Abstract: A joining device includes: a pair of pressing members disposed to face each other to sandwich joining target members from both sides in a stacking direction of the joining target members and configured to press the joining target members; and power supply members disposed on one or both sides in the stacking direction of the joining target members to sandwich a pressing target portion of the joining target members by the pressing members and configured to come into contact with and supply power to the joining target members. The power supply members are provided at positions not overlapping the pressing members in the stacking direction of the joining target members, and the pressing members press the joining target members while the power supply members supply power to the joining target members, thereby generating resistance heat in the pressing target portion and joining the joining target members.

Abstract: A metallic member bonding device includes a pressurizing unit, a current supply unit, and a deformation suppressing unit. The pressurizing unit pressurizes a first metallic member toward a hole portion of a second metallic member to press the first metallic member therein. The current supply unit supplies a welding current between the first metallic member and the second metallic member. The deformation suppressing unit suppresses deformation of one of the first metallic member and the second metallic member, the one member having a constituent metallic material with at least one of a proof stress and a melting temperature lower than that of the other member, the deformation being in a direction of a cross section crossing a direction of the press-in. Then, the deformation suppressing unit is provided in a region covering at least a plastic flow range in the press-in direction.

Abstract: A resistance welding method includes: welding a plurality of welding target members by supplying an electric current through electrodes; and generating a fragile portion in a position of the welding target members different from a position subject to the welding by using the electrodes for the welding or electrodes separate from the electrodes for the welding, before, during, or after the welding is performed.

Abstract: A resistance welding apparatus includes: a cleaning system that, before a welding electrode contacts a welding target, supplies a fluid to clean, of a contact portion of the welding electrode and a contact portion of the welding target, at least the contact portion of the welding target, the contact portion of the welding target being to contact the welding electrode, the contact portion of the welding electrode being to contact the welding target; and a cooling system that, during and/or after welding the welding target by the welding electrode, supplies the fluid to cool the welding electrode and a portion near the contact portion of the welding target.

Abstract: The molding method according to the present invention includes a first step of disposing a composite material and a molded member in an overlapped manner between a die having a first mold part and a punch having a second mold part opposing the first mold part, and a second step of pressing the punch in a direction to approach the die so as to mold the composite material and the molded member into shapes corresponding to the first and second mold parts and join the composite material and the molded member to each other. The composite material has a thickness of 0.01 mm or more and 1 mm or less.

Abstract: A molding method according to the present invention is a method of molding a composite material including a first member, a second member, and a reinforcement member interposed between the first member and the second member, the method including a first step of disposing the reinforcement member between the first member and the second member, and a second step of causing the first member to collide with the second member by a predetermined urging force after the reinforcement member is disposed, thus joining the first member and the second member with the reinforcement member interposed between the first member and the second member. The composite material has a thickness of 0.01 mm or more and 1 mm or less.

Abstract: A resistance welding machine includes a first electrode and a second electrode which are configured so that the first and second electrodes can hold a workpiece therebetween and apply a current to the workpiece. The first electrode includes a first inner electrode and a first outer electrode disposed outside the first inner electrode at a predetermined interval. The second electrode includes a second inner electrode and a second outer electrode disposed outside the second inner electrode at a predetermined interval. The resistance welding machine further includes a control unit that can control a pressing state of the workpiece with the first and second electrodes according to predetermined welding conditions and selects a pair of electrodes that apply a current to the workpiece from the first inner electrode, the first outer electrode, the second inner electrode, and the second outer electrode.

Abstract: A joining apparatus is an apparatus for performing joining of a joining target object including multiple members stacked on each other and a thermosetting adhesive arranged on joining target portions of the multiple members. The joining apparatus includes a first electrode; a second electrode; a pressurization mechanism configured to cause the first and second electrodes to pressure-contact the surface of the joining target object in the vicinity of the joining target portions; a power source configured to distribute power to between the first electrode and the second electrode; and a control unit configured to distribute the power to between both electrodes by the power source in a state in which the first electrode and the second electrode pressure-contact the surface by the pressurization mechanism, thereby performing joining of the joining target object by curing of the thermosetting adhesive by resistance heating generated at the joining target object.

Abstract: A metallic member bonding device includes a pressurizing unit, a current supply unit, and a deformation suppressing unit. The pressurizing unit pressurizes a first metallic member toward a hole portion of a second metallic member to press the first metallic member therein. The current supply unit supplies a welding current between the first metallic member and the second metallic member. The deformation suppressing unit suppresses deformation of one of the first metallic member and the second metallic member, the one member having a constituent metallic material with at least one of a proof stress and a melting temperature lower than that of the other member, the deformation being in a direction of a cross section crossing a direction of the press-in. Then, the deformation suppressing unit is provided in a region covering at least a plastic flow range in the press-in direction.

Abstract: In a clutch manufacturing method, inner peripheral portions of drum members, of two clutches are connected to a sleeve member, and a piston, a seal plate and a return spring are provided between the drum members, an insulator to apply electric isolation between the piston and the drum member or between the seal plate and another drum member is attached to either the piston or the seal plate. Then, the drum member, to which the electric isolation with the insulator is not applied, is connected to the sleeve member. Then, the piston, return sprig and seal plate are assembled to the sleeve member to which the drum member has been connected. Finally, the drum member, to which the electric isolation with the insulator has been applied, is connected to the sleeve member with electric welding.

