Patents by Inventor Masao Noguchi

Masao Noguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11251680
    Abstract: A deceleration device according to an embodiment includes a driven gear configured to rotate about a rotational axis by driving power of a drive mechanism; a deceleration unit including a plurality of gears including a first gear and a second gear, the first gear that rotates by the driven gear, the second gear that rotates about the rotational axis, the deceleration unit configured to rotate the second gear at a reduced speed with respect to the driven gear; a first contact included in the second gear; and a second contact provided separately from the driven gear and the plurality of gears and configured to come into contact with the first contact to stop the rotation of the second gear.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: February 15, 2022
    Assignee: SHIROKI CORPORATION
    Inventors: Kohei Izuchi, Masao Noguchi, Toshiaki Nagata
  • Patent number: 11043474
    Abstract: A semiconductor device may include a first insulated substrate, a first semiconductor chip and a second semiconductor chip disposed on the first insulated substrate, a second insulated substrate opposed to the first insulated substrate with the first semiconductor chip interposed therebetween, and a third insulated substrate opposed to the first insulated substrate with the second semiconductor chip interposed therebetween and located side by side with the second insulated substrate.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: June 22, 2021
    Assignee: DENSO CORPORATION
    Inventors: Shingo Tsuchimochi, Rintaro Asai, Akinori Sakakibara, Masao Noguchi
  • Patent number: 10848307
    Abstract: A radio transmission device includes: an information acquisition unit to externally acquire information data; an encryptor to encrypt the information data using one of a plurality of encryption processes used for encryption to generate transmission data; a radio field intensity setter having a different setting for each of the plurality of encryption processes used for encryption, the radio field intensity setter setting a radio field intensity at which the transmission data is to be transmitted; and a transmitter to transmit the transmission data at the set radio field intensity.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: November 24, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Saki Nakatsuma, Kazuhiko Yamada, Masao Noguchi
  • Patent number: 10522498
    Abstract: A system of bonded substrates may include a first substrate, a second substrate, and a bonding layer. The first substrate may include a bonding surface, wherein a geometry of the bonding surface of the first substrate includes a plurality of microchannels. The second substrate may include a complementary bonding surface. The bonding layer may be positioned between the first substrate and the second substrate, wherein the bonding layer may fill the microchannels of the first substrate and may contact substantially the entire bonding surface of the first substrate. The bonding layer may include a metal.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 31, 2019
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Masao Noguchi
  • Publication number: 20190385985
    Abstract: A semiconductor device may include a first insulated substrate, a first semiconductor chip and a second semiconductor chip disposed on the first insulated substrate, a second insulated substrate opposed to the first insulated substrate with the first semiconductor chip interposed therebetween, and a third insulated substrate opposed to the first insulated substrate with the second semiconductor chip interposed therebetween and located side by side with the second insulated substrate.
    Type: Application
    Filed: April 29, 2019
    Publication date: December 19, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shingo TSUCHIMOCHI, Rintaro ASAI, Akinori SAKAKIBARA, Masao NOGUCHI
  • Patent number: 10489525
    Abstract: Systems and methods of simulating a physical bond layer comprising a composite material and predicting one or more properties of the composite material are disclosed. A method includes obtaining one or more X-ray images of a bulk physical sample of a composite material, the one or more X-ray images including one or more visual identifiers that correspond to one or more materials present in the bulk physical sample, and generating a three dimensional image of the bulk physical sample from the one or more X-ray images. The three dimensional image includes one or more labels indicating the presence and location of the one or more materials. The method further includes creating a meshed three dimensional microstructure-based model from the three dimensional image and simulating a physical bond layer with the meshed three dimensional microstructure-based model. The meshed three dimensional microstructure-based model incorporates data obtained from the one or more labels.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: November 26, 2019
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Masao Noguchi, Ercan M. Dede
  • Publication number: 20190356196
    Abstract: A deceleration device according to an embodiment includes a driven gear configured to rotate about a rotational axis by driving power of a drive mechanism; a deceleration unit including a plurality of gears including a first gear and a second gear, the first gear that rotates by the driven gear, the second gear that rotates about the rotational axis, the deceleration unit configured to rotate the second gear at a reduced speed with respect to the driven gear; a first contact included in the second gear; and a second contact provided separately from the driven gear and the plurality of gears and configured to come into contact with the first contact to stop the rotation of the second gear.
