Patents by Inventor Masaki Tunekane

Masaki Tunekane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7154926
    Abstract: Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: December 26, 2006
    Assignee: Laserfront Technologies, Inc.
    Inventors: Hikaru Kouta, Hisaya Takahashi, Hideyuki Ono, Yuuzou Ikeda, Masaki Tunekane, Toshinori Ishida, Keiichi Kubota
  • Publication number: 20050069266
    Abstract: Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.
    Type: Application
    Filed: September 17, 2004
    Publication date: March 31, 2005
    Inventors: Hikaru Kouta, Hisaya Takahashi, Hideyuki Ono, Yuuzou Ikeda, Masaki Tunekane, Toshinori Ishida, Keiichi Kubota