Patents by Inventor Masanori Iida

Masanori Iida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190161666
    Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.
    Type: Application
    Filed: November 2, 2016
    Publication date: May 30, 2019
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Eiji TANIGAWA, Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA
  • Patent number: 7919875
    Abstract: A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: April 5, 2011
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductor Co., Ltd.
    Inventors: Takashi Noma, Katsuhiko Kitagawa, Hisao Otsuka, Akira Suzuki, Yoshinori Seki, Yukihiro Takao, Keiichi Yamaguchi, Motoaki Wakui, Masanori Iida
  • Patent number: 7413931
    Abstract: The invention is directed to improvement of reliability of a chip size package type semiconductor device in a manufacturing method thereof. A support body is formed on a front surface of a semiconductor substrate with a first insulation film therebetween. Then, a part of the semiconductor substrate is selectively etched from its back surface to form an opening, and then a second insulation film is formed on the back surface. Next, the first insulation film and the second insulation film at a bottom of the opening are selectively etched, to expose pad electrodes at the bottom of the opening. Then, a third resist layer is selectively formed on a second insulation film at boundaries between sidewalls and the bottom of the opening on the back surface of the semiconductor substrate. Furthermore, a wiring layer electrically connected with the pad electrodes at the bottom of the opening and extending onto the back surface of the semiconductor substrate is selectively formed corresponding to a predetermined pattern.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: August 19, 2008
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Takashi Noma, Kazuo Okada, Hiroshi Yamada, Masanori Iida
  • Publication number: 20080093708
    Abstract: A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.
    Type: Application
    Filed: December 13, 2007
    Publication date: April 24, 2008
    Applicants: SANYO Electric Co., Ltd., Kanto SANYO Semiconductor Co., Ltd.
    Inventors: Takashi Noma, Katsuhiko Kitagawa, Hisao Otsuka, Akira Suzuki, Yoshinori Seki, Yukihiro Takao, Keiichi Yamaguchi, Motoaki Wakui, Masanori Iida
  • Patent number: 7312107
    Abstract: A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: December 25, 2007
    Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
    Inventors: Takashi Noma, Katsuhiko Kitagawa, Hisao Otsuka, Akira Suzuki, Yoshinori Seki, Yukihiro Takao, Keiichi Yamaguchi, Motoaki Wakui, Masanori Iida
  • Patent number: 7024087
    Abstract: A first substrate on which an optical-waveguide groove is formed and a second substrate. The second substrate is bonded to the plane of the first substrate on which the optical-waveguide groove is formed by a material having a refractive index higher than those of the first substrate and second substrate. The optical-waveguide groove is filled with the material, and the refractive index of the first substrate is different from the refractive index of the second substrate.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: April 4, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mikihiro Shimada, Tsuguhiro Korenaga, Masanori Iida, Hiroyuki Asakura
  • Publication number: 20060068572
    Abstract: The invention is directed to improvement of reliability of a chip size package type semiconductor device in a manufacturing method thereof. A support body is formed on a front surface of a semiconductor substrate with a first insulation film therebetween. Then, a part of the semiconductor substrate is selectively etched from its back surface to form an opening, and then a second insulation film is formed on the back surface. Next, the first insulation film and the second insulation film at a bottom of the opening are selectively etched, to expose pad electrodes at the bottom of the opening. Then, a third resist layer is selectively formed on a second insulation film at boundaries between sidewalls and the bottom of the opening on the back surface of the semiconductor substrate. Furthermore, a wiring layer electrically connected with the pad electrodes at the bottom of the opening and extending onto the back surface of the semiconductor substrate is selectively formed corresponding to a predetermined pattern.