    Type: Application
    Filed: October 30, 2017
    Publication date: November 21, 2019
    Applicant: SHIROKI CORPORATION
    Inventors: Kohei IZUCHI, Masao NOGUCHI, Toshiaki NAGATA
  • Patent number: 10208835
    Abstract: A speed reducer includes: a case; an input shaft rotationally driven by an electric motor and having an eccentric shaft portion; an externally toothed gear wheel rotatably supported on the eccentric shaft portion; an output shaft rotatably supported on the case coaxially with the input shaft and having an internally toothed gear wheel; a guide plate formed with a guide recess recessed parallel to the input shaft, and disposed between the input shaft and the externally toothed gear wheel; a guide protrusion provided in the case to protrude parallel to the input shaft to guide sliding of the recess; and a guide portion provided between the externally toothed gear wheel and the guide plate to guide movement of the externally toothed gear wheel relative to the guide plate, thereby guiding the externally toothed gear wheel so as to be revolvable but non-rotatable in cooperation with the recess and the protrusion.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: February 19, 2019
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Masao Noguchi, Toshiaki Nagata
  • Publication number: 20190013944
    Abstract: A radio transmission device includes: an information acquisition unit to externally acquire information data; an encryptor to encrypt the information data using one of a plurality of encryption processes used for encryption to generate transmission data; a radio field intensity setter having a different setting for each of the plurality of encryption processes used for encryption, the radio field intensity setter setting a radio field intensity at which the transmission data is to be transmitted; and a transmitter to transmit the transmission data at the set radio field intensity.
    Type: Application
    Filed: July 7, 2016
    Publication date: January 10, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Saki NAKATSUMA, Kazuhiko YAMADA, Masao NOGUCHI
  • Patent number: 10109556
    Abstract: Apparatuses for coupling a semiconductor device to a cooling system, methods of coupling a semiconductor device to a cooling system, and systems incorporating the apparatuses are disclosed. An apparatus includes a first frame member coupled to the cooling system, a second frame member coupled via one or more fasteners to the first frame member, and a spring assembly disposed between the first frame member and the second frame member. The semiconductor device is disposed between the spring assembly and the second frame member.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: October 23, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Masao Noguchi
  • Patent number: 10065537
    Abstract: A seat reclining device includes: a reclining unit that includes a fixing member fixed to a seat cushion side and a rotating member fixed to the seat cushion side and supported by the fixing member to rotate freely, and that switches freely between a locked state and an unlocked state; a transmission lever supported by the fixing member to rotate freely on the same center as the fixing member; a release operation lever supported on the seat cushion side to rotate freely between lock operation and unlocking operation positions; a link which includes a protruding portion, in which each end portion of the link is supported by one of the transmission and release operation levers to rotate freely, and which switches the reclining unit from the locked state to the unlocked state; and a holding plate that includes an unlock holding portion.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: September 4, 2018
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Masao Noguchi, Hideo Nihommatsu, Yasuhiro Kojima
  • Patent number: 10052978
    Abstract: By a contact of an engagement portion of a second memory member to a circumferential wall portion of a first memory member, the engagement portion is restricted from moving in a radial direction in accordance with a lock operation of lock members. By an engagement of the circumferential wall portion of the first memory member with the engagement portion of the second memory member that is in contact with the circumferential wall portion, the first memory member integrally rotates with a first rotary member on a same axis of the first and second rotary members. In a state where a rotation limiting mechanism restricts the first memory member and the first rotary member from integrally rotating with each other, the first memory member allows the engagement portion to slide along a longitudinal direction of the circumferential wall portion.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: August 21, 2018
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Masao Noguchi, Hideo Nihonmatsu, Yasuhiro Kojima
  • Patent number: 10043731
    Abstract: A method for high temperature bonding of substrates may include providing a top substrate and a bottom substrate, and positioning an insert between the substrates to form a assembly. The insert may be shaped to hold at least an amount of Sn having a low melting temperature and a gap shaped to hold at least a plurality of metal particles having a high melting temperature greater than the low melting temperature. The assembly may be heated to below the low melting temperature and held for a first period of time. The assembly may further be heated to approximately the low melting temperature and held for a period of time at a temperature equal to or greater than the low melting temperature such that the amount of Sn and the amount of metal particles form one or more intermetallic bonds. The assembly may be cooled to create a bonded assembly.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: August 7, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Masao Noguchi
  • Patent number: 9928880
