Abstract: An electronic apparatus includes a rectangular or substantially rectangular plate-shaped housing including a first side and a second side which are long sides and a third side and a fourth side which are short sides, and an antenna device. The antenna device includes a first coil including a first coil conductor and a second coil including a second coil conductor. A portion of the first coil overlaps with the second coil opening, a portion of the second coil overlaps with the first coil opening, a straight line connecting a center of gravity of the first coil opening and a center of gravity of the second coil opening intersects with the third side and the fourth side, and the center of gravity of the second coil opening is closer to the third side than the center of gravity of the first coil opening.

Abstract: An electronic apparatus includes a rectangular or substantially rectangular plate-shaped housing including a first side and a second side which are long sides and a third side and a fourth side which are short sides, and an antenna device. The antenna device includes a first coil including a first coil conductor and a second coil including a second coil conductor. A portion of the first coil overlaps with the second coil opening, a portion of the second coil overlaps with the first coil opening, a straight line connecting a center of gravity of the first coil opening and a center of gravity of the second coil opening intersects with the third side and the fourth side, and the center of gravity of the second coil opening is closer to the third side than the center of gravity of the first coil opening.

Abstract: An antenna element includes a multilayer body and a coil conductor. The multilayer body includes a first non-magnetic portion and a first magnetic portion laminated together. The first magnetic portion is closer to a first principal surface than is the first non-magnetic portion. The coil conductor includes a first conductor pattern portion and a first insulating pattern portion. The first conductor pattern portion is disposed between the first non-magnetic portion and the first magnetic portion. The first insulating pattern portion is provided on the first conductor pattern portion at a side facing the second principal surface, and has a line width less than a line width of the first conductor pattern portion. The first insulating pattern portion overlaps the first conductor pattern portion in plan view as viewed in a lamination direction of the multilayer body.

Abstract: An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath.

Abstract: An Sn alloy plating apparatus is disclosed which can relatively easily perform control of an Sn alloy plating solution, including control of the Sn ion concentration and the acid concentration of the plating solution.

Abstract: An Sn alloy plating apparatus is disclosed which can relatively easily perform control of an Sn alloy plating solution, including control of the Sn ion concentration and the acid concentration of the plating solution.

Abstract: An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath.

Abstract: An Sn alloy plating apparatus includes: a plating bath having a cathode chamber for holding therein an Sn alloy plating solution in which the substrate is to be immersed and an anode chamber for holding therein an anolyte containing Sn ions and an acid; an Sn anode located in the anode chamber; and an electrolytic solution supply line configured to supply an electrolytic solution containing the acid into the anode chamber such that a Sn ion concentration of the anolyte in the anode chamber is kept not less than a predetermined value and a concentration of the acid in the anolyte is kept not less than a predetermined acceptable value. The electrolytic solution supply line supplies the electrolytic solution into the anode chamber to increase an amount of the anolyte in the anode chamber and supply the anolyte into the Sn alloy plating solution by the increased amount.

Abstract: A dielectric substrate having a radiation electrode 3 and a feed electrode 4 formed thereon is formed such that a plurality of insulator layers 7a to 7e are stacked and combined. An open end 3K of the radiation electrode 3 and a capacitive coupling end 4Y of the feed electrode 4 are formed on a surface of the same insulator layer of the dielectric substrate 2. A floating electrode 5 is formed on a surface of an insulator layer on which the open end 3K of the radiation electrode 3 and the capacitive coupling end 4Y of the feed electrode 4 are not formed. The floating electrode 5 is arranged to commonly face both the open end 3K of the radiation electrode 3 and the capacitive coupling end 4Y of the feed electrode 4 in the stacking direction of the insulator layers 7a to 7e.

Abstract: A high-frequency superposing module for driving a laser diode includes an oscillating circuit and an impedance matching circuit. The impedance matching circuit includes a capacitor connected in series between the emitter of a transistor and the terminal through which a laser-diode drive signal is output; and a capacitor connected in parallel between the drive-signal output terminal and the ground. The oscillating circuit includes an inductor serving as a choke coil connected between the drive-signal output terminal and the collector of the transistor, thus allowing the drive-signal output terminal to serve as a power input terminal for the oscillating circuit.

Abstract: An oscillator includes a transistor, a first bias resistor connected between the base of the transistor and a power input terminal, and a second bias resistor connected between the base of the transistor and a control-voltage input terminal. When the control-voltage input terminal is grounded, the bias voltage at the base of the transistor is below a predetermined threshold, thus causing the oscillator to stop oscillation. When the control-voltage input terminal is open, the bias voltage at the base of the transistor is above the threshold, thus causing the oscillator to start oscillation.

Abstract: A high-frequency superposing module for driving a laser diode includes an oscillating circuit and an impedance matching circuit. The impedance matching circuit includes a capacitor connected in series between the emitter of a transistor and the terminal through which a laser-diode drive signal is output; and a capacitor connected in parallel between the drive-signal output terminal and the ground. The oscillating circuit includes an inductor serving as a choke coil connected between the drive-signal output terminal and the collector of the transistor, thus allowing the drive-signal output terminal to serve as a power input terminal for the oscillating circuit.

Abstract: An oscillator includes a transistor, a first bias resistor connected between the base of the transistor and a power input terminal, and a second bias resistor connected between the base of the transistor and a control-voltage input terminal. When the control-voltage input terminal is grounded, the bias voltage at the base of the transistor is below a predetermined threshold, thus causing the oscillator to stop oscillation. When the control-voltage input terminal is open, the bias voltage at the base of the transistor is above the threshold, thus causing the oscillator to start oscillation.