    Type: Application
    Filed: September 14, 2005
    Publication date: March 30, 2006
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Takashi Noma, Kazuo Okada, Hiroshi Yamada, Masanori Iida
  • Patent number: 7013090
    Abstract: A transmitting circuit apparatus has a frequency modulator that performs frequency modulation of a carrier wave with frequency modulation data and outputs the frequency-modulated carrier wave; a sigma-delta modulator which performs sigma delta modulation of amplitude modulation data; and an amplitude modulator that performs amplitude modulation of the frequency-modulated carrier wave with an output signal of the sigma-delta modulator and outputs the amplitude-modulated carrier wave.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: March 14, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisashi Adachi, Masanori Iida, Hiroyuki Asakura
  • Patent number: 6990155
    Abstract: A transmitting circuit apparatus has a first digital modulator and a second digital modulator for modulating an I signal and a Q signal which are multi-valued digital baseband modulation signals, into a digital I signal and a digital Q signal, respectively, having the number of bits smaller than that of the baseband modulation signals; and a quadrature modulator for outputting a signal synthesized from the signals generated by modulating (two) carrier waves each having a phase perpendicular to each other by using the modulated I and Q signals, respectively.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: January 24, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisashi Adachi, Masanori Iida, Hiroyuki Asakura
  • Patent number: 6964528
    Abstract: An optical mount substrate and a manufacturing method of the optical mount substrate. An optical fiber guide section for arranging and fixing an optical transfer section, having an optical waveguide or an optical fiber, is formed. An electrical conductivity member is embedded in the optical mount substrate so that it penetrates a first principal plane of an arrangement section for arranging an optical device optically connected with the optical waveguide or the optical fiber on the first principal plane, and a second principal plane of the arrangement section parallel to the first principal plane. The optical fiber guide section and the arrangement section are formed by pressing a mold member to a heated and softened substrate to transfer inversion geometry of the mold member onto the substrate. The electrical conductivity member, having a predetermined shape, is directly pressed onto the heated and softened substrate to embed it into the substrate.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: November 15, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsuguhiro Korenaga, Hiroyuki Asakura, Masanori Iida, Hisashi Adachi, Mikihiro Shimada
  • Patent number: 6902328
    Abstract: An optical module has a high-frequency circuit substrate; at least one optical semiconductor device mounted on the high-frequency circuit substrate; and an optical waveguide substrate arranged on the high-frequency circuit substrate.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: June 7, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mikihiro Shimada, Masanori Iida, Hiroyuki Asakura
  • Publication number: 20050063660
    Abstract: An optical element has a substrate having or not having a channel for optical waveguide; and a material which has a refractive index higher than that of the substrate and is filled in the channel for optical waveguide or is disposed on the substrate; wherein the refractive index in a part of the material varies substantially periodically or is substantially continuously monotone increasing or decreasing in the direction of light propagation.
    Type: Application
    Filed: October 8, 2004
    Publication date: March 24, 2005
    Inventors: Mikihiro Shimada, Tsuguhiro Korenaga, Masanori Iida, Hiroyuki Asakura
  • Publication number: 20050048740
    Abstract: A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.
    Type: Application
    Filed: August 4, 2004
    Publication date: March 3, 2005
    Applicant: Sanyo Electric Co., Ltd.
