Patents by Inventor Masanori Shimizu

Masanori Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10295280
    Abstract: A cylindrical header of a heat exchanger includes a central member, front-side and rear-side members extending longitudinally on front and rear sides of the central member to form front-side and rear-side spaces along with the central member. The central member has a first flange covering a front-side-member-first-end part and a rear-side-member-first-end part from outside when viewed in cross-section, and a second flange covering a front-side-member-second-end part and a rear-side-member-second-end part from outside when viewed in cross-section. The front-side member is joined to the central member with the front-side-member-first-end part facing an inner surface of the first flange, and the front-side-member-second-end part facing an inner surface of the second flange. The rear-side is joined to the central member with the rear-side-member-first-end part facing an inner surface of the first flange, and the rear-side-member-second-end part facing an inner surface of the second flange.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: May 21, 2019
    Assignee: Daikin Industries, Ltd.
    Inventors: Masahiro Tsutsui, Motofumi Shimizu, Masanori Jindou, Junichi Hamadate
  • Patent number: 10072608
    Abstract: The displacer 2d . . . has a gas retention space Hg . . . formed therein. The gas retention space Hg . . . enables a working gas G to be alternately moved between a heating unit 3h side and a cooling unit 3c side of a displacer cylinder 2c . . . by the movement of the displacer 2d . . . . The displacer 2d . . . and the displacer cylinder 2c . . . have an outer circumferential surface 2df and an inner circumferential surface 2ci, respectively, formed into such shapes as to be able to permit the movement of the displacer 2d . . . and inhibit passage of the working gas G. The displacer 2d . . . has a gas passageway 7 which is formed on its outer circumferential surface 2df and includes a gas passage groove that allows the gas retention space Hg to communicate with a working gas inlet/outlet 6 . . . provided in the displacer cylinder 2c . . . and connected to a power cylinder 5c.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: September 11, 2018
    Inventors: Hidemi Kurita, Masanori Shimizu
  • Publication number: 20170045018
    Abstract: The displacer 2d . . . has a gas retention space Hg . . . formed therein. The gas retention space Hg . . . enables a working gas G to be alternately moved between a heating unit 3h side and a cooling unit 3c side of a displacer cylinder 2c . . . by the movement of the displacer 2d . . . . The displacer 2d . . . and the displacer cylinder 2c . . . have an outer circumferential surface 2df and an inner circumferential surface 2ci, respectively, formed into such shapes as to be able to permit the movement of the displacer 2d . . . and inhibit passage of the working gas G. The displacer 2d . . . has a gas passageway 7 which is formed on its outer circumferential surface 2df and includes a gas passage groove that allows the gas retention space Hg to communicate with a working gas inlet/outlet 6 . . . provided in the displacer cylinder 2c . . . and connected to a power cylinder 5c.
    Type: Application
    Filed: April 13, 2015
    Publication date: February 16, 2017
    Inventors: Hidemi KURITA, Masanori SHIMIZU
  • Patent number: 9362205
    Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: June 7, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Takashi Shibasaki, Hidefumi Saito, Takahisa Makino, Masanori Shimizu, Daisuke Sasaki
  • Patent number: 9363894
    Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: June 7, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Takashi Shibasaki, Hidefumi Saito, Takahisa Makino, Masanori Shimizu, Daisuke Sasaki
  • Patent number: 9271397
    Abstract: A circuit device having superior voltage resistance is provided. A structure is achieved that omits the resin layer that is normally provided to the top surface of a circuit board. Specifically, a ceramic substrate (22) is disposed on the top surface of a circuit board (12) comprising a metal, and a transistor (34) such as an IGBT is mounted to the top surface of the ceramic substrate (22). As a result, the transistor (34) and the circuit board (12) are insulated from each other by the ceramic substrate (22). The ceramic substrate (22), which comprises an inorganic material, has an extremely high voltage resistance compared to the conventionally used insulating layer comprising resin, and so even if a high voltage on the order of 1000V is applied to the transistor (34), short circuiting between the transistor (34) and the circuit board (12) is prevented.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: February 23, 2016
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Takashi Shibasaki, Hidefumi Saito, Takahisa Makino, Masanori Shimizu, Daisuke Sasaki
  • Patent number: 9062851
    Abstract: An LED lamp provides a strong red color with a natural appearance. The LED lamp is provided with an LED module and a filter. The LED module includes a blue LED with a main emission peak in the 440 nm to 460 nm wavelength band, a green/yellow phosphor that is excited by light emitted by the blue LED, and a red phosphor that is excited by light emitted by at least one of the blue LED and the green/yellow phosphor. The filter reduces the spectral radiation intensity of at least a portion of the 570 nm to 590 nm wavelength band among light emitted by the LED module.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: June 23, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoko Matsubayashi, Hiroshi Yagi, Masanori Shimizu, Yoshio Manabe, Atsushi Motoya, Kazuhiro Matsuo, Toshio Mori
  • Publication number: 20130286618
    Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).
