Patents by Inventor Masaki Ohsugi

Masaki Ohsugi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11756708
    Abstract: An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate, and a Vickers hardness of the Cu plating layer is in the range of 80 to 190 HV.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: September 12, 2023
    Assignee: Fujikura Ltd.
    Inventor: Masaki Ohsugi
  • Patent number: 11621105
    Abstract: An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate. An average crystal grain size of the Cu plating layer is 3.30 ?m or more and equal to or less than a thickness of the Cu plating layer.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: April 4, 2023
    Assignee: Fujikura Ltd.
    Inventor: Masaki Ohsugi
  • Publication number: 20220148763
    Abstract: An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate, and a Vickers hardness of the Cu plating layer is in the range of 80 to 190 HV.
    Type: Application
    Filed: March 16, 2020
    Publication date: May 12, 2022
    Applicant: Fujikura Ltd.
    Inventor: Masaki Ohsugi
  • Publication number: 20220148762
    Abstract: An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate. An average crystal grain size of the Cu plating layer is 3.30 ?m or more and equal to or less than a thickness of the Cu plating layer.
    Type: Application
    Filed: March 16, 2020
    Publication date: May 12, 2022
    Applicant: Fujikura Ltd.
    Inventor: Masaki Ohsugi
  • Publication number: 20190172612
    Abstract: An oxide superconducting wire includes two superconducting laminates that are superposed on each other in a thickness direction. Each superconducting laminate includes a tape-shaped substrate, an intermediate layer disposed on one face of the substrate, an oxide superconducting layer disposed on the intermediate layer, and a protective layer covering a surface of the oxide superconducting layer. The two superconducting laminates are integrated by a metal layer that is disposed at least on both lateral faces of the two superconducting laminates in a width direction, such that the two superconducting laminates form a non-fixed portion therebetween that is not fixed in a longitudinal direction of the superconducting laminates.
    Type: Application
    Filed: July 27, 2017
    Publication date: June 6, 2019
    Applicant: FUJIKURA LTD.
    Inventor: Masaki Ohsugi
  • Publication number: 20180114638
    Abstract: In a method of manufacturing an oxide superconducting wire, a superconducting laminated body is prepared, a tape-shaped stabilizer is folded to be divided into a first portion in which the stabilizer covers one surface of the superconducting laminated body in a thickness direction and a second portion in which the stabilizer covers both side surfaces of the superconducting laminated body in a widthwise direction and the stabilizer is disposed around the superconducting laminated body, the first portion is formed to have a width larger than that of the superconducting laminated body using a molding jig and the superconducting laminated body is covered with the stabilizer, and the superconducting laminated body and the stabilizer are bonded and a bonding material between the second portion and the superconducting laminated body is formed to have a thickness larger than that of a bonding material between the first portion and the superconducting laminated body.
    Type: Application
    Filed: November 8, 2016
    Publication date: April 26, 2018
    Applicant: FUJIKURA LTD.
    Inventor: Masaki Ohsugi