Patents by Inventor Masakazu Ishikawa

Masakazu Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220002771
    Abstract: A method for producing a secreted ?-galactosidase, characterized by integrating a non-secreted ?-galactosidase gene derived from a basidiomycetous yeast into Aspergillus oryzae to produce a secreted ?-galactosidase, and a method for producing a galactooligosaccharide using a ?-galactosidase produced by the method facilitate the production of a galactooligosaccharide.
    Type: Application
    Filed: November 7, 2019
    Publication date: January 6, 2022
    Applicant: KABUSHIKI KAISHA YAKULT HONSHA
    Inventors: Eiji ISHIKAWA, Masakazu IKEDA, Minako ANBE, Hiroshi HATANO
  • Publication number: 20210338890
    Abstract: The present invention aims to provide a meniscus regeneration material having high meniscus regeneration ability.
    Type: Application
    Filed: September 25, 2019
    Publication date: November 4, 2021
    Applicants: HIROSHIMA UNIVERSITY, SANYO CHEMICAL INDUSTRIES, LTD.
    Inventors: Nobuo ADACHI, Naosuke KAMEl, Masakazu ISHIKAWA, Tomoyuki NAKASA, Shingo KAWABATA, Tsubasa YAMANAKA
  • Patent number: 11007722
    Abstract: A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 ?m, a thickness of the dielectric welding film ranging from 10 to 2,000 ?m. The method uses the dielectric welding film.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: May 18, 2021
    Assignee: LINTEC CORPORATION
    Inventors: Masakazu Ishikawa, Tatsuya Izumi
  • Publication number: 20200224062
    Abstract: The invention provides a method of dismantling an adhesion structure including a pair of adherends made of the same material or different materials and a dielectric adhesive sheet interposed between the pair of adherends and bonding the pair of adherends to each other. The method includes: a first step of heating the dielectric adhesive sheet by dielectric heating; and a second step of applying an external force to at least one of the pair of adherends or the dielectric adhesive sheet to separate the pair of adherends from the dielectric adhesive sheet.
    Type: Application
    Filed: August 6, 2018
    Publication date: July 16, 2020
    Inventor: Masakazu ISHIKAWA
  • Publication number: 20200087541
    Abstract: A high-frequency dielectric heating adhesive sheet requires no releasable sheet, exhibiting excellent handleability and workability to an adherend even when a size of the high-frequency dielectric heating adhesive sheet is large, and an adhesion method of the high-frequency dielectric heating adhesive sheet. The high-frequency dielectric heating adhesive sheet includes a sheet-shaped base material and a high-frequency dielectric adhesive layer containing a thermoplastic resin as a component A and a dielectric filler as a component B.
    Type: Application
    Filed: March 30, 2018
    Publication date: March 19, 2020
    Inventor: Masakazu ISHIKAWA
  • Publication number: 20200063001
    Abstract: A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 ?m, a thickness of the dielectric welding film ranging from 10 to 2,000 ?m. The method uses the dielectric welding film.
    Type: Application
    Filed: October 18, 2017
    Publication date: February 27, 2020
    Applicant: LINTEC Corporation
    Inventors: Masakazu ISHIKAWA, Tatsuya IZUMI
  • Publication number: 20200010730
    Abstract: A dielectric welding film for welding a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including at least one resin selected from the group consisting of an olefin-vinyl acetate copolymer and a maleic anhydride-modified polyolefin, the olefin-vinyl acetate copolymer containing 2 mass % or more constituent unit derived from vinyl acetate.
    Type: Application
    Filed: February 8, 2018
    Publication date: January 9, 2020
    Inventors: Naoki TAYA, Masakazu ISHIKAWA
  • Publication number: 20190352546
    Abstract: A dielectric welding configured to weld a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including a polyolefin resin having a polar part, a content of the B component in the dielectric welding film ranging from 3 volume % to 40 volume %.
    Type: Application
    Filed: February 8, 2018
    Publication date: November 21, 2019
    Inventors: Naoki TAYA, Masakazu ISHIKAWA
  • Publication number: 20190329504
    Abstract: A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.
    Type: Application
    Filed: October 18, 2017
    Publication date: October 31, 2019
    Applicant: LINTEC CORPORATION
    Inventor: Masakazu ISHIKAWA
  • Publication number: 20190282236
    Abstract: Nerve scaffolds are described that include a tubular outer housing fabricated from a biocompatible polymer, within which are disposed a plurality of carbon nanofiber yarns. The carbon nanofiber yarns, which can be separated by distances roughly corresponding to an average nerve fiber diameter, provide surfaces on which nerve fibers can regrow. Because the proximate carbon nanofiber yarns can support individual nerve fibers, a nerve can be regenerated with a reduced likelihood of undesirable outcomes, such as nerve pain or reduced nerve function.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 19, 2019
    Applicant: Lintec Of America, Inc.