Abstract: A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surface of the core wire (11), and a plurality of superabrasive grains (13) bonded to the surface of the core wire (11) with the bonding material (12). The reel (1) includes a peripheral surface (2) having one end (3) and the other end (4). The superabrasive wire saw (10) which is to be unreeled successively toward a workpiece is wound around the peripheral surface (2) reciprocatingly between the one end (3) and the other end (4) to be multi-layered. A pitch P for winding the superabrasive wire saw (10) around the peripheral surface (2) between the one end (3) and the other end (4) satisfies a relation of D<P<2D.

Abstract: In a clutch manufacturing method, inner peripheral portions of drum members, of two clutches are connected to a sleeve member, and a piston, a seal plate and a return spring are provided between the drum members, an insulator to apply electric isolation between the piston and the drum member or between the seal plate and another drum member is attached to either the piston or the seal plate. Then, the drum member, to which the electric isolation with the insulator is not applied, is connected to the sleeve member. Then, the piston, return sprig and seal plate are assembled to the sleeve member to which the drum member has been connected. Finally, the drum member, to which the electric isolation with the insulator has been applied, is connected to the sleeve member with electric welding.

Abstract: A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surface of the core wire (11), and a plurality of superabrasive grains (13) bonded to the surface of the core wire (11) with the bonding material (12). The reel (1) includes a peripheral surface (2) having one end (3) and the other end (4). The superabrasive wire saw (10) which is to be unreeled successively toward a workpiece is wound around the peripheral surface (2) reciprocatingly between the one end (3) and the other end (4) to be multi-layered. A pitch P for winding the superabrasive wire saw (10) around the peripheral surface (2) between the one end (3) and the other end (4) satisfies a relation of D<P<2D.

Abstract: This invention provides a fluorocarbon resin aqueous coating composition comprising:(a) a fluorocarbon resin, and based on the amount by weight of the resin(b) about 1 to about 10% by weight of a silicone emulsion (calculated as silicone oil contained),(c) about 1 to about 40% by weight of a flaky inorganic material, and(d) about 3 to about 10% by weight of a nonionic surfactant, or a mixture of nonionic surfactant and anionic surfactant,the composition containing about 25 to about 75% by weight of water based on the whole composition.

Abstract: An integrated injection logic circuit includes a plurality of integrated injection logic gates each having a PNP transistor for injector and NPN transistor for signal inversion, and an injector common line to which the respective injector PNP transistors are commonly connected. A test pad for electric probing is provided at least one location of the injector common line.

Abstract: An integrated injection logic having a first semiconductor region of first conductivity type, a second semiconductor region of second conductivity type formed in the first semiconductor region, a plurality of third semiconductor regions of first conductivity type formed in the second semiconductor region, and a fourth semiconductor region of second conductivity type formed in the first semiconductor region. A fifth semiconductor region of second conductivity type is formed in the first semiconductor region and in the vicinity of the second semiconductor region and is connected to one of the plurality of third semiconductor regions in order to eliminate minority carriers stored in the first semiconductor region and the second semiconductor region.

Abstract: A buffer circuit is provided wherein bipolar transistors are connected to the output terminal of an IIL gate. The buffer circuit includes an IIL gate having a plurality of output terminals. The output terminals of the IIL gate are respectively connected to the bases of the bipolar transistors of which the emitter-collector paths are connected in series between a buffer output terminal and a reference voltage terminal.

Abstract: The integrated injection logic semiconductor device comprises an N type semiconductor substrate, a P type semiconductor layer laminated on the N type semiconductor substrate, a first N type region extending through the P type semiconductor layer to reach the N type semiconductor substrate, a P type region formed in the first N type region and having a periphery along the outer periphery of the first N type region and a second N type region formed in the P type semiconductor layer. The integrated injection logic semiconductor device is constituted by a PNP lateral transistor utilizing the P type region, the first N type region and the P type semiconductor layer as the emitter, base and collector electrodes respectively, and a NPN vertical transistor utilizing the N type semiconductor substrate, P type semiconductor layer and the second N type region as the emitter, base and collector electrodes, respectively.

Abstract: A semiconductor device comprises a P type semiconductor substrate; an N type layer buried in the P type substrate; and an N type isolating region extending from the surface of the P type substrate to the N type buried region to provide a P type isolated region in the P type substrate. In the P type isolated region marked off by the N type isolating region is formed a first N type region so as not to contact the N type isolating region and buried region and a P type second region is diffused in the first N type region. A logic circuit is constituted by a first vertical PNP transistor formed of the P type second region, first N type region and P type isolated region and a second vertical NPN transistor formed of the first N type region, P type isolated region and N type buried region.

Abstract: A measuring apparatus comprises: a first series circuit having first and second resistors connected between a power source terminal and ground; a second series circuit having a thermistor and a third resistor connected between the power source and ground; a first variable frequency oscillator for generating a pulse signal with the frequency corresponding to the current derived from the junction between the first and second resistors of the first series circuit; a second variable frequency oscillator for generating a pulse signal with the frequency corresponding to the current derived from the junction between the thermistor and the third resistor; a first counter which counts the pulse signal from the second variable frequency oscillator to produce a high level signal till it counts a given number of pulses; and AND gate connected to the output terminal of the first variable frequency oscillator and the first counter, a second counter for counting the pulse fed from the first variable frequency oscillator via