Abstract: A Cd-free blue fluorescent quantum dot with a narrow fluorescence FWHM. The quantum dot does not contain cadmium and its fluorescence FWHM is 25 nm or less. The quantum dot is preferably a nanocrystal containing zinc and selenium or zinc and selenium and sulfur. Further, the quantum dot preferably has a core-shell structure in which the nanocrystal serves as a core and the surface of the core is coated with a shell.

Abstract: A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.

Abstract: The invention is directed to improvement of reliability of a chip size package type semiconductor device in a manufacturing method thereof. A support body is formed on a front surface of a semiconductor substrate with a first insulation film therebetween. Then, a part of the semiconductor substrate is selectively etched from its back surface to form an opening, and then a second insulation film is formed on the back surface. Next, the first insulation film and the second insulation film at a bottom of the opening are selectively etched, to expose pad electrodes at the bottom of the opening. Then, a third resist layer is selectively formed on a second insulation film at boundaries between sidewalls and the bottom of the opening on the back surface of the semiconductor substrate. Furthermore, a wiring layer electrically connected with the pad electrodes at the bottom of the opening and extending onto the back surface of the semiconductor substrate is selectively formed corresponding to a predetermined pattern.

Abstract: A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.

Abstract: A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.

Abstract: A first substrate on which an optical-waveguide groove is formed and a second substrate. The second substrate is bonded to the plane of the first substrate on which the optical-waveguide groove is formed by a material having a refractive index higher than those of the first substrate and second substrate. The optical-waveguide groove is filled with the material, and the refractive index of the first substrate is different from the refractive index of the second substrate.

Abstract: The invention is directed to improvement of reliability of a chip size package type semiconductor device in a manufacturing method thereof. A support body is formed on a front surface of a semiconductor substrate with a first insulation film therebetween. Then, a part of the semiconductor substrate is selectively etched from its back surface to form an opening, and then a second insulation film is formed on the back surface. Next, the first insulation film and the second insulation film at a bottom of the opening are selectively etched, to expose pad electrodes at the bottom of the opening. Then, a third resist layer is selectively formed on a second insulation film at boundaries between sidewalls and the bottom of the opening on the back surface of the semiconductor substrate. Furthermore, a wiring layer electrically connected with the pad electrodes at the bottom of the opening and extending onto the back surface of the semiconductor substrate is selectively formed corresponding to a predetermined pattern.

Abstract: A transmitting circuit apparatus has a frequency modulator that performs frequency modulation of a carrier wave with frequency modulation data and outputs the frequency-modulated carrier wave; a sigma-delta modulator which performs sigma delta modulation of amplitude modulation data; and an amplitude modulator that performs amplitude modulation of the frequency-modulated carrier wave with an output signal of the sigma-delta modulator and outputs the amplitude-modulated carrier wave.

Abstract: A transmitting circuit apparatus has a first digital modulator and a second digital modulator for modulating an I signal and a Q signal which are multi-valued digital baseband modulation signals, into a digital I signal and a digital Q signal, respectively, having the number of bits smaller than that of the baseband modulation signals; and a quadrature modulator for outputting a signal synthesized from the signals generated by modulating (two) carrier waves each having a phase perpendicular to each other by using the modulated I and Q signals, respectively.

Abstract: An optical mount substrate and a manufacturing method of the optical mount substrate. An optical fiber guide section for arranging and fixing an optical transfer section, having an optical waveguide or an optical fiber, is formed. An electrical conductivity member is embedded in the optical mount substrate so that it penetrates a first principal plane of an arrangement section for arranging an optical device optically connected with the optical waveguide or the optical fiber on the first principal plane, and a second principal plane of the arrangement section parallel to the first principal plane. The optical fiber guide section and the arrangement section are formed by pressing a mold member to a heated and softened substrate to transfer inversion geometry of the mold member onto the substrate. The electrical conductivity member, having a predetermined shape, is directly pressed onto the heated and softened substrate to embed it into the substrate.

Abstract: An optical module has a high-frequency circuit substrate; at least one optical semiconductor device mounted on the high-frequency circuit substrate; and an optical waveguide substrate arranged on the high-frequency circuit substrate.

