Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C.

Abstract: An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.

Abstract: The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C.

Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Abstract: The improved filler metal for use in the welding of Ni—Cr—W alloys that are excellent in high-temperature strength and corrosion resistance and which are used in the hot-zone structures of high-temperature gas-cooled reactors, gas turbines, etc comprises on a mass basis C≦0.05%, Mn≦0.1%, Si≦0.1% (Mn+Si≦0.1%), Cr=17-20%, W=20-23% (Cr+W=39-43%), Ti=0.02-0.1%, Zr≦0.03%, Y≦0.015%, B=0.0003-0.01%, Al≦0.1%, Mg≦0.05%, Nb≦0.06% (10Zr+10B+5Nb+2Y≦0.3%), the balance being Ni and incidental impurities.

Abstract: The improved superalloy that possesses all the characteristics required of the high-temperature structural material of high-temperature gas-cooled reactors (i.e., high-temperature strength, corrosion resistance, good producibility, good hot workability and resistance to embrittlement due to thermal aging) consists essentially of 16-28% Cr, 15-24% W (provided that Cr+W=39-44%), 0.01-0.1% Zr, 0.001-0.015% Y, 0.0005-0.01% B, up to 0.05% C, up to 0.1% Si, up to 0.1% Mn (provided that Si+Mn.ltoreq.0.1%), up to 0.1% Ti, up to 0.1% Al and up to 0.1% Nb (provided that Ti+Al.ltoreq.0.1% and Ti+Al+Nb.ltoreq.0.15%), with the balance being Ni and inevitable impurities and all percentages being on a weight basis.

Abstract: The improved superalloy that possesses all the characteristics required of the high-temperature structural material of high-temperature gas-cooled reactors (i.e., high-temperature strength, corrosion resistance, good productibility, good hot workability and resistance to embrittlement due to thermal aging) consists essentially of 16-28% Cr. 15-24% W (provided that Cr+W=39-44%), 0.01-0.1% Zr, 0.001-0.015% Y, 0.0005-0.01% B, up to 0.05% C, up to 0.1% Si, up to 0.1% Mn (provided that Si+Mn.gtoreq.0.1%), up to 0.1% Ti, up to 0.1% Al and up to 0.1% Nb (provided that Ti+Al.gtoreq.0.1% and Ti+Al+Nb.gtoreq.0.15%), with the balance being Ni and inevitable impurities and all percentages being on a weight basis.

Abstract: This invention is constructed such that a toilet bowl and a shower are spaced apart and installed in a unit room, a flashing water unit provided with a counter having an apron is attached to the wall surface of the unit room for the shower space through hinges in such a way as it may be rotated across the shower space and the toilet bowl installing space, said counter having apron is provided with a storing part for storing the toilet bowl and covering it at the moving position toward the toilet bowl installing space and being closed in opposition to the wall surface of the unit room, thereby in case of using of the shower, the flashing water unit is positioned at the shower space and the shower space can be utilized as the flashing water application space and a toilet bowl application space is also kept, and in turn in case of non-use of the shower, the flashing water unit is rotated toward the toilet bowl installing space and a shower space is also kept and at the same time the toilet bowl installing space

Abstract: A nickel-base alloy excellent in corrosion resistance at high temperatures, which consists essentially of, in weight percentage:Carbon -- 0.04 to 0.25%,Chromium -- 10.0 to 25.0%,At least one element selected from the group consisting of 0.1 to 30.0% iron, 0.1 to 25.0% tungsten, 0.1 to 10.0% molybdenum and 0.05 to 30.0% cobalt -- 50.0% at the maximum,Manganese -- 0.4 to 1.5%,Silicon -- 0.05 to 0.5%, preferably 0.05 to 0.2%, andNickel and inevitable impurities -- balance;Said alloy having excellent corrosion resistance at high temperatures in an atmosphere of a low oxidizing potential.Said alloy contains, as required, the following additional elements:Boron -- 0.001 to 0.05%,Zirconium -- 0.1 to 0.1%, andAt least one element selected from the group consisting of 0.001 to 0.02% magnesium, 0.001 to 0.05% calcium and 0.001 to 0.02% rare earth elements.