Abstract: A surface-mounting choke coil has a resin coating material with magnetic powder which is filled a space between the upper flange and the lower flange of a drum-type ferrite core, while covering the circumferential of the winding. The resin coating material with magnetic powder has a glass transition temperature Tg of about ?20° C. or lower, more preferably about ?50° C. or lower in a course of transferring from a glass state to a rubber state during changing of shear modulus with respect to temperature as a physical property when hardening, and the thickness of the upper flange of the drum-type ferrite core is about 0.35 mm or less, and a value of a ratio L2/L1 of an outer diameter L2 of the upper flange to a diameter L1 of the winding core of the drum-type ferrite core is about 1.9 or more.

Abstract: The present invention provides a method of manufacturing a semiconductor device and a semiconductor device that allow use of interlayer and interconnect insulating films having a low dielectric constant in forming a dual damascene structure. A first insulating film, a second insulating film, a first-mask forming layer, a second-mask forming layer, a third-mask forming layer, and a fourth-mask forming layer are sequentially deposited over a substrate. The fourth-mask forming layer is patterned to form a fourth mask having an interconnect trench pattern. After a resist mask is formed on the fourth mask, the layers to the second insulating film are etched to open via holes. The third-mask forming layer is etched through the fourth mask to thereby form a third mask having the interconnect trench pattern and to extend the via holes downward partway across the first insulating film.

Abstract: Each terminal (3) of a bulb socket (1) has a power-supplying tab (31) and a bulb connecting portion (32) that are integral with one another. The bulb connecting portion (32) is on an extension of the power-supplying tab (31) extending along an inserting direction into a connector accommodating portion (25). Thus, the bulb socket (1) is reduced in height, the number of assembling steps is reduced, and the deformation of the terminals can be avoided. Further, a reduction in the number of parts leads to reduced production costs.

Abstract: The present invention relates to a new crystal of triazaspiro[5.5]undecane derivatives. The crystal of a non-solvate of (3R)-1-butyl-2,5-dioxo-3-[(1R)-1-hydroxy-1-cyclohexylmethyl]-9-[4-(4-carboxyphenyloxy)phenylmethyl]-1,4,9-triazaspiro[5.5]undecane hydrochloride have safety as drug substance, and have possibility to supply at large scale. And the crystal have an antagonistic activity against the interaction between chemokine and chemokine receptor, therefore, it is useful for manufacture of an agent for treating and/or preventing diseases such as various inflammatory diseases, asthma, atopic dermatitis, nettle rash, allergy disease, nephritis, nephropathy, hepatitis, arthritis, chronic rheumatoid arthritis, autoimmune disease, transplanted organ rejection reactions, acquired immunodeficiency syndrome and the like.

Abstract: An object of the present invention is to provide a process of producing alkoxysilanes, which does not use a chlorosilane as the intermediate raw material, is improved in view of the environment, and is satisfactory with respect to the yield of a desired material. The present invention is concerned with a process of producing an alkoxysilane including hydrosilylating (A) an organosilicon compound having at least one hydrogen-silicon bond and at least one alkoxy group and (B) an organic compound having a carbon—carbon unsaturated bond in vapor phase in the presence of a mixture containing a hydrosilylation catalyst and a polyalkylene glycol and supported on a carrier, thereby adding hydrogen and silicon of the compound (A) to the carbon—carbon unsaturated bond in the compound (B).

Abstract: A surface-mounting choke coil has a resin coating material with magnetic powder which is filled a space between the upper flange and the lower flange of a drum-type ferrite core, while covering the circumferential of the winding. The resin coating material with magnetic powder has a glass transition temperature Tg of about ?20° C. or lower, more preferably about ?50° C. or lower in a course of transferring from a glass state to a rubber state during changing of shear modulus with respect to temperature as a physical property when hardening, and the thickness of the upper flange of the drum-type ferrite core is about 0.35 mm or less, and a value of a ratio L2/L1 of an outer diameter L2 of the upper flange to a diameter L1 of the winding core of the drum-type ferrite core is about 1.9 or more.

Abstract: A memory controller (1) writes data continuously to a first and a second blocks (20A), (20B) which are provided by dividing a memory region of a nonvolatile memory (2), and reads the data therefrom. The controller includes: a first writer (12A) which writes data to the first block (20A); and a second writer (12B) which writes data to the second block (20B) after completion of the writing by the first writer (12A) and a lapse of a waiting time generally equal to a length of time necessary for a power breakdown to drop a power source voltage down to a voltage value to at least disable the writing of data to the memory region.

Abstract: Each terminal (3) of a bulb socket (1) has a power-supplying tab (31) and a bulb connecting portion (32) that are integral with one another. The bulb connecting portion (32) is on an extension of the power-supplying tab (31) extending along an inserting direction into a connector accommodating portion (25). Thus, the bulb socket (1) is reduced in height, the number of assembling steps is reduced, and the deformation of the terminals can be avoided. Further, a reduction in the number of parts leads to reduced production costs.

Abstract: In a mounting process simulation system and a method thereof in accordance with the present invention, the respective simulations of a mounting process having a plurality of sequential steps are analyzed on the basis of condition parameters, a single evaluation value is created on the basis of the analysis results, and when the evaluation value does not reach a target value, an approximate function is created on the basis of the analysis results, a tentative parameter is created, and optimization is carried out again.

