Patents by Inventor Masanobu Takahashi
Masanobu Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220270678Abstract: According to one embodiment, a semiconductor memory device includes: a memory cell configured to hold 5-bit data; a word line coupled to the memory cell; and a row decoder configured to apply first to 31st voltages to the word line. A first bit of the 5-bit data is established by reading operations using first to sixth voltages. A second bit of the 5-bit data is established by reading operations using seventh to twelfth voltages. A third bit of the 5-bit data is established by reading operations using thirteenth to eighteenth voltages. A fourth bit of the 5-bit data is established by reading operations using nineteenth to 25th voltages. A fifth bit of the 5-bit data is established by reading operations using 26th to 31st voltages.Type: ApplicationFiled: May 6, 2022Publication date: August 25, 2022Applicant: KIOXIA CORPORATIONInventors: Tomonori TAKAHASHI, Masanobu SHIRAKAWA, Osamu TORII, Marie TAKADA
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Publication number: 20200270518Abstract: A semiconductor phosphor configured to exhibit photoluminescence upon irradiation with excitation light, including: at least one active layer made of a compound semiconductor and containing an n-type or p-type dopant; and at least two barrier layers made of a compound semiconductor and having a larger band gap than the active layer. The active layer and the barrier layers are alternately stacked. This provides a semiconductor phosphor which allows easy wavelength adjustment, high efficiency and stability.Type: ApplicationFiled: October 11, 2018Publication date: August 27, 2020Applicant: SHIN-ETSU HANDOTAI CO., LTD.Inventors: Susumu HIGUCHI, Kenji SAKAI, Masato YAMADA, Masanobu TAKAHASHI, Junya ISHIZAKI
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Publication number: 20130045653Abstract: A heat-resistant flame-retardant protective suit fabric of the present invention is formed of a uniform blended spun yarn including 25 to 75 mass % of polyetherimide fiber, 20 to 50 mass % of at least one fiber selected from wool and flame-retardant rayon, and 5 to 25 mass % of para-aramid fiber when the spun yarn is 100 mass %. The fabric experiences no heat shrinkage when exposed to a heat flux at 80 kW/m2 ±5% for 3 seconds in accordance with ISO 9151 Determination of Heat Transmission on Exposure to Flame. And the char length is not more than 10 cm in the longitudinal and horizontal directions in the flammability test specified in JIS L 1091A-4. Thereby, the present invention provides a protective suit fabric that provides comfort in wearing even if the suit is worn in the hot seasons or even if the wearer perspires during exertion. The fabric has high heat resistance and high flame retardance, favorable dye affinity, and the fabric can be produced at a low cost.Type: ApplicationFiled: January 12, 2012Publication date: February 21, 2013Applicants: SABIC INNOVATIVE PLASTICS IP B.V., THE JAPAN WOOL TEXTILE CO., LTD.Inventors: Masanobu Takahashi, Hideki Omori
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Publication number: 20130040523Abstract: A protective suit fabric of the present invention is a heat-resistant flame-retardant protective suit fabric, which is formed of a spun yarn. The fiber blend rate is: 25-75 mass % of polyetherimide fiber (A); 20-50 mass % of at least one fiber (B) selected from wool and flame-retardant rayon; and 5 to 25 mass % of para-aramid fiber (C). The spun yarn for forming the fabric is a two-fold yarn (20) prepared by twisting: 1) a single yarn (24) of a uniform blended spun yarn including the fiber components (A) and (B); and 2) a single yarn (23) of a sheath-core spun yarn including a core (21) of stretch-broken spun yarn of the para-aramid fiber (C) and a sheath (22) formed by blend-spinning the polyetherimide fiber (A) and the at least one fiber (B) selected from wool and flame-retardant rayon. The protective suit fabric has high washing resistance. The protective suit fabric provides favorable comfort in wearing even if the suit is worn in the hot seasons or even if the wearer perspires during exertion.Type: ApplicationFiled: February 27, 2012Publication date: February 14, 2013Applicants: SABIC INNOVATIVE PLASTICS IP B.V., THE JAPAN WOOL TEXTILE CO., LTD.Inventors: Masanobu Takahashi, Hideki Omori
