Patents by Inventor Masaki Akatsuka

Masaki Akatsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060276568
    Abstract: This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by Formula (1) below E-M-S-M-E??(1) (where E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer). Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.
    Type: Application
    Filed: August 17, 2006
    Publication date: December 7, 2006
    Inventors: Masaki Akatsuka, Yoshitaka Takazawa, Katsuo Sugawara
  • Patent number: 7109288
    Abstract: This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by the following formula: E-M-S-M-E, wherein E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer. Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: September 19, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Masaki Akatsuka, Yoshitaka Takazawa, Katsuo Sugawara
  • Publication number: 20040147709
    Abstract: This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more.
    Type: Application
    Filed: November 18, 2003
    Publication date: July 29, 2004
    Inventors: Masaki Akatsuka, Yoshitaka Takazawa, Katsuo Sugawara
  • Patent number: 6765043
    Abstract: An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin composition is provided based on this epoxy resin. The epoxy resin includes a major compound having a structure expressed by the Chemical Formula (1), and a method is provided for manufacturing the epoxy resin by reaction of (A) an epoxy resin with one mesogen contained in a molecule and (B) a compound with two elements of active hydrogen contained in a molecule, with the percentage composition of (B) active hydrogen with respect to (A) epoxy group being 0.25 and over, up to and including 0.7.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: July 20, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Masaki Akatsuka, Yoshitaka Takezawa, Hisashi Morooka
  • Publication number: 20030232964
    Abstract: An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin composition is provided based on this epoxy resin. The epoxy resin includes a major compound having a structure expressed by the Chemical Formula (1), and a method is provided for manufacturing the epoxy resin by reaction of (A) an epoxy resin with one mesogen contained in a molecule and (B) a compound with two elements of active hydrogen contained in a molecule, with the percentage composition of (B) active hydrogen with respect to (A) epoxy group being 0.25 and over, up to and including 0.7.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 18, 2003
    Inventors: Masaki Akatsuka, Yoshitaka Takezawa, Hisashi Morooka
  • Publication number: 20030229159
    Abstract: (Subject)
    Type: Application
    Filed: September 19, 2002
    Publication date: December 11, 2003
    Inventors: Masaki Akatsuka, Yoshitaka Takezawa, Hisashi Morooka
  • Publication number: 20030031932
    Abstract: An electrolyte, which comprises (a) a compound having at least one methylene group adjacent to an oxygen atom in the molecule, (b) a compound represented by the following formula (1), 1
    Type: Application
    Filed: September 20, 2001
    Publication date: February 13, 2003
    Inventors: Takefumi Okumura, Shin Nishimura, Masaki Akatsuka
  • Patent number: 6261481
    Abstract: An insulating material of high electrically insulating properties and high thermal conductivity is provided wherein the high thermal conductivity is attained by having a liquid crystal resin comprising a polymerization product of a resin composition containing a monomer which has a mesogen group.
    Type: Grant
    Filed: March 15, 1999
    Date of Patent: July 17, 2001
    Assignee: Hitachi, LTD
    Inventors: Masaki Akatsuka, Yoshitaka Takezawa, Yuzo Ito
  • Patent number: 5550209
    Abstract: Disclosed are a lactone polymer, a carbonate polymer, a lactone-carbonate random or block copolymer which are mono-dispersed, that is, which have a molecular weight distribution of nearly 1, or, in which purity of a polymer component having a unitary structure is very high, and processes for the preparation thereof which comprise a ring-opening addition reaction of a lactone monomer and/or a cyclic carbonate monomer with a ring-opening initiator in the presence of an organic aluminum-based Lewis acid represented by general formula (I), ##STR1## wherein R is an alkyl group having a carbon number ranging from 1 to 4, Y is independently selected from a substituted group, and p is any one of 1, 2 and 3.
    Type: Grant
    Filed: February 28, 1995
    Date of Patent: August 27, 1996
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Shohei Inoue, Takuzo Aida, Masaki Akatsuka
  • Patent number: 4266324
    Abstract: Sliver weight unevenness correcting apparatus of a feed-forward type has: a sliver weight measuring section for detecting the variations in weight of a bundle of slivers; a correcting draft device having front rollers disposed downstream of the sliver weight measuring section relative to the direction of advancement of slivers, the front rollers being rotated at a constant speed, and back rollers disposed between the sliver weight measuring section and the front rollers, the back rollers being rotated at a variable speed; a rotation detector for detecting the number of revolutions of the front rollers; an unevenness correcting circuit having a ratio circuit for operating a ratio (E.sub.0 /E.sub.1) between a reference sliver weight (E.sub.0) and the detected weight (E.sub.1) thereof, a delay circuit for delaying the speed control of the back rollers of the correcting draft device for a predetermined period of time, and a contrasting operational circuit for multiplying the ratio (E.sub.0 /E.sub.
    Type: Grant
    Filed: December 27, 1979
    Date of Patent: May 12, 1981
    Assignees: Kabushiki Kaisha Toyota Chuo Kenkyusho, Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
    Inventors: Junzo Hasegawa, Susumu Kawabata, Hiroshi Niimi, Yasuhiko Suzuki, Masaki Akatsuka, Takahiko Tsunekawa