Abstract: A method for manufacturing an image display element including: a front panel; a back panel facing the front panel; plural pixels arranged in a matrix between the panels, and to be selected to be in a display or non-display state; and plural electrodes for controlling the pixels, the panels being bonded with the pixels and the electrodes interposed therebetween, and the electrodes being connected to a driving control circuit via metal wires, includes a first step of performing dicing from the back side of the opposing surface from the front panel, and forming a groove part such that electrode terminals connected to the electrodes are exposed between adjacent plural pixel lines, with the back panel bonded thereto, and a second step of forming the metal wires so as to be connected to the electrode terminals exposed at the groove part.

Abstract: An image display element includes: a front panel; a back panel opposite thereto; a plurality of pixels arranged between both the panels; and plural electrodes for controlling the pixels. The panels are bonded with the pixels and the electrodes interposed therebetween, and the electrodes are connected to a driving circuit via metal film wires. The back panel is divided so as to expose electrode terminals, and a groove part V-shaped in cross section is formed at the divided portion. The metal film wires are formed on the top surface of the back panel, and the electrode terminals and the metal film wires are connected by a conductive paste coated along the tilt surfaces forming the groove part. Partitions are disposed between the adjacent electrode terminals at the bottom of the groove part.

Abstract: Provided are a liquid-crystal compound and a liquid-crystal composition containing the compound, of which the advantages are that they show nematic hybrid orientation on a rubbed TAC substrate, they are polymerizable in open air and they readily give a polymer having a high degree of polymerization even when exposed to a relatively small total quantity of light. The films formed by photopolymerizing them keep nematic hybrid orientation. The compound is represented by formula (1): wherein R1 is a hydrogen or an alkyl; R2 is a hydrogen, —OCF3, etc.; A1 is a 1,4-phenylene, etc.; A2 and A3 are independently a 1,4-cyclohexylene, a 1,4-phenylene, etc.; X1 is a single bond, —O—, etc.; X2 and X3 are independently a single bond, —COO—, —C?C—, —CONH—, etc.; m is an integer of from 0 to 20; and n is 1 or 0.

Abstract: A polymerizable liquid crystal composition containing compounds represented by the formula (1-1) and the formula (1-2), compounds represented by the formula (2-1) and the formula (2-2), and a compound represented by the formula (3-1): the polymerizable liquid crystal composition having homogeneous, homeotropic, or hybrid alignment, which can be coated on a support substrate, for example, of a transparent plastic film such as a triacetyl cellulose film or cycloolefin polymer film, or glass, and is aligned on a substrate as a polymer film while maintaining the alignment.

Abstract: A polymerizable liquid crystal composition containing compounds represented by the formula (1-1) and the formula (1-2), compounds represented by the formula (2-1) and the formula (2-2), and a compound represented by the formula (3-1): the polymerizable liquid crystal composition having homogeneous, homeotropic, or hybrid alignment, which can be coated on a support substrate, for example, of a transparent plastic film such as a triacetyl cellulose film or cycloolefin polymer film, or glass, and is aligned on a substrate as a polymer film while maintaining the alignment.

Abstract: An organic EL panel has a support substrate on which an organic EL device layer is formed. The support substrate is adhered to a sealing substrate via an adhesive to define a sealed space for encapsulating the organic EL device between both the substrates. The sealing substrate is made of a transparent material. On the inner surface of the sealing substrate, a color filter layer is formed. This structure allows light emitted from the organic EL device to transmit through the sealing substrate after having passed through the color filter layer. A transparent moisture capturing film is formed on the inner surface of the sealing substrate to cover the color filter layer, thereby filling the sealed space with transparent moisture capturing film. Thereby, the organic EL panel is provided, which makes it possible to obtain a sufficient moisture capturing effect in the sealed space.

Abstract: The present invention provides metallocene compounds which exhibit high polymerization activity for production of highly stereoregular polymers, as well as a production process for olefin polymers which employs olefin polymerization catalysts containing the compounds, and olefin polymers obtained by the production process.

Abstract: Provided are a liquid-crystal compound and a liquid-crystal composition containing the compound, of which the advantages are that they show nematic hybrid orientation on a rubbed TAC substrate, they are polymerizable in open air and they readily give a polymer having a high degree of polymerization even when exposed to a relatively small total quantity of light. The films formed by photopolymerizing them keep nematic hybrid orientation. The compound is represented by formula (1): wherein R1 is a hydrogen or an alkyl; R2 is a hydrogen, —OCF3, etc.; A1 is a 1,4-phenylene, etc.; A2 and A3 are independently a 1,4-cyclohexylene, a 1,4-phenylene, etc.; X1 is a single bond, —O—, etc.; X2 and X3 are independently a single bond, —COO—, —C?C—, —CONH—, etc.; m is an integer of from 0 to 20; and n is 1 or 0.

Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 ?m.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate 12 directly to the ceramic substrate 10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.

Abstract: After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch undesired portions of the copper plates 14 to form a metal circuit portion. While the resists 16 are maintained, undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed (or undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists 16 are peeled off, and an Ni—P electroless plating 18 is carried out.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.

Abstract: The present invention provides a metallocene compound which produces an olefin polymer having a high molecular weight with a high stereoregularity.

Abstract: An organic EL panel has a support substrate on which an organic EL device layer is formed. The support substrate is adhered to a sealing substrate via an adhesive to define a sealed space for encapsulating the organic EL device between both the substrates. The sealing substrate is made of a transparent material. On the inner surface of the sealing substrate, a color filter layer is formed. This structure allows light emitted from the organic EL device to transmit through the sealing substrate after having passed through the color filter layer. A transparent moisture capturing film is formed on the inner surface of the sealing substrate to cover the color filter layer, thereby filling the sealed space with transparent moisture capturing film. Thereby, the organic EL panel is provided, which makes it possible to obtain a sufficient moisture capturing effect in the sealed space.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.

Abstract: There is provided a method for producing a metal/ceramic bonding substrate, the method being capable of improving the linearity of a pattern and preventing the occurrence of defective plating to improve the visual failure of plating and ensure the adhesion of plating.

Abstract: In an organic EL device having a lower electrode, an upper electrode, and an organic light-emitting functional layer provided between the lower and upper electrodes and containing at least a light-emitting layer, the organic EL device formed on a substrate is sealed with a transparent passivation film and a color filter is provided on the passivation film. The organic EL device can be formed thinly. In an active drive type organic EL device having a TFT provided between the substrate and the organic light-emitting functional layer, the color filter can be set after the organic EL device is sealed with the passivation film. In addition to improvement in numerical aperture and contrast, deterioration of the color filter caused by a high-temperature process for production of the TFT can be avoided.

Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 &mgr;m.

Abstract: A paste of brazing material of Ag—Cu—Ti—TiO2 system is printed to both sides of an AlN substrate; a copper sheet is then placed on both sides and heated in vacuum to be joined to the substrate. A resist having a desired-circuit pattern is coated on the surface of each copper sheet and etching is performed. A solution containing a mixture of EDTA, ammonia and aqueous hydrogen peroxide is then applied to dissolve away the unwanted brazing material and the like from between the circuit patterns without corroding the ceramic substrate and the metal sheet.

Abstract: A method for forming a protection film capable of effectively sealing an organic EL device mounted on a surface of a substrate is provided, for example.