Abstract: An object of the present invention is to provide a process of producing alkoxysilanes, which does not use a chlorosilane as the intermediate raw material, is improved in view of the environment, and is satisfactory with respect to the yield of a desired material. The present invention is concerned with a process of producing an alkoxysilane including hydrosilylating (A) an organosilicon compound having at least one hydrogen-silicon bond and at least one alkoxy group and (B) an organic compound having a carbon-carbon unsaturated bond in vapor phase in the presence of a mixture containing a hydrosilylation catalyst and a polyalkylene glycol and supported on a carrier, thereby adding hydrogen and silicon of the compound (A) to the carbon-carbon unsaturated bond in the compound (B).

Abstract: A housing (10) is insert-molded around a core (30) holding terminal fittings (20). The core (30) is provided with a holdable portion (36) at a position exposed to outside through an opening (13) formed in the housing (10) and held in a molding die (50). Thus, the core (30) is prevented from displacements from its a proper position upon being subjected to an injection pressure of a resin. Further, the holdable portion (36) is located in a sealed area of a connector fitting portion (11) defined between the connector fitting portion (11) and a mating female connector (40), the entrance of water through the opening (13) can be prevented.

Abstract: In a process of secondary insert molding, a molten resin is injected into a cavity (236) for secondary molding that is formed by bring a clipping portion (234) of a mold for secondary molding into contact with an outer surface of a primary molding article (216). Projecting areas of ends (214A) of terminals (214) on an outer surface of a resin molding portion (210) are formed of a primary molding resin portion (219). Thus, the cavity (236) for secondary molding and clipping portion (234) are in a position where the ends (214A) of the terminals (214) do not contact the cavity (236) and clipping portion (234).

Abstract: A focusing portion of a mounting process simulation system selects necessary data, and a result table forming portion forms a result table by using the data and stores the table in a result table storing portion. A condition setting portion forms a condition table based on process condition data input from an input device and stores the table in a condition table storing portion. A sample calculating portion calculates calculated result data by using the result table and the condition table. The condition table storing portion lists the calculated result data on the condition table, and outputs the data to the sample calculating portion as the calculated result data in the pre-step.

Abstract: The present invention relates to a novel crystal of a compound of formula (I).

Abstract: A housing (10) is insert-molded around a core (30) holding terminal fittings (20). The core (30) is provided with a holdable portion (36) at a position exposed to outside through an opening (13) formed in the housing (10) and held in a molding die (50). Thus, the core (30) is prevented from displacements from its a proper position upon being subjected to an injection pressure of a resin. Further, the holdable portion (36) is located in a sealed area of a connector fitting portion (11) defined between the connector fitting portion (11) and a mating female connector (40), the entrance of water through the opening (13) can be prevented.

Abstract: A component/board retriever 2 retrieves component/board data from CAD data supplied to a CAD data input unit 1. A circuit board information storage 3 stores various board information and outputs board information based on board design data. A component information storage 4 stores various component information and outputs component information based on component design data. A mount scheme (process) requirement storage 6 stores requirements for mounting processes. A mounting device requirements storage 7 stores requirements for mounting devices. A design analyzer 8 analyzes whether the designed circuit board is achievable or not under requirements supplied by an applied mount requirement input unit 5 and outputs the analysis results through a check result output unit 9 to a designer. Thus, changes in the mounting process requirement and/or the mounting device requirement can be easily reflected on a design check.

Abstract: The invention improves the assembly operation of a lighting fixture. A single electric wire W is distributed between a connector 3 and bulb sockets 1 and 2, and contact welding terminals 11A and 11B attached to the connector 3 and the bulb sockets 1 and 2 make contact. The electric wire W is cut off at specified locations, thereby forming a feeder circuit to bulbs B. Next, a sealing member 22 made from elastomer is moulded so as to cover portions of the electric wire W extending from the connector 3 and the bulb sockets 1 and 2, then the bulb sockets 1 and 2 and the connector 3 are inserted into attachment holes 8 passing through a lighting fixture panel 7.

Abstract: In a process of secondary insert molding, a molten resin is injected into a cavity (236) for secondary molding that is formed by bring a clipping portion (234) of a mold for secondary molding into contact with an outer surface of a primary molding article (216). Projecting areas of ends (214A) of terminals (214) on an outer surface of a resin molding portion (210) are formed of a primary molding resin portion (219). Thus, the cavity (236) for secondary molding and clipping portion (234) are in a position where the ends (214A) of the terminals (214) do not contact the cavity (236) and clipping portion (234).

Abstract: A component/board retriever 2 retrieves component/board data from CAD data supplied to a CAD data input unit 1. A circuit board information storage 3 stores various board information, and outputs board information based on board design data. A component information storage 4 stores various component information, and outputs component information based on component design data. A mount scheme requirement storage 6 stores requirements for mount schemes. A mounting device requirements storage 7 stores requirements for mounting devices. A design analyzer 8 analyzes whether the designed circuit board is achievable or not under requirements supplied by an applied mount requirement input unit 5, and outputs the analysis results through a check result output unit 9 to a designer. Thus, changes in mount scheme requirement and/or mounting device requirement can be easily reflected on design check.

Abstract: The invention improves the assembly operation of a lighting fixture. A single electric wire W is distributed between a connector 3 and bulb sockets 1 and 2, and contact welding terminals 11A and 11B attached to the connector 3 and the bulb sockets 1 and 2 make contact. The electric wire W is cut off at specified locations, thereby forming a feeder circuit to bulbs B. Next, a sealing member 22 made from elastomer is moulded so as to cover portions of the electric wire W extending from the connector 3 and the bulb sockets 1 and 2, then the bulb sockets 1 and 2 and the connector 3 are inserted into attachment holes 8 passing through a lighting fixture panel 7.