    Type: Application
    Filed: September 15, 2011
    Publication date: October 31, 2013
    Applicant: ON Semiconductor Trading, Ltd.
    Inventors: Takashi Shibasaki, Hidefumi Saito, Takahisa Makino, Masanori Shimizu, Daisuke Sasaki
  • Publication number: 20130286616
    Abstract: A circuit device having superior voltage resistance is provided. A structure is achieved that omits the resin layer that is normally provided to the top surface of a circuit board. Specifically, a ceramic substrate (22) is disposed on the top surface of a circuit board (12) comprising a metal, and a transistor (34) such as an IGBT is mounted to the top surface of the ceramic substrate (22). As a result, the transistor (34) and the circuit board (12) are insulated from each other by the ceramic substrate (22). The ceramic substrate (22), which comprises an inorganic material, has an extremely high voltage resistance compared to the conventionally used insulating layer comprising resin, and so even if a high voltage on the order of 1000V is applied to the transistor (34), short circuiting between the transistor (34) and the circuit board (12) is prevented.
    Type: Application
    Filed: September 15, 2011
    Publication date: October 31, 2013
    Applicant: ON Semiconductor Trading, Ltd.
    Inventors: Takashi Shibasaki, Hidefumi Saito, Takahisa Makino, Masanori Shimizu, Daisuke Sasaki
  • Publication number: 20130286617
    Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.
    Type: Application
    Filed: September 15, 2011
    Publication date: October 31, 2013
    Applicant: ON Semiconductor Trading, Ltd.
    Inventors: Takashi Shibasaki, Hidefumi Saito, Takahisa Makino, Masanori Shimizu, Daisuke Sasaki
  • Patent number: 8534857
    Abstract: A backlight apparatus comprises a light source that is composed of a combination of a blue light emitting device, a green light emitting phosphor, and a red light emitting phosphor. The blue light emitting device has a peak intensity of a light emitting spectrum 3 to 19 times as high as the green light emitting phosphor.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: September 17, 2013
    Assignee: Panasonic Corporation
    Inventors: Masanori Shimizu, Yoko Matsubayashi, Hiroshi Yagi
  • Patent number: 8405307
    Abstract: An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: March 26, 2013
    Assignee: Panasonic Corporation
    Inventors: Tadashi Yano, Masanori Shimizu, Kiyoshi Takahashi
  • Publication number: 20120300432
    Abstract: An LED lamp provides a strong red color with a natural appearance. The LED lamp is provided with an LED module and a filter. The LED module includes a blue LED with a main emission peak in the 440 nm to 460 nm wavelength band, a green/yellow phosphor that is excited by light emitted by the blue LED, and a red phosphor that is excited by light emitted by at least one of the blue LED and the green/yellow phosphor. The filter reduces the spectral radiation intensity of at least a portion of the 570 nm to 590 nm wavelength band among light emitted by the LED module.
