Abstract: Provided is a battery wiring module that can reduce damage of electric wires. The battery wiring module has: a module-side terminal electrically connected to a bus bar connecting battery terminals of a plurality of battery cells; an electric wire with one end side to which the module-side terminal is connected; and a housing for accommodating the electric wire and the module-side terminal. The housing has a terminal accommodating portion for accommodating the module-side terminal. The battery wiring module includes a partition wall portion that is provided such that the module-side terminal disposed on the bottom portion of the terminal accommodating portion is located between the partition wall portion and the bottom portion, and separates the module-side terminal and the electric wire.

Abstract: A housing is provided with a terminal accommodation portion accommodating a module-side terminal and having an opening through which the module-side terminal is introduced. The terminal accommodation portion includes a bottom portion and a third wall portion serving as an accommodation-side regulating portion that regulates displacement of the module-side terminal. A cover that seals the opening of the terminal accommodation portion includes first and second regulating wall portions serving as a cover-side regulating portion that regulates displacement of the module-side terminal at a different position from that of the bottom portion and the third wall portion.

Abstract: A battery wiring module that can keep an electrical wire from getting caught up when a cover portion is rotated and closed. In order to keep an electrical wire from sticking out from an electrical wire housing portion, a cover portion that partially covers an upper opening of the electrical wire housing portion is provided to a first side wall portion of an electrical wire housing portion with a hinge portion. The upper end of the first side wall portion is provided with a cover facing surface that faces the cover portion in a covering position in the vertical direction (a height direction Z), and a protruding portion that is adjacent to the cover facing surface and that protrudes higher than the cover facing surface.

Abstract: A battery wiring module that can ensure an insulation distance between an electrode of a secondary battery and a conductive part arranged above the cover portion. A housing includes first and second divided housings that respectively include a bus bar housing portion that houses a bus bar, a first cover portion that is provided in one piece with the first divided housing and covers an opening of the bus bar housing portion of the first divided housing, and a second cover portion that is provided in one piece with the second divided housing and covers an opening of the bus bar housing portion of the second divided housing, the first and second cover portions being adjacent to each other. The first cover portion is provided with a tongue piece that extends from the first cover portion toward the second cover portion and overlaps the second cover portion in the opening direction of the bus bar housing portion.

Abstract: To provide a film excellent in breakage resistance and uniform stretchability, and a method for its production. The film is a single-layer film characterized in that it is made of a blend resin of two kinds of resins both belonging to any one of ETFE, PFA, FEP, ECTFE and PMP, wherein the melt flow rate of the film is at least 6 g/10 min. and less than 20 g/10 min., and ? of the film as measured by a prescribed measurement method is at least 0.99.

Abstract: In order to cut a plurality of clumps having an approximately uniform shapes and approximately uniform dimensions out of a cell aggregate which has proliferated and appropriately eliminate contamination with fragments of different shapes or dimensions, when cutting the clumps of approximately uniform shape out of the cell aggregate which has proliferated, cutting lines along which the clumps of a specific shape are cut out are set such that the area of a peripheral part of the cell aggregate which is not cut by the cutting line exceeds the surface area of one of the clumps, and the cell aggregate is cut by irradiating with laser light in such a way as to trace the cutting lines.

Abstract: To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C.

Abstract: A battery wiring module that can keep an electrical wire from getting caught up when a cover portion is rotated and closed. In order to keep an electrical wire from sticking out from an electrical wire housing portion, a cover portion that partially covers an upper opening of the electrical wire housing portion is provided to a first side wall portion of an electrical wire housing portion with a hinge portion. The upper end of the first side wall portion is provided with a cover facing surface that faces the cover portion in a covering position in the vertical direction (a height direction Z), and a protruding portion that is adjacent to the cover facing surface and that protrudes higher than the cover facing surface.

Abstract: A battery wiring module that can ensure an insulation distance between an electrode of a secondary battery and a conductive part arranged above the cover portion. A housing includes first and second divided housings that respectively include a bus bar housing portion that houses a bus bar, a first cover portion that is provided in one piece with the first divided housing and covers an opening of the bus bar housing portion of the first divided housing, and a second cover portion that is provided in one piece with the second divided housing and covers an opening of the bus bar housing portion of the second divided housing, the first and second cover portions being adjacent to each other. The first cover portion is provided with a tongue piece that extends from the first cover portion toward the second cover portion and overlaps the second cover portion in the opening direction of the bus bar housing portion.

