Abstract: A method for producing a decomposer of an organic halogenated compound comprises subjecting an iron powder produced beforehand to plastic deformation that gives the iron powder particles a flat shape. Further, an iron powder and a copper salt powder are mechanically mixed in a ball mill to produce a copper salt-containing iron particle powder in which the particles of the two powders are joined. In this case, the method for producing the decomposer of an organic halogenated compound is characterized in that the iron powder is mechanically deformed to give the particles a flat shape.

Abstract: A decomposer of organic halogenated compounds comprises iron powder constituted of flat iron particles of a planar ratio of 2 or greater. Further, a decomposer of organic halogenated compounds comprises a copper salt-containing iron particle powder constituted of copper salt-carrying iron particles having a flat shape with a planar ratio of 2 or greater whose surfaces have adhered thereto copper salt particles that are finer than the iron particles.

Abstract: A method for producing a decomposer of an organic halogenated compound comprises subjecting an iron powder produced beforehand to plastic deformation that gives the iron powder particles a flat shape. Further, an iron powder and a copper salt powder are mechanically mixed in a ball mill to produce a copper salt-containing iron particle powder in which the particles of the two powders are joined. In this case, the method for producing the decomposer of an organic halogenated compound is characterized in that the iron powder is mechanically deformed to give the particles a flat shape.

Abstract: A decomposer of organic halogenated compounds comprises iron powder constituted of flat iron particles of a planar ratio of 2 or greater. Further, a decomposer of organic halogenated compounds comprises a copper salt-containing iron particle powder constituted of copper salt-carrying iron particles having a flat shape with a planar ratio of 2 or greater whose surfaces have adhered thereto copper salt particles that are finer than the iron particles.

Abstract: A surface grinding machine for a sintered rare earth magnetic alloy wafer comprises a pair of disk-shaped grindstones that face each other across a prescribed gap to be rotatable in opposite directions about their center axes. The grinding surfaces of the pair of grindstones and the center axe inclination of one grinding stone are configured to form a planar grinding region A wherein a portion of both of the grinding surfaces of the pair of grindstones lie parallel with a constant intervening gap therebetween. Other portions of the grinding surfaces of the grindstones constitute a wedge-like opening region B that becomes more narrow toward the planar grinding surface A. A feeder to feed the wafers from the wedge-like opening region B toward the planar grinding region A is provided in order to grind both surfaces of the wafers at the planar grinding.

Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

Abstract: A permanent magnet alloy having an improved heat resistance comprising, in terms of % by atom, 0.1 to 15 at. % C, 0.5 to 15 at. % B, provided that C and B in total account for 2 to 30 at. %; 40% or less Co (exclusive), 0.5 to 5 at. % in total of Dy and Tb, 8 to 20 at. % R. where R represents at least one element selected from the group consisting of Nd, Pr, Ce, La, Y, Gd, Ho, Er, and Tm; with the balance being Fe and unavoidable impurities.