    Abstract: A system management device (1) includes: a data request transmission unit (5) which successively transmits data request signals (C5) to a management object system (50); a feature data extraction unit (6) which extracts feature data (D3) from data (D50) acquired by a data acquisition unit (3); an error information extraction unit (7) which extracts error information from the data; a feature data storage unit (8) which stores feature data at a time of occurrence of an error as error-occurrence-time feature data (D6) according to the error information; and a system control unit (9) which, each time the data is acquired, compares a status value included in the feature data (D3) in the acquired data with a status value included in the error-occurrence-time feature data (D6) already stored in the feature data storage unit (8) and performs control of the management object system (50) according to a result of the comparison.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: March 27, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Satoshi Michihata, Masao Noguchi, Kiyoyasu Maruyama
  • Patent number: 9912089
    Abstract: An electrical connector is disclosed having a terminal housing, a female terminal, and a holding protrusion. The female terminal is positioned in the terminal housing and has a terminal body into which a complementary male terminal may be inserted and extracted. The holding protrusion projects from the terminal body in a direction orthogonal to inserting and extracting directions, and is press-fitted in the terminal receiving terminal housing.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: March 6, 2018
    Assignees: Tyco Electronics Japan G.K., Toyota Jidosha Kabushiki Kaisha
    Inventors: Tetsuro Akiguchi, Kazuhiko Ueda, Natsuki Nozawa, Hitoshi Ozaki, Masao Noguchi, Arata Harada
  • Patent number: 9905532
    Abstract: Methods and systems of bonding substrates include disposing a low melting point material and one or more high melting point materials having a higher melting temperature than a melting temperature of the low melting point material between a first substrate and a second substrate to form a substrate assembly including a contacting surface comprising first and second areas; applying a first force at the first area; and applying heat to form a bond layer between the first and second substrates. A first formed porosity of the bond layer is aligned with the first area of the contacting surface. A second formed porosity of the bond layer is aligned with the second area of the contacting surface to which the first force was not applied, and the first formed porosity is different from the second formed porosity.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: February 27, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Masao Noguchi
  • Publication number: 20170363176
    Abstract: A speed reducer includes: a case; an input shaft rotationally driven by an electric motor and having an eccentric shaft portion; an externally toothed gear wheel rotatably supported on the eccentric shaft portion; an output shaft rotatably supported on the case coaxially with the input shaft and having an internally toothed gear wheel; a guide plate formed with a guide recess recessed parallel to the input shaft, and disposed between the input shaft and the externally toothed gear wheel; a guide protrusion provided in the case to protrude parallel to the input shaft to guide sliding of the recess; and a guide portion provided between the externally toothed gear wheel and the guide plate to guide movement of the externally toothed gear wheel relative to the guide plate, thereby guiding the externally toothed gear wheel so as to be revolvable but non-rotatable in cooperation with the recess and the protrusion.
    Type: Application
    Filed: June 20, 2017
    Publication date: December 21, 2017
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Masao NOGUCHI, Toshiaki NAGATA
  • Publication number: 20170327010
    Abstract: By a contact of an engagement portion of a second memory member to a circumferential wall portion of a first memory member, the engagement portion is restricted from moving in a radial direction in accordance with a lock operation of lock members. By an engagement of the circumferential wall portion of the first memory member with the engagement portion of the second memory member that is in contact with the circumferential wall portion, the first memory member integrally rotates with a first rotary member on a same axis of the first and second rotary members. In a state where a rotation limiting mechanism restricts the first memory member and the first rotary member from integrally rotating with each other, the first memory member allows the engagement portion to slide along a longitudinal direction of the circumferential wall portion.
    Type: Application
    Filed: September 29, 2015
    Publication date: November 16, 2017
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Masao NOGUCHI, Hideo NIHONMATSU, Yasuhiro KOJIMA
  • Publication number: 20170263586
    Abstract: Methods and systems of bonding substrates include disposing a low melting point material and one or more high melting point materials having a higher melting temperature than a melting temperature of the low melting point material between a first substrate and a second substrate to form a substrate assembly including a contacting surface comprising first and second areas; applying a first force at the first area; and applying heat to form a bond layer between the first and second substrates. A first formed porosity of the bond layer is aligned with the first area of the contacting surface. A second formed porosity of the bond layer is aligned with the second area of the contacting surface to which the first force was not applied, and the first formed porosity is different from the second formed porosity.
    Type: Application
    Filed: March 9, 2016
    Publication date: September 14, 2017
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Masao Noguchi
  • Publication number: 20170256516
    Abstract: A system of bonded substrates may include a first substrate, a second substrate, and a bonding layer. The first substrate may include a bonding surface, wherein a geometry of the bonding surface of the first substrate includes a plurality of microchannels. The second substrate may include a complementary bonding surface. The bonding layer may be positioned between the first substrate and the second substrate, wherein the bonding layer may fill the microchannels of the first substrate and may contact substantially the entire bonding surface of the first substrate. The bonding layer may include a metal.
    Type: Application
    Filed: May 18, 2017
    Publication date: September 7, 2017
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Masao Noguchi