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Patent number: 8267356Abstract: A tension balancer which includes an axis body including a latch part, a column shaped main body including a bottom part which has at least two first through holes arranged at equal intervals in a concentric circle from the center, and an open upper part, a spring base housed within the main body and having an aperture for joining an end of the axis body to the center, and at least two second holes arranged at equal intervals in a concentric circle from the center, an upper lid having an aperture for pushing through the main body of the axis body to the center, and at last two second through holes arranged at equal intervals in a concentric circle from the center, the upper lid being screwed to the main body by a bold and nut which passes through the first, second and third through holes, and at least two or more spring unit groups sandwiched between the spring base which is housed within the main body and the upper lid.Type: GrantFiled: December 5, 2008Date of Patent: September 18, 2012Assignee: NHK Spring Co., LtdInventors: Atsushi Ohta, Masanobu Takahashi, Shinichi Kobayashi, Mikio Ito, Mitsuru Murakami, Yutaro Ohtomo, Keitaro Kawamura, Masahashi Nakagome
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Publication number: 20120207856Abstract: Methods for treating a patient at risk for or diagnosed with colorectal cancer are disclosed herein. The method of the present invention determines the overall expression of MSH3 in cells suspected of being colorectal cancer cells from the patient and predicting the efficacy of therapy with a genotoxic anti-neoplastic agent for treating the patient, wherein a decrease in the overall expression of MSH3 in the patient cells when compared to the expression of MSH3 in normal colorectal cells indicates a predisposition to responsiveness to genotoxic anti-neoplastic agent therapy, wherein the therapy comprises administering an effective amount of the genotoxic anti-neoplastic agent therapy to patients.Type: ApplicationFiled: February 10, 2012Publication date: August 16, 2012Applicant: Baylor Research InstituteInventors: Ajay Goel, C. Richard Boland, Minoru Koi, Masanobu Takahashi
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Patent number: 8209948Abstract: The multilayer-structured spun yarn of the present invention is a multilayer-structured spun yarn C composed of a core fiber A and a cover fiber B that wraps around the core fiber; the core fiber A is in a range of 20 to 50 wt %; the cover fiber B is in a range of 50 to 80 wt %; the core fiber A contains a para-aramid fiber and is a stretch breaking twist yarn; the cover fiber B contains a flame-retardant acrylic fiber, a polyetherimide fiber, or a meta-aramid fiber; the direction of twist of the stretch breaking yarn and the direction of twist of the multilayer-structured yarn are the same; and the multilayer-structured yarn C has a twist number 1.2 to 1.6 times greater than that of the stretch breaking yarn. The heat-resistant textile of the present invention uses the aforementioned multilayer-structured spun yarn. The heat-resistant protective suit of the present invention uses the aforementioned heat-resistant textile.Type: GrantFiled: July 10, 2008Date of Patent: July 3, 2012Assignees: The Japan Wool Textile Co., Ltd., Sabic Innovative Plastics IP B.V.Inventors: Masanobu Takahashi, Keita Tasaki, Yukimasa Tanimoto
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Publication number: 20120164273Abstract: An object is to provide a pasteurized fresh cheese which has a smooth texture and a good taste, shows little water release, scarcely shows a lowering in pH or acidity and has a long best-before period. The objective is achieved by a method for processing a pasteurized fresh cheese comprising the steps of: (a) coagulating a starting milk material to obtain a curd; (b) adding a stabilizer to the curd; (c) pasteurizing the curd by heating; and, (d) separating a whey from the curd to obtain a cheese curd.Type: ApplicationFiled: September 3, 2009Publication date: June 28, 2012Applicant: Takanashi Milk Products Co., Ltd.Inventors: Kenji Nakajima, Masanobu Takahashi, Masataka Hosoda, Masaru Hiramatsu