    Inventors: Akira KODAMA, Masakazu ISHIKAWA, Marcio D. LIMA
  • Publication number: 20190283334
    Abstract: A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.
    Type: Application
    Filed: October 18, 2017
    Publication date: September 19, 2019
    Applicant: LINTEC CORPORATION
    Inventor: Masakazu ISHIKAWA
  • Patent number: 10201449
    Abstract: A sex toy holder is provided to be capable of holding a sex toy, and is used for action using the sex toy to obtain sexual pleasure, and includes a gripping portion that is gripped by a user during the action, and extends along a predetermined direction, two leg portions arranged side by side at a distance along the predetermined direction and provided so that a center of the gripping portion and a center between the two leg portions match each other in the predetermined direction, and a support portion that supports the two leg portions and the gripping portion.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: February 12, 2019
    Inventor: Masakazu Ishikawa
  • Publication number: 20180104088
    Abstract: A sex toy holder is provided to be capable of holding a sex toy, and is used for action using the sex toy to obtain sexual pleasure, and includes a gripping portion that is gripped by a user during the action, and extends along a predetermined direction, two leg portions arranged side by side at a distance along the predetermined direction and provided so that a center of the gripping portion and a center between the two leg portions match each other in the predetermined direction, and a support portion that supports the two leg portions and the gripping portion.
    Type: Application
    Filed: October 12, 2017
    Publication date: April 19, 2018
    Inventor: Masakazu ISHIKAWA
  • Patent number: 9208037
    Abstract: The present invention provides a duplexed operation processor control system that includes operation processors, an I/O device, and at least one communication path that couples the operation processors to the I/O device, and at least one communication path that couples the operation processors with each other. The duplexed operation processor control system switches over either of the operation processors to be a primary operation processor that executes a control operation for a control target, and the other to be a secondary operation processor that is in a stand-by state, and the secondary operation processor snoops control data synchronously when the primary operation processor acquires the control data from the control target.
    Type: Grant
    Filed: June 18, 2009
    Date of Patent: December 8, 2015
    Assignees: HITACHI, LTD., HITACHI INDUSTRY & CONTROL SOLUTIONS, LTD.
    Inventors: Toshiki Shimizu, Akira Bando, Yusaku Otsuka, Yasuhiro Kiyofuji, Eiji Kobayashi, Akihiro Onozuka, Satoru Funaki, Masakazu Ishikawa, Hideaki Masuko, Yusuke Seki, Wataru Sasaki, Naoya Mashiko, Akihiro Nakano, Shin Kokura, Shoichi Ozawa, Yu Iwasaki
  • Patent number: 8493927
    Abstract: In a control apparatus which transmits/receives data from a central processing unit via a serial transfer channel to a communication control unit, and groups/distributes data of input/output units from the communication control unit via a parallel transfer channel, the control apparatus initiates a diagnosing unit of the parallel transfer channel in response to an instruction issued from the central processing unit, and diagnosis the input/output units subsequent to the diagnosis of the transmission channel. Data input/output timing of the input/output unit is also instructed from the central processing unit, so that the central processing unit can suppress lowering of response speeds caused by the diagnoses, and can maintain the periodicity of the data input/output.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: July 23, 2013
    Assignees: Hitachi, Ltd., Hitachi Information & Control Solutions, Ltd.
