruding like finger leads are finely formed and is capable of maintaining good flexibility at a bent portion. Circuit conductors 2 composed of an electrically conducting metal having a large Young's modulus are disposed at the ends of one surface of a flexible insulating base member 1 to form finger lead-like terminals 3, required circuit wiring conductors 4 composed of an electrically conducting metal rich in flexibility are disposed on the other surface of the flexible insulating base member 1 inclusive of a bent portion A of the circuit wiring board, and through-hole connection portions 5 are formed to electrically connect required portions of the circuit conductors 2 and the circuit wiring conductors 4.
    Type: Grant
    Filed: September 13, 1993
    Date of Patent: April 18, 1995
    Assignee: Nippon Mektron, Ltd.
    Inventors: Masaichi Inaba, Atsushi Miyagawa, Takeshi Iwayama
  • Patent number: 5369881
    Abstract: This invention provides a method of forming a circuit wiring pattern which cannot be formed by a prior art method such as etching or plating. This method comprises a step of forming trenches for forming a circuit wiring pattern at predetermined positions on at least one of the surface of an insulating base material and then filling a conductive material into the trenches, a step of removing conductor layers in such a manner that the conductor layers formed by the step described above exist only in the trenches formed in the insulating base material and gap portions of the circuit wiring pattern comprising the conductor layers formed in the trenches of the insulating base material are exposed, and a step of forming an insulating surface protection layer.
    Type: Grant
    Filed: September 20, 1993
    Date of Patent: December 6, 1994
    Assignee: Nippon Mektron, Ltd.
    Inventors: Masaichi Inaba, Norimasa Fujita
  • Patent number: 4508942
    Abstract: A membrane keyboard with a circuit means having a plurality of snap action domes formed therein has a cover sheet thereon. A plurality of cavities formed between the cover sheet and the domed circuit layer has air passages connecting each cavity with the ambient environment. The structure of the present invention permits lower tensile force during actuation and results in improved snap action and tactile feel.
    Type: Grant
    Filed: November 28, 1983
    Date of Patent: April 2, 1985
    Assignee: Nippon Mektron Ltd.
    Inventor: Masaichi Inaba
  • Patent number: 4471176
    Abstract: A snap action keyboard switch mechanism is presented wherein protrusions located on the switch sheet between adjoining snap action elements act to support the switch sheet and avoid inadvertent input. If a key is actuated off center, the support protrusions will prevent erroneous actuation of an adjoining key. The protrusion height varies depending upon the desired optimum tactility.
    Type: Grant
    Filed: April 29, 1983
    Date of Patent: September 11, 1984
    Assignee: Nippon Mektron, Ltd.
    Inventor: Masaichi Inaba