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Publication number: 20120110721Abstract: A fire-protecting waterproof moisture-permeable sheet 4 of the present invention is a laminate of at least one fiber sheet 5 and a waterproof moisture-permeable film 7. The fiber sheet 5 is selected from the group consisting of a woven fabric, a knitted fabric and a nonwoven fabric including 50 to 100 weight % of a polyetherimide fiber and 0 to 50 weight % of another flame-retardant fiber. The flame resistance, the heat resistance, and the wash resistance under ISO 11613-1999 as the international performance standards for fireproof clothing are: (1) flame resistance to be free from hole formation, dripping and melting; and to have afterflame time and afterglow time of not more than 2 seconds; (2) heat resistance to be free from firing, separation, dripping and melting; and to have a shrinkage rate of not more than 5%; and (3) washing resistance to have a shrinkage rate of not more than 3%.Type: ApplicationFiled: February 24, 2010Publication date: May 10, 2012Applicants: SABIC INNOVATIVE PLASTICS IP B.V., THE JAPAN WOOL TEXTILE CO., LTD.Inventors: Masanobu Takahashi, Shigeo Washiyama
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Patent number: 8153109Abstract: An object of the invention is to provide an aqueous solution of a No. 1 permanent waving agent through reconstitution upon use in a simple manner, which solution contains a cyclic mercapto compound as a reducing agent and realizes excellent characteristics such as high waving effect and good appearance of waved hair. The invention provides an alkylene carbonate dilution containing a cyclic mercapto compound in an amount of 7 to 80 wt. %; an alkylene carbonate for use in preparation of the alkylene carbonate dilution; and an aqueous reducing chemical agent which is prepared from the alkylene carbonate dilution and an aqueous base material.Type: GrantFiled: November 20, 2007Date of Patent: April 10, 2012Assignees: San-Ei Kagaku Co., Ltd., Showa Denko K.K.Inventors: Masanobu Takahashi, Masumi Koike, Hirotomi Tamura
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Publication number: 20120042442Abstract: A fabric for fireproof clothing of the present invention is a fireproof fabric including flame-retardant fibers. The fabric is a woven fabric, a knitted fabric or a nonwoven fabric including 70 to 100 mass % of a polyetherimide fiber and 0 to 30 mass % of another flame-retardant fiber. The flame resistance, the heat resistance, and the wash resistance under ISO 11613-1999 as the international performance standards for fireproof clothing are: (1) flame resistance to be free from hole formation, dripping and melting; and to have afterflame time and afterglow time of not more than 2 seconds; (2) heat resistance to be free from firing, separation, dripping and melting; and to have a shrinkage rate of not more than 5%; and (3) washing resistance to have a shrinkage rate of not more than 3%. The fireproof clothing of the present invention includes the fireproof fabric fabricated as an inner liner.Type: ApplicationFiled: February 23, 2010Publication date: February 23, 2012Applicants: SABIC INNOVATIVE PLASTICS IP B.V., THE JAPAN WOOL TEXTILE CO., LTD.Inventors: Masanobu Takahashi, Keita Tasaki, Takashi Tamura
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Publication number: 20110193261Abstract: The present invention aims at effectively decreasing the installation space of an entire semiconductor chip compression molding apparatus and effectively decreasing the clamping force in dies which are provided in the apparatus. It further aims at performing a clamping, in the case where substrates having a different thickness are used, with an efficient adjustment in accordance with the thicknesses of the substrates. To this end, the semiconductor chip compression molding includes two semiconductor chip compression molding dies (top and bottom dies), and a die opening/closing means for closing the die surfaces of top dies and those of bottom dies in each of the upper and lower dies. The die opening/closing means includes a die opening/closing mechanism having two racks and one pinion, and a thickness adjustment mechanism for adjusting the gaps in accordance with the thicknesses of the substrates supplied to each of the upper and lower dies.Type: ApplicationFiled: October 16, 2009Publication date: August 11, 2011Applicant: TOWA CORPORATIONInventors: Hiroshi Uragami, Masanobu Takahashi, Shigeru Hirata
