Abstract: According to the present invention, a substrate 11, a cluster of LED chips, which are arranged two-dimensionally on the substrate 11, and a plurality of phosphor resin portions 13a, 13b that cover the respective LED chips are provided. The phosphor resin portion 13a, 13b includes a phosphor for transforming the emission of its associated LED chip into a light ray having a longer wavelength than that of the emission. A size of the phosphor resin portions 13b, which cover the LED chips located in an outer region of the cluster, is set bigger than that of the other phosphor resin portions 13a, which cover the LED chips located in the remaining non-outer region.

Abstract: An LED lamp includes: a substrate; a cluster of LEDs, which are arranged two-dimensionally on the substrate; and an interconnection circuit, which is electrically connected to the LEDs. The LEDs include a first group of LEDs, which are located around the outer periphery of the cluster, and a second group of LEDs, which are located elsewhere in the cluster. The interconnection circuit has an interconnection structure for separately supplying drive currents to at least one of the LEDs in the first group and to at least one of the LEDs in the second group separately from each other.

Abstract: An LED lighting source preventing heat deterioration and improving luminous efficiency includes a mounting substrate having a wiring pattern on a first main surface thereof and a plurality of LED bare chips, each composed of a first semiconductor layer and a second semiconductor layer having respectively different conductivity, an active layer disposed therebetween, and a metal electrode on the first semiconductor layer and substantially equal in area thereto, and each LED bare chip being joined to the wiring pattern according to flip chip mounting of the metal electrode to form a junction between the wiring pattern and the metal electrode. Each junction is formed so that an area thereof is at least 20% of the area of the metal electrode. Thermal resistance from the active layers through to a second main surface of the mounting substrate, which is a back surface thereof, is set to 3.0 9C./W or lower.

Abstract: A method for controlling a viscosity of a slurry includes the steps of preparing a slurry in which dispersion particles exhibiting a first median diameter are dispersed, and dispersing fine particles exhibiting a second median diameter, which is smaller than the first median diameter of the dispersion particles, in the slurry. When the dispersion particles exhibiting a larger median diameter and the fine particle exhibiting a smaller median diameter make a slurry, the resulting slurry exhibits a reduced viscosity.

Abstract: An exhaust gas purifying catalyst is provided in which alloying of precious metals is prevented even at high temperatures so that degradation of catalyst can be inhibited. The exhaust gas purifying catalyst comprises a substrate serving as a passage of exhaust gas; and a catalyst coating layer formed on the internal surface of the through hole and including precious metals and a refractory inorganic oxide. The catalyst coating layer formed in the area A located on the upstream portion of the passage with respect to the flow direction of exhaust gas contains a precious metal, Rh. The weight ratio of Rh and the precious metal other than Rh is 1:0 to 0.5. The catalyst coating layer formed in the area B located on the downstream portion of the passage contains precious metal other than Rh. The weight of the precious metal other than Rh is larger than the weight of Rh.

Abstract: A crusher for crushing cooked wood chips or the like finely. A raw material to be crushed such as the cooked wood chips is delivered into a housing and clamped between stationary blades attached to a stationary plate housed in the upper end of the housing and rotary blades attached to a rotary plate rotating in the housing, so that it is finely crushed by the stationary blades and the rotary blades by making use of the planer principle. The crushed products are carried in the air flow, which is generated around a guide vane disc, which rotates in a through hole formed in a substantially central portion of the stationary plate, and forcibly delivered from an exit in the housing side wall front portion inclined forward, to the outside of the housing.

Abstract: A crusher for crushing cooked wood chips or the like finely. A raw material to be crushed such as the cooked wood chips is delivered into a housing and clamped between stationary blades attached to a stationary plate housed in the upper end of the housing and rotary blades attached to a rotary plate rotating in the housing, so that it is finely crushed by the stationary blades and the rotary blades by making use of the planer principle. The crushed products are carried in the air flow, which is generated around a guide vane disc, which rotates in a through hole formed in a substantially central portion of the stationary plate, and forcibly delivered from an exit in the housing side wall front portion inclined forward, to the outside of the housing.

