Patents by Inventor Masaki Toyoshima

Masaki Toyoshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070257708
    Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
    Type: Application
    Filed: July 16, 2007
    Publication date: November 8, 2007
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
  • Publication number: 20070257376
    Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
    Type: Application
    Filed: July 16, 2007
    Publication date: November 8, 2007
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
  • Publication number: 20070156373
    Abstract: A failure diagnosis apparatus for a refrigerating cycle had a problem that it has a low precision because the fluid is treated, and it is difficult to detect a foretaste of failure, absorb individual differences of real machine in the failure determination, and determine a cause of failure. Also, no cheap and practical diagnosis apparatus and method are provided. A plurality of instrumentation amounts concerning the refrigerant such as the pressure and temperature of the refrigerating cycle apparatus or other instrumentation amounts are detected, the state quantities such as composite variables are acquired by making the arithmetic operation on these instrumentation amounts, and whether the apparatus is normal or abnormal is judged employing the arithmetic operation results.
    Type: Application
    Filed: December 17, 2004
    Publication date: July 5, 2007
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Koji Yamashita, Masaki Toyoshima, Hiroshi Nakata
  • Publication number: 20060055432
    Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
    Type: Application
    Filed: August 31, 2005
    Publication date: March 16, 2006
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
  • Patent number: 5996372
    Abstract: An accumulator is capable of preventing an excessive enlargement of the flow rate of a liquid refrigerant which is discharged from the accumulator, reducing the quantity of refrigerating machine oil which is accumulated in the accumulator, and maintaining a required quantity of refrigerating machine oil in a compressor. Liquid and a gas which circulate in a refrigerating and air-conditioning circuit are introduced into a first space by a suction pipe, and the gas refrigerant is discharged to a refrigerating and air-conditioning circuit through a gas passage pipe, a second space and a discharge pipe 5. A liquid-level maintaining mechanism prevents a rise in the height of the accumulated liquid introduced into the first space. When the height has been made to be not lower than a predetermined height, a gas communication mechanism moves liquid in the first space from the first space to the second space.
    Type: Grant
    Filed: April 28, 1998
    Date of Patent: December 7, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshihide Koda, Masahiro Sugihara, Mihoko Shimoji, Naoki Tanaka, Hitoshi Iijima, Masaki Toyoshima
  • Patent number: 5887444
    Abstract: In an accumulator constituting a refrigerating cycle apparatus, a high liquid-level auxiliary pipe (14a) and a low liquid-level auxiliary pipe (14b), which act as oil recovery pipes, and each of which is provided with a plurality of oil recovery holes (10a), are attached to a discharge pipe (12) in positions so as to be different vertically from each other, so that lubricating oil can be surely recovered through the oil recovery holes.
    Type: Grant
    Filed: July 16, 1997
    Date of Patent: March 30, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masaki Toyoshima, Hitoshi Iijima, Naoki Tanaka, Toshihide Koda, Mihoko Shimoji
  • Patent number: 5799503
    Abstract: In an accumulator, an oil collecting pipe is held in a sealed vessel with the lower end thereof closed, the pipe has a plurality of oil collecting apertures spaced in a vertical direction and a communication port for communicating with a discharge pipe. The communication port is disposed in the vicinity of the lowermost oil collecting aperture or to the downstream side of the aperture. Therefore, excessive liquid refrigerant flow from the accumulator is prevented even if a large amount of the liquid refrigerant resides in the sealed vessel.
    Type: Grant
    Filed: April 1, 1997
    Date of Patent: September 1, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshihide Koda, Mihoko Shimoji, Masahiro Sugihara, Naoki Tanaka, Hitoshi Iijima, Takeshi Izawa, Masaki Toyoshima