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Patent number: 7972892Abstract: A composite growth-assisting substrate 10 is formed by epitaxially growing a separation-assisting compound semiconductor layer 10k composed of a non-GaAs III-V compound semiconductor single crystal, and then a sub-substrate 10e composed of a GaAs single crystal in this order, on a first main surface of a substrate bulk 10m composed of a GaAs single crystal. The sub-substrate portion 10e is then separated from the composite growth-assisting substrate 10, so as to be left as a residual substrate portion 1 on a second main surface of the main compound semiconductor layer 40, and a portion of the residual substrate portion 1 is cut off to thereby form a cut-off portion 1j having a bottom surface used as a light extraction surface. By this configuration, the light emitting device is provided as allowing effective use of the GaAs substrate, and increasing the light extraction efficiency.Type: GrantFiled: February 25, 2005Date of Patent: July 5, 2011Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Masato Yamada, Masanobu Takahashi
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Publication number: 20100243825Abstract: A tension balancer which includes an axis body including a latch part, a column shaped main body including a bottom part which has at least two first through holes arranged at equal intervals in a concentric circle from the center, and an open upper part, a spring base housed within the Main body and having an aperture for joining an end of the axis body to the center, and at least two second holes arranged at equal intervals in a concentric circle from the center, an upper lid having an aperture for pushing through the main body of the axis body to the center, and at last two second through holes arranged at equal intervals in a concentric circle from the center, the upper lid being screwed to the main body by a bold and nut which passes through the first, second and third through holes, and at least two or more spring unit groups sandwiched between the spring base which is housed within the main body and the upper lid.Type: ApplicationFiled: December 5, 2008Publication date: September 30, 2010Applicant: NHK SPRING Co., Ltd.Inventors: Atsushi Ohta, Masanobu Takahashi, Shinichi Kobayashi, Mikio Ito, Mitsuru Murakami, Yutaro Ohtomo, Keitaro Kawamura, Masahashi Nakagome
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Publication number: 20100205723Abstract: The multilayer-structured spun yarn of the present invention is a multilayer-structured spun yarn C composed of a core fiber A and a cover fiber B that wraps around the core fiber; the core fiber A is in a range of 20 to 50 wt %; the cover fiber B is in a range of 50 to 80 wt %; the core fiber A contains a para-aramid fiber and is a stretch breaking twist yarn; the cover fiber B contains a flame-retardant acrylic fiber, a polyetherimide fiber, or a meta-aramid fiber; the direction of twist of the stretch breaking yarn and the direction of twist of the multilayer-structured yarn are the same; and the multilayer-structured yarn C has a twist number 1.2 to 1.6 times greater than that of the stretch breaking yarn. The heat-resistant textile of the present invention uses the aforementioned multilayer-structured spun yarn. The heat-resistant protective suit of the present invention uses the aforementioned heat-resistant textile.Type: ApplicationFiled: July 10, 2008Publication date: August 19, 2010Applicant: THE JAPAN WOOL TEXTILE CO., LTD.Inventors: Masanobu Takahashi, Keita Tasaki, Yukimasa Tanimoto
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Patent number: 7589352Abstract: A light emitting element (100) comprising an element chip (100C) provided, at least in a partial section in the thickness direction thereof, with a part of reduced cross-section where the cross sectional area decreases continuously or stepwise in the direction perpendicular to the thickness direction from the first major surface side toward the second major surface side. A part of a molded section (25) has a first mold layer (26) covering at least the part of reduced cross-section, and a second mold layer (25m) covering the outside of the first mold layer (26), wherein the first mold layer (26) is composed of a polymer mold material softer than that of the second mold layer (25m). A light emitting element, having such a structure that the element chip bonded onto a metal stage is not stripped easily even if mold resin expands, is thereby provided.Type: GrantFiled: November 4, 2004Date of Patent: September 15, 2009Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Masato Yamada, Masanobu Takahashi