Abstract: An LED lamp 100 according to the present invention includes: a substrate 20 with an upper surface; a plurality of LED chips 10, which are arranged on the upper surface of the substrate 20; and a reflector 30, which has reflective surfaces that reflect emissions of the respective LED chips 10 at least partially. The reflector 30 includes a resin and a framework that is made of a material having a higher flexural rigidity than the resin.

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: A socket fixed to a heat sink holds a card-type LED module formed by integrating LED elements. The socket (6) includes: a frame structure for holding the LED module (1000) with its light source unit exposed through the frame opening; and a pressing member positioned around the opening for pressing the back surface of the LED module against the heat sink (2122). The socket may include a structure including a lower member (61) placed on a heat sink and an upper frame member (62) holding the LED module with its light source unit (1002) exposed through the frame opening. The upper member supported by the lower member via a hinge can open/close, and includes a pressing unit pressing the LED module set in the open state, against the lower member (61). The lower member (61) includes, in its main part, a lock unit (63) directly or indirectly lock the upper member (62) when the upper member is closed.

Abstract: According to the present invention, a substrate 11, a cluster of LED chips, which are arranged two-dimensionally on the substrate 11, and a plurality of phosphor resin portions 13a, 13b that cover the respective LED chips are provided. The phosphor resin portion 13a, 13b includes a phosphor for transforming the emission of its associated LED chip into a light ray having a longer wavelength than that of the emission. A size of the phosphor resin portions 13b, which cover the LED chips located in an outer region of the cluster, is set bigger than that of the other phosphor resin portions 13a, which cover the LED chips located in the remaining non-outer region.

Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.

Abstract: An LED illumination source is disclosed. The illumination source includes a metal base substrate including a line pattern and an insulating layer including a composite material with an inorganic filler and a resin composition. LED bare chips are mounted on one surface of the metal base substrate An optical reflector with holes to surround the bare chips is provided on the surface of the metal base substrate on which the LED bare chips are mounted. Stress relaxing means is provided between the metal base substrate and the optical reflector.

Abstract: The present invention has as its object the provision of a platinum-rhodium catalyst for automotive exhaust gas wherein the exhaust gas purification catalyst is provided with resistance to lean conditions due to fluctuations in the exhaust gas atmosphere due to fuel cuts of the automobile engine and the catalyst itself is provided with heat resistance due to mounting in the high temperature region right near the engine. Further, the platinum-rhodium catalyst for automotive exhaust gas of the present invention is formed with a catalyst layer from a mixture of a platinum catalyst carrier substance comprised of 95 to 99.9 wt % of a first catalyst carrier substance comprised of either first cerium oxide or activated alumina stabilized by zirconium carrying 0.1 to 5 wt % of platinum, a rhodium catalyst-carrying powder comprised of a second catalyst carrier substance of a rare earth metal element-stabilized zirconium oxide carrying 0.

Abstract: In a module socket, a connecter and a connector are connected by wiring, and three LED modules are connected in parallel with respect to a constant voltage circuit unit via the wiring. Each module has a constant current circuit unit and an LED mounting unit. The constant current circuit unit includes one resistor and two transistors mounted on a surface of a sub-substrate on which a conductive land is formed. The sub-substrate is bonded to a main substrate.

Abstract: An illumination light source includes four different types of LEDs, namely a blue light-emitting diode 11 emitting blue light, a blue-green light-emitting diode 12 emitting blue-green light, an orange light-emitting diode 13 emitting orange light and a red light-emitting diode 14 emitting red light.

Abstract: A metal base wiring board including: an insulation substrate composed of an upper insulation layer and a lower insulation layer; and a metal base attached to a rear surface of the insulation substrate. In front surfaces of the upper and lower insulation layers, wiring patterns are embedded and connected to each other. The insulation substrate has a plurality of recesses whose bottom faces are exposed areas of the front surface of the lower insulation layer. LED bare chips are mounted on the bottom faces of the recesses so as to be connected to the wiring pattern of the lower insulation layer.