Abstract: Provided is an estimation device capable of estimating a current position with a high degree of accuracy. A driving support system includes: a vehicle mounted device 1 that is mounted on a vehicle and performs a control concerning vehicle driving support; a LIDAR 2; a gyroscope sensor 3; and a vehicle speed sensor 4. The vehicle mounted device 1 acquires, from the LIDAR 2, a measurement value ztk indicating a positional relationship between a reference landmark Lk of an index k and the own vehicle. The vehicle mounted device 1 calculates a post estimated value x?t by correcting a prior estimated value x t estimated, on the basis of the measurement value ztk and a position vector mk of the reference landmark Lk included in a map DB 10, from a moving speed measured by the vehicle speed sensor 4 and an angular rate measured by the gyroscope sensor 3.

Abstract: An objective of the present invention is to provide: a cancer stem cell isolated using a cell marker; a substantively homogeneous cancer stem cell population including said cancer stem cell; and a method of preparing said cancer stem cell population. Another objective of the present invention is to provide: a method for separating cancer stem cells with a high proliferative potential and those with a low proliferative potential; a method for inducing cancer stem cells to have a different proliferative potential; and cancer stem cells separated or induced by these separation or induction methods. A further objective of the present invention is to provide: a method of screening for pharmaceuticals using said cancer stem cell or cancer stem cell population; a method for detecting the presence of said cancer stem cell or cancer stem cell population and for identifying or quantifying the same.

Abstract: A method of killing specific cells from among a group of cells cultured in a culture vessel by quick and brief laser treatment, the cell culture vessel comprising a main body and a to-be-irradiated layer attached to the main body, the to-be-irradiated layer containing an ingredient capable of absorbing laser light upon laser irradiation, the group of cells being cultured on the surface of the to-be-irradiated layer, the method comprising: applying laser light to a partial area of the to-be-irradiated layer directly below the specific cells.

Abstract: A mold release film, which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and forming a resin-encapsulation portion excellent in adhesion to an ink layer, is provided. The mold release film is disposed on a cavity surface of a mold, in which a semiconductor element is disposed and encapsulated with a curable resin to form a resin-encapsulation portion. The mold release film has a first surface in contact with the curable resin when the resin-encapsulation portion is formed, and a second surface in contact with the cavity surface. At least the first surface is made of a fluororesin. The mold release film has an F/Al ratio of from 0.2 to 4, or an F/(C+F+O) ratio of from 0.1 to 0.3. A process for producing a semiconductor package using the mold release film is also provided.

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C.

Abstract: An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

Abstract: To provide a mold release film which has excellent mold releasing property and is capable of reducing contamination of a mold in a sealing step; a process for producing the mold release film; and a process for producing a semiconductor package by using the mold release film. The mold release film 1 is a mold release film to be disposed on a surface of a mold which is to be in contact with a curable resin, in the production of a semiconductor package by disposing a semiconductor element in the mold, and sealing it with the curable resin to form a resin sealed portion. This mold release film 1 comprises a resin-side mold release layer 2 to be in contact with the curable resin at the time of forming the resin sealed portion, and a gas barrier layer 3. The gas barrier layer 3 contains at least one polymer (I) selected from the group consisting of a polymer having vinyl alcohol units and a polymer having vinylidene chloride units, and the thickness of the gas barrier layer 3 is from 0.1 to 5 ?m.

Abstract: The inventors successfully produced anti-Epiregulin antibodies showing cross-species reactivity between cynomolgus monkey (non-human animals) and human, anti-Epiregulin antibodies with suppressed chemical degradation, anti-Epiregulin antibodies with lowered isoelectric point, anti-Epiregulin antibodies with increased thermal denaturation midpoint temperature, and anti-Epiregulin antibodies with reduced amount of aggregate by performing appropriate amino acid residue substitutions in the variable-region sequences of the humanized EP27 antibody which inhibits growth of cancer cells by exhibiting cytotoxic activity and neutralizing activity against human Epiregulin-expressing cells.

Abstract: A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least one of the first surface and the second surface has irregularities formed thereon, and the surface having irregularities formed thereon, has an arithmetic mean roughness (Ra) of from 1.3 to 2.5 ?m and a peak count (RPc) of from 80 to 200; and a process for producing a semiconductor package by using the mold release film.

Abstract: The inventors successfully produced anti-Epiregulin antibodies showing cross-species reactivity between cynomolgus monkey (non-human animals) and human, anti-Epiregulin antibodies with suppressed chemical degradation, anti-Epiregulin antibodies with lowered isoelectric point, anti-Epiregulin antibodies with increased thermal denaturation midpoint temperature, and anti-Epiregulin antibodies with reduced amount of aggregate by performing appropriate amino acid residue substitutions in the variable-region sequences of the humanized EP27 antibody which inhibits growth of cancer cells by exhibiting cytotoxic activity and neutralizing activity against human Epiregulin-expressing cancer cells.