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Publication number: 20090162467Abstract: Resin molding apparatus includes in unit, press unit and out unit. The in unit transfers not only pre-molding substrate but also resin material. The press unit includes multiple mold assemblies. The out unit transfers molded substrate having been resin-sealed within the mold assemblies. Further, the resin sealing/molding apparatus includes not only carrier rail but also demounting means and supply means traveling along the carrier rail. Furthermore, multiple press units in the state of being linked with each other are disposed between the in unit and the out unit.Type: ApplicationFiled: January 26, 2007Publication date: June 25, 2009Inventors: Hiroshi Uragami, Mamoru Nakamura, Masanobu Takahashi, Kinya Fujino, Katsunori Tsutafuji
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Patent number: 7511314Abstract: Disclosed is a light-emitting device (100) has a light-emitting layer portion (24) which is composed of a group III-V compound semiconductor and a transparent thick-film semiconductor layer (90) with a thickness of not less than 40 ?m which is formed on at least one major surface side of the light-emitting layer portion (24) and composed of a group III-V compound semiconductor having a band gap energy larger than the photon energy equivalent of the peak wavelength of emission flux from the light-emitting layer portion (24). The transparent thick-film semiconductor layer (90) has a lateral surface portion (90S) which is a chemically etched surface. The dopant concentration of the transparent thick-film semiconductor layer (90) is not less than 5×1016/cm3 and not more than 2×1018/cm3. The light-emitting device can have a transparent thick-film semiconductor layer while being significantly improved in light taking-out efficiency from the lateral surface portion.Type: GrantFiled: October 15, 2004Date of Patent: March 31, 2009Assignee: Shin-Etsu Handotai Co., Ltd.Inventors: Masato Yamada, Masayuki Shinohara, Masanobu Takahashi, Keizou Adomi, Jun Ikeda
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Publication number: 20080118455Abstract: An object of the invention is to provide an aqueous solution of a No. 1 permanent waving agent through reconstitution upon use in a simple manner, which solution contains a cyclic mercapto compound as a reducing agent and realizes excellent characteristics such as high waving effect and good appearance of waved hair. The invention provides an alkylene carbonate dilution containing a cyclic mercapto compound in an amount of 7 to 80 wt. %; an alkylene carbonate for use in preparation of the alkylene carbonate dilution; and an aqueous reducing chemical agent which is prepared from the alkylene carbonate dilution and an aqueous base material.Type: ApplicationFiled: November 20, 2007Publication date: May 22, 2008Applicants: SAN-EI KAGAKU CO., LTD., SHOWA DENKO K. K.Inventors: Masanobu Takahashi, Masumi Koike, Hirotomi Tamura
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Publication number: 20070187712Abstract: A composite growth-assisting substrate 10 is formed by epitaxially growing a separation-assisting compound semiconductor layer 10k composed of a non-GaAs III-V compound semiconductor single crystal, and then a sub-substrate 10e composed of a GaAs single crystal in this order, on a first main surface of a substrate bulk 10m composed of a GaAs single crystal. The sub-substrate portion 10e is then separated from the composite growth-assisting substrate 10, so as to be left as a residual substrate portion 1 on a second main surface of the main compound semiconductor layer 40, and a portion of the residual substrate portion 1 is cut off to thereby form a cut-off portion 1j having a bottom surface used as a light extraction surface. By this configuration, the light emitting device is provided as allowing effective use of the GaAs substrate, and increasing the light extraction efficiency.Type: ApplicationFiled: February 25, 2005Publication date: August 16, 2007Applicant: Shin-Etsu Handotai Co., Ltd.Inventors: Masato Yamada, Masanobu Takahashi