    Inventors: Akira Bandou, Masamitsu Kobayashi, Masahiro Shiraishi, Akihiro Onozuka, Takashi Umehara, Shin Kokura, Eiji Kobayashi, Masakazu Ishikawa, Yasuyuki Furuta, Naoya Mashiko, Satoru Funaki, Yuusuke Seki, Tatsuyuki Ootani, Wataru Sasaki, Yusaku Otsuka, Akihiro Nakano, Shoichi Ozawa, Takenori Kasahara, Yu Iwasaki
  • Patent number: 8386862
    Abstract: A fault diagnosis apparatus and method capable of simultaneously detecting the fault of a multiplexer and the fault of an A/D converter and isolating and identifying causes of these faults, the multiplexer and the A/D converter being used in a multi-channel analog input/output circuit. Test-voltage values are inputted from a diagnosis-voltage input unit into the multiplexer and the A/D converter constituting an analog-signal conversion unit, the multiplexer having plural channels, the A/D converter converting outputs from the multiplexer into digital signals, the test-voltage values being different from each other for each channel of the multiplexer. Comparisons are made between the digital voltage values and the test-voltage values inputted, the digital voltage values being outputted for each channel of the multiplexer. From this comparison result, it is judged whether the multiplexer is at fault or the A/D converter is at fault.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: February 26, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Hisashi Terae, Masakazu Ishikawa, Yasuyuki Furuta, Katsumi Yoshida, Atsushi Nishioka, Yasuhiro Kiyofuji, Takenori Kasahara, Syuichi Nagayama, Fujiya Kawawa, Manabu Kubota, Tatsuyuki Ootani, Hidechiyo Tanaka
  • Patent number: 8209594
    Abstract: A receiving device including: a receiver receiving two frames, each including substantially same data attached thereto with a data error detection code, a frame error detection code, and safety flag information indicating a safety function or not, respectively; a first detector connected to the receiver for performing error detection of the frames by use of the frame error detection code, respectively; a second detector connected to the receiver for performing error detection of the data by use of the data error detection code, respectively; and a Direct Memory Access Controller (DMAC) connected to the first and second detectors for outputting one among the data included in the two frames under a condition of the safety function in the two frames when no error is detected in the frame and data error detections.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: June 26, 2012
    Assignees: Hitachi, Ltd., Hitachi Information & Control Solutions, Ltd.
    Inventors: Akihiro Onozuka, Masakazu Ishikawa, Masamitsu Kobayashi, Takashi Umehara, Shin Kokura, Hiromichi Endoh, Satoru Funaki, Hisao Nagayama, Masahiro Shiraishi, Akira Bando, Eiji Kobayashi, Yasuyuki Furuta, Naoya Mashiko
  • Patent number: 8161362
    Abstract: Processed results are received when processors make compatible computations on data of a common object. A computation command signal is generated and fed to the processors in response to a start signal from any one of the processors so that the processors can make computations with different operation timings. Then, the results of the computations made by the processors are compared with each other. Thus, apparatus capable of small size, high performance and safety at the same time can be achieved by the above construction using the processors.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: April 17, 2012
    Assignees: Hitachi, Ltd., Hitachi Information & Control Solutions, Ltd.
    Inventors: Akira Bando, Shin Kokura, Takashi Umehara, Masamitsu Kobayashi, Hisao Nagayama, Naoya Mashiko, Masakazu Ishikawa, Masahiro Shiraishi, Akihiro Onozuka, Hiromichi Endoh, Tsutomu Yamada, Satoru Funaki
  • Publication number: 20120003738
    Abstract: The present invention provides a method for expanding and improving functional capacity of human adult-derived progenitor cells in vitro using a closed culture system. The present invention provides a favorable condition for cell therapy to promote tissue repair and organogenesis via vasculogenesis and angiogenesis in clinical settings. The proposed closed bag culture system for culturing hemangioblast comprises of, in one embodiment, a serum-free culture medium containing one or more factors selected from the group consisting of stem cell growth factor, interleukin-6, FMS-like tyrosine kinase 3, thrombopoietin, and vascular endothelial growth factor and a kit for the preparation of the serum-free culture medium and the like.
    Type: Application
    Filed: June 20, 2011
    Publication date: January 5, 2012
    Inventors: Marco A. Costa, Masakazu Ishikawa, Takayuki Asahara, Haruchika Masuda
  • Publication number: 20110214125
    Abstract: An input/output control apparatus including: a unit that controls input/output of data relating to a computation of a plurality of processors in response to an access request from a second input/output unit and an access request from a first input/output unit which requires higher reliability than said second input/output unit, and orders at least one of a plurality of processors to perform a computation relating to the access request from said first input/output unit away from the computation relating to the access request from said second input/output unit in case of that said first input/output unit issued an access request, so that a same computation is made by said plurality of processors; a unit that compares the results of said computations relative to the access request from said first input/output unit provided from said plurality of processors; and a unit that allows the data associated with said computations of said processors to be output on the basis of said compared results.
    Type: Application
    Filed: May 11, 2011
    Publication date: September 1, 2011
    Inventors: Akira Bando, Shin Kokura, Takashi Umehara, Masamitsu Kobayashi, Hisao Nagayama, Naoya Mashiko, Masakazu Ishikawa, Masahiro Shiraishi, Akihiro Onozuka, Hiromichi Endoh, Tsutomu Yamada, Satoru Funaki