Abstract: An optical element has a substrate having or not having a channel for optical waveguide; and a material which has a refractive index higher than that of the substrate and is filled in the channel for optical waveguide or is disposed on the substrate; wherein the refractive index in a part of the material varies substantially periodically or is substantially continuously monotone increasing or decreasing in the direction of light propagation.

Abstract: A manufacturing method of a semiconductor device formed in a chip size package is improved to enhance a yield and reliability. A window to expose first wirings is formed only in a region of a semiconductor substrate where the first wirings exist. As a result, area of the semiconductor substrate bonded to a supporting body through an insulation film and a resin is increased to prevent cracks in the supporting body and separation of the semiconductor substrate from the supporting body. A slit is formed along a dicing line after forming the window, the slit is covered with a protection film and then the semiconductor substrate is diced into individual semiconductor dice. Thus, separation on a cut surface or at an edge of the semiconductor dice, which otherwise would be caused by contact of the blade in the dicing can be prevented.

Abstract: An optical element has a substrate having or not having a channel for optical waveguide; and a material which has a refractive index higher than that of the substrate and is filled in the channel for optical waveguide or is disposed on the substrate; wherein the refractive index in a part of the material varies substantially periodically or is substantially continuously monotone increasing or decreasing in the direction of light propagation.

Abstract: The invention provides a radio circuit realizing a desired receiving characteristic even when a strong-level interfering wave is received and operating with small power when no interfering wave is received. The radio circuit comprises a receiving circuit for selecting a signal having a desired frequency from received signals and demodulating the signal, an input-power detector for detecting power P1 of the receiving circuit, a received-power detector for detecting power P2 of a signal selected by the receiving circuit, and a reception control circuit for controlling the receiving circuit. The reception control circuit controls the receiving circuit at a low distortion by increasing the power consumption of a circuit included in the receiving circuit and thereby expanding the linear operation range when the power P1 detected by the input-power detector is larger than a predetermined value t1 and the power P2 detected by the input-power detector is smaller than a predetermined value t3.

Abstract: The present invention includes a light-transmissive first substrate having a first refractive index, a first groove for an optical waveguide, formed on the principal plane of said first substrate, filled with a material with a second refractive index which is higher than said first refractive index, a second groove, one end of which is formed on said principal plane of said first substrate at a predetermined distance from one end of said first groove, for placing an optical terminal on said first substrate and optically connecting said optical waveguide and said optical terminal, and a second substrate having a lower refractive index than said second refractive index placed on said first substrate for covering said first groove and at least part of said predetermined gap.

Abstract: When forming a laminated optical waveguide, an extra adhesive layer lies and a wave-guiding mode is present. Moreover, it is difficult to remove the adhesive layer.

Abstract: Plural subcarrier-multiplexed AM signals 30 are input and narrow-band-FM-modulated by a voltage controlled oscillator 4 including the fundamental carrier wave and higher-order harmonics as the output, and the FM carrier wave component of the higher-order harmonics of the fundamental carrier wave is selectively taken out by a band-rejection filter 5, shifted to the lower frequency side by a frequency converter 7, converted into an optical signal by an electric/optic converter 3 and transmitted.

Abstract: Plural subcarrier-multiplexed AM signals 30 are input and narrow-band-FM-modulated by a voltage controlled oscillator 4 including the fundamental carrier wave and higher-order harmonics as the output, and the FM carrier wave component of the higher-order harmonics of the fundamental carrier wave is selectively taken out by a band-rejection filter 5, shifted to the lower frequency side by a frequency converter 7, converted into an optical signal by an electric/optic converter 3 and transmitted.

Abstract: An FM signal converter comprising: an amplitude detecting unit for detecting amplitude variation of a plurality of signals that are multiplexed with subcarriers, as an amplitude variation signal; a peak detection unit for determining from said amplitude variation signal whether a peak of the amplitude of said plurality of signals exceeds a threshold and for generating peak detection information that includes information about said peak of the amplitude; a frequency signal source for providing signal with a predetermined frequency that differs from any of the frequencies of said subcarriers; an amplitude phase control unit for adjusting amplitude and phase of the signal from the frequency signal source according to said peak detecting information and outputting the adjusted signal as a corrected signal; signal combining means for combining said corrected signal and said plurality of signals multiplexed with subcarriers, with considering a time for generating the corrected signal; and an FM modulator for