Abstract: An object of the present invention is to provide a pressure-sensitive adhesive sheet enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer containing an acrylic polymer (A) and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive layer has a dielectric constant at a frequency of 1 MHz of from 2.3 to 3.5. The pressure-sensitive adhesive sheet has a 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. of 6 N/20 mm or more.

Abstract: An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability and transparency while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A), a mixture of monomer components constituting the acrylic polymer (A) or a partially polymerized product of a mixture of monomer components constituting the acrylic polymer (A), and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive composition comprises a branched-chain alkyl group having 10 to 24 carbon atoms as a monomer component.

Abstract: An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions, a pressure-sensitive adhesive layer, a pressure-sensitive adhesive sheet, an optical member, and a touch panel. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A) and a hydrogenated polyolefinic resin (B). The acrylic polymer (A) contains a (meth)acrylic alkyl ester having an alkyl group having 8 or more carbon atoms as a constituent monomer component. The hydrogenated polyolefinic resin (B) contains a hydrogenated polyolefin.

Abstract: An object of the present invention is to provide a pressure-sensitive adhesive sheet, an optical member, and a touch panel that enable a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer, and the number of the voids having a diameter of 300 ?M or more in the following low pressure test is less than 10, and the number of the voids having a diameter of not less than 50 less than 300 ?M in the following low pressure test is less than 20.

Abstract: A laminate, comprising: a carrier film for a transparent conductive film comprising a support and a pressure-sensitive adhesive layer provided on at least one side of the support; and a transparent conductive film comprising a transparent conductive layer and a transparent substrate, wherein the support has an in-plane thermal shrinkage S1 of 0.3 to 0.9% when heated at 140° C. for 90 minutes, and the transparent conductive film has an in-plane thermal shrinkage S2 of 0.3 to 0.6% when heated at 140° C. for 90 minutes.

Abstract: A carrier film for transparent conductive films, including: a support; and a pressure-sensitive adhesive layer provided on at least one side of the support, wherein the pressure-sensitive adhesive layer has an adhesive surface with an arithmetic mean surface waviness Wa of 70 nm or less opposite to an adhesive surface in contact with the support.

Abstract: A carrier film for transparent conductive films of the invention includes a support and a pressure-sensitive adhesive layer provided on at least one side of the support, wherein the pressure-sensitive adhesive layer is made from a pressure-sensitive adhesive composition including: a (meth)acryl-based polymer (A) having a glass transition temperature of ?50° C. or lower and obtained by polymerization of a monomer component containing an alkyl(meth)acrylate and a hydroxyl group-containing monomer; an isocyanate crosslinking agent (B); and a catalyst (C) having an iron active center. The carrier film for transparent conductive films, with which the formation of irregularities on an adherend surface and zipping can be prevented.

Abstract: The present invention provides a methylenebis(fatty acid amide) composition containing as a main component a methylenebis(fatty acid amide) obtained by reacting a fatty acid monoamide with formaldehyde, a content of impurities which consist of the fatty acid monoamide and a fatty acid from which the fatty acid monoamide is constituted is 0 to less than 2 wt %, and a adhesive sheet containing the methylenebis(fatty acid amide) composition.

Abstract: An adhesive tape or sheet with a release liner has; a thermoplastic resin film, a pressure sensitive adhesive layer formed on one side of the thermoplastic resin film, and a release liner positioned on one side of the pressure sensitive adhesive layer, a fatty acid bisamide as well as a fatty acid monoamide and/or fatty acid are contained at least one of the thermoplastic resin film and the pressure sensitive adhesive layer.

Abstract: A rolled adhesive tape or sheet which is wound in a rolled configuration having; a thermoplastic resin film, and a pressure sensitive adhesive layer formed on one side of the thermoplastic resin film, a fatty acid bisamide as well as a fatty acid monoamide and/or fatty acid are contained at least one of the thermoplastic resin film and the pressure sensitive adhesive layer.

Abstract: The invention provides true La(OiPr)3 preferable as a starting material for an asymmetric synthesis catalyst and a process for producing the same. In this process, anhydrous lanthanum chloride LaCl3 is reacted with potassium isopropoxide K(OiPr) in a mixed solvent of isopropanol and toluene, then the isopropanol is distilled away to replace all the solvent by toluene, then the reaction solution is left, decanted and filtered to give a transparent filtrate, and the solvent is distilled away from the filtrate which is then vacuum-dried under heating, whereby high-purity La(OiPr)3 is obtained in 77% yield. In this high-purity La(OiPr)3, the La content is 97 to 103% of the theoretical content, impurity K is 0.3% or less, (Li+Na) is 0.01% or less, Cl is 0.2% or less, and the degree of association thereof is 5.5 to 6.5.

Abstract: The invention provides true La(OiPr)3 preferable as a starting material for an asymmetric synthesis catalyst and a process for producing the same. In this process, anhydrous lanthanum chloride LaCl3 is reacted with potassium isopropoxide K(OiPr) in a mixed solvent of isopropanol and toluene, then the isopropanol is distilled away to replace all the solvent by toluene, then the reaction solution is left, decanted and filtered to give a transparent filtrate, and the solvent is distilled away from the filtrate which is then vacuum-dried under heating, whereby high-purity La(OiPr)3 is obtained in 77% yield. In this high-purity La(OiPr)3, the La content is 97 to 103% of the theoretical content, impurity K is 0.3% or less, (Li+Na) is 0.01% or less, Cl is 0.2% or less, and the degree of association thereof is 5.5 to 6.5.

Abstract: This invention provides a process for producing bismuth tertiary amyloxide which is a starting material for forming a ferroelectric film such as SrBi2Ta2O9 containing bismuth oxide, or an oxide superconductive film such as Bi2Sr2CaCu2O8, by the CVD method or sol-gel method. This process comprises reacting bismuth bromide with sodium tertiary amyloxide or potassium tertiary amyloxide in a toluene solvent containing 5 to 30 weight % tetrahydrofuran, then separating a byproduct sodium bromide or potassiumbromide by filtration and recovering bismuth tertiary amyloxide by distillation under reduced pressure.

Abstract: This invention provides a process for producing bismuth tertiary amyloxide which is a starting material for forming a ferroelectric film such as SrBi2Ta2O9 containing bismuth oxide, or an oxide superconductive film such as Bi2Sr2CaCu2O8, by the CVD method or sol-gel method. This process comprises reacting bismuth bromide with sodium tertiary amyloxide or potassium tertiaryamyloxide in a toluene solvent containing 5 to 30 weight % tetrahydrofuran, then separating a byproduct sodium bromide or potassium bromide by filtration and recovering bismuth tertiary amyloxide by distillation under reduced pressure.

Abstract: A method of forming a Bi-layered ferroelectric thin film on a substrate with good reproducibility, using a mixed composition of a Bi-containing organic compound and a metal polyalkoxide compound by at least one technique selected from the group consisting of molecular deposition such as CVD, and spincoat-sintering.