    Inventors: Takashi Noma, Katsuhiko Kitagawa, Hisao Otsuka, Akira Suzuki, Yoshinori Seki, Yukihiro Takao, Keiichi Yamaguchi, Motoaki Wakui, Masanori Iida
  • Patent number: 6826344
    Abstract: An optical element has a substrate having or not having a channel for optical waveguide; and a material which has a refractive index higher than that of the substrate and is filled in the channel for optical waveguide or is disposed on the substrate; wherein the refractive index in a part of the material varies substantially periodically or is substantially continuously monotone increasing or decreasing in the direction of light propagation.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: November 30, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mikihiro Shimada, Tsuguhiro Korenaga, Masanori Iida, Hiroyuki Asakura
  • Patent number: 6826418
    Abstract: The invention provides a radio circuit realizing a desired receiving characteristic even when a strong-level interfering wave is received and operating with small power when no interfering wave is received. The radio circuit comprises a receiving circuit for selecting a signal having a desired frequency from received signals and demodulating the signal, an input-power detector for detecting power P1 of the receiving circuit, a received-power detector for detecting power P2 of a signal selected by the receiving circuit, and a reception control circuit for controlling the receiving circuit. The reception control circuit controls the receiving circuit at a low distortion by increasing the power consumption of a circuit included in the receiving circuit and thereby expanding the linear operation range when the power P1 detected by the input-power detector is larger than a predetermined value t1 and the power P2 detected by the input-power detector is smaller than a predetermined value t3.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: November 30, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisashi Adachi, Masanori Iida, Hiroyuki Asakura
  • Publication number: 20040184705
    Abstract: The present invention includes a light-transmissive first substrate having a first refractive index, a first groove for an optical waveguide, formed on the principal plane of said first substrate, filled with a material with a second refractive index which is higher than said first refractive index, a second groove, one end of which is formed on said principal plane of said first substrate at a predetermined distance from one end of said first groove, for placing an optical terminal on said first substrate and optically connecting said optical waveguide and said optical terminal, and a second substrate having a lower refractive index than said second refractive index placed on said first substrate for covering said first groove and at least part of said predetermined gap.
    Type: Application
    Filed: January 7, 2004
    Publication date: September 23, 2004
    Inventors: Mikihiro Shimada, Masanori Iida
  • Publication number: 20040047580
    Abstract: When forming a laminated optical waveguide, an extra adhesive layer lies and a wave-guiding mode is present. Moreover, it is difficult to remove the adhesive layer.
    Type: Application
    Filed: October 24, 2003
    Publication date: March 11, 2004
    Inventors: Mikihiro Shimada, Tsuguhiro Korenaga, Masanori Iida, Hiroyuki Asakura
  • Publication number: 20040037571
    Abstract: Plural subcarrier-multiplexed AM signals 30 are input and narrow-band-FM-modulated by a voltage controlled oscillator 4 including the fundamental carrier wave and higher-order harmonics as the output, and the FM carrier wave component of the higher-order harmonics of the fundamental carrier wave is selectively taken out by a band-rejection filter 5, shifted to the lower frequency side by a frequency converter 7, converted into an optical signal by an electric/optic converter 3 and transmitted.
    Type: Application
    Filed: August 19, 2003
    Publication date: February 26, 2004
    Inventors: Masanori Iida, Hisashi Adachi, Hiroyuki Asakura
  • Patent number: 6658216
    Abstract: Plural subcarrier-multiplexed AM signals 30 are input and narrow-band-FM-modulated by a voltage controlled oscillator 4 including the fundamental carrier wave and higher-order harmonics as the output, and the FM carrier wave component of the higher-order harmonics of the fundamental carrier wave is selectively taken out by a band-rejection filter 5, shifted to the lower frequency side by a frequency converter 7, converted into an optical signal by an electric/optic converter 3 and transmitted.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: December 2, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Iida, Hisashi Adachi, Hiroyuki Asakura
  • Patent number: 6643470
    Abstract: An FM signal converter comprising: an amplitude detecting unit for detecting amplitude variation of a plurality of signals that are multiplexed with subcarriers, as an amplitude variation signal; a peak detection unit for determining from said amplitude variation signal whether a peak of the amplitude of said plurality of signals exceeds a threshold and for generating peak detection information that includes information about said peak of the amplitude; a frequency signal source for providing signal with a predetermined frequency that differs from any of the frequencies of said subcarriers; an amplitude phase control unit for adjusting amplitude and phase of the signal from the frequency signal source according to said peak detecting information and outputting the adjusted signal as a corrected signal; signal combining means for combining said corrected signal and said plurality of signals multiplexed with subcarriers, with considering a time for generating the corrected signal; and an FM modulator for
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: November 4, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Iida, Hisashi Adachi, Hiroyuki Asakura