    Type: Application
    Filed: February 16, 2011
    Publication date: November 29, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Yoko Matsubayashi, Hiroshi Yagi, Masanori Shimizu, Yoshio Manabe, Atsushi Motoya, Kazuhiro Matsuo, Toshio Mori
  • Patent number: 8175777
    Abstract: A control apparatus for a continuously variable transmission includes a clamping force increase portion. The continuously variable transmission includes a pair of a primary pulley and a secondary pulley on which a transmission belt is wound. A shift of the continuously variable transmission is performed by changing effective diameters of the primary pulley and the secondary pulley. The clamping force increase portion increases a belt clamping force when it is determined that a torque capacity is decreased by determining that drive power input to the primary pulley is decreased by an amount equal to or larger than a predetermined amount while the secondary pulley is in a stopped state or a substantially stopped state, as compared to when it is determined that the torque capacity is not decreased.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: May 8, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Masanori Shimizu, Ryuji Chida, Takashi Yumoto, Kenichi Yamaguchi
  • Patent number: 8071502
    Abstract: An exhaust gas purifying catalyst is provided in which alloying of precious metals is prevented even at high temperatures so that degradation of catalyst can be inhibited. The exhaust gas purifying catalyst comprises a substrate serving as a passage of exhaust gas; and a catalyst coating layer formed on the internal surface of the through hole and including precious metals and a refractory inorganic oxide. The catalyst coating layer formed in the area A located on the upstream portion of the passage with respect to the flow direction of exhaust gas contains a precious metal, Rh. The weight ratio of Rh and the precious metal other than Rh is 1:0 to 0.5. The catalyst coating layer formed in the area B located on the downstream portion of the passage contains precious metal other than Rh. The weight of the precious metal other than Rh is larger than the weight of Rh.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: December 6, 2011
    Assignee: Cataler Corporation
    Inventors: Masanori Shimizu, Michio Tanaka
  • Publication number: 20110096530
    Abstract: A backlight apparatus comprises a light source that is composed of a combination of a blue light emitting device, a green light emitting phosphor, and a red light emitting phosphor. The blue light emitting device has a peak intensity of a light emitting spectrum 3 to 19 times as high as the green light emitting phosphor.
    Type: Application
    Filed: October 25, 2010
    Publication date: April 28, 2011
    Inventors: Masanori Shimizu, Yoko Matsubayashi, Hiroshi Yagi
  • Publication number: 20110006673
    Abstract: An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.
    Type: Application
    Filed: July 14, 2010
    Publication date: January 13, 2011
    Applicant: Panasonic Corporation
    Inventors: Tadashi YANO, Masanori Shimizu, Kiyoshi Takahashi
  • Patent number: 7791274
    Abstract: An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: September 7, 2010
    Assignee: Panasonic Corporation
    Inventors: Tadashi Yano, Masanori Shimizu, Kiyoshi Takahashi
  • Patent number: 7671464
    Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: March 2, 2010
    Assignee: Panasonic Corporation
    Inventors: Tetsushi Tamura, Tatsumi Setomoto, Nobuyuki Matsui, Masanori Shimizu, Yoshihisa Yamashita
  • Publication number: 20100017080
    Abstract: A control apparatus for a continuously variable transmission includes a clamping force increase portion. The continuously variable transmission includes a pair of a primary pulley and a secondary pulley on which a transmission belt is wound. A shift of the continuously variable transmission is performed by changing effective diameters of the primary pulley and the secondary pulley. The clamping force increase portion increases a belt clamping force when it is determined that a torque capacity is decreased by determining that drive power input to the primary pulley is decreased by an amount equal to or larger than a predetermined amount while the secondary pulley is in a stopped state or a substantially stopped state, as compared to when it is determined that the torque capacity is not decreased.
    Type: Application
    Filed: April 15, 2009
    Publication date: January 21, 2010
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masanori SHIMIZU, Ryuji Chida, Takashi Yumoto, Kenichi Yamaguchi