Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: In manufacturing of a solar cell module in which a solar cell having a surface electrode to which a tab lead is connected is sealed with a resin, the step of connecting the tab lead and the step of sealing the solar cell with the resin are performed simultaneously at a relatively low temperature that is used for the resin sealing step. To perform these steps simultaneously, the solar cell having the surface electrode to which the tab lead is connected with an adhesive is resin-sealed using a vacuum laminator to manufacture the solar cell module. The vacuum laminator used includes a first chamber and a second chamber partitioned by a flexible sheet. The internal pressures of these chambers can be controlled independently, and a heating stage for heating is provided in the second chamber.

Abstract: Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.

Abstract: A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization.

Abstract: Screen data is generated by a screen generating processor (74) of a control host computer (7) and transmitted to a programmable display apparatus (5). In accordance with the screen data, the programmable display apparatus (5) inquires a PLC (3) or the like about a state of a device (21), so as to update the display or transmit a control instruction depending on an input result. On the other hand, a control host computer (7) has a public server section (77) to transmit to a client apparatus (9) via the Internet an applet, which is generated by a compiler (76) compiling the screen data. The client apparatus (9) executes the applet to transmit to the public server section (77) an or the control instruction inquiry similar to those the programmable display apparatus (5) makes. In this way, the display is updated in accordance with a response.

Abstract: Screen data is generated by a screen generating processor (74) of a control host computer (7) and transmitted to a programmable display apparatus (5). In accordance with the screen data, the programmable display apparatus (5) inquires a PLC (3) or the like about a state of a device (21), so as to update the display or transmit a control instruction depending on an input result. On the other hand, a control host computer (7) has a public server section (77) to transmit to a client apparatus (9) via the Internet an applet, which is generated by a compiler (76) compiling the screen data. The client apparatus (9) executes the applet to transmit to the public server section (77) an or the control instruction inquiry similar to those the programmable display apparatus (5) makes. In this way, the display is updated in accordance with a response.

Abstract: A power supply device is provided that includes a battery module 3 and a cooling mechanism. The battery module is composed of a plurality of batteries 20 arranged side by side. The cooling mechanism cools the batteries 20. A thermally-insulating member 70 is arranged on a part of a battery module surface, and thermally insulates heat generated from the batteries 3. This power supply device can reduce the temperature unevenness ?T.

Abstract: A power supply device includes rectangular battery cells 1, resin separators 2, end spacers 17, thick metal end plates 10, and coupling members 11. The separator 2 is inserted between the cells 1 to insulate adjacent cells 1 from each other, and in thermal contact with the cells 1. The end spacers 17 cover end battery cells 1 on the opposed end surfaces of a battery block composed of the cells 1 and the separators 2 alternately arranged. The end plates 10 cover the surfaces of the end spacers 17. The coupling members 11 couple the end plates 10 to each other. The separators 2 form gaps 4 for flowing air along the surfaces of the cells 1 in contact with the separators 2. The end spacers 17 have hollow layers 18 on their surfaces in contact with the cells 1, and define closed chambers.

Abstract: Screen data is generated by a screen generating processor (74) of a control host computer (7) and transmitted to a programmable display apparatus (5). In accordance with the screen data, the programmable display apparatus (5) inquires a PLC (3) or the like about a state of a device (21), so as to update the display or transmit a control instruction depending on an input result. On the other hand, a control host computer (7) has a public server section (77) to transmit to a client apparatus (9) via the Internet an applet, which is generated by a compiler (76) compiling the screen data. The client apparatus (9) executes the applet to transmit to the public server section (77) an or the control instruction inquiry similar to those the programmable display apparatus (5) makes. In this way, the display is updated in accordance with a response.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: The battery system comprises battery blocks 3 having a plurality of battery cells 1 stacked with cooling gaps 4 established between the battery cells 1 to pass cooling gas; ventilating ducts 5, which are supply ducts 6 and exhaust ducts 7, disposed on both sides of the battery blocks to forcibly ventilate the cooling gaps; and ventilating apparatus 9 to force cooling gas to flow through the ventilating ducts. Cooling gas forcibly introduced by the ventilating apparatus 9 flows from the supply ducts 6 through the cooling gaps 4 and into the exhaust ducts 7 to cool the battery cells. In addition, the battery system has temperature equalizing walls 8 disposed in the supply ducts 6. The temperature equalizing walls 8 are long and narrow with length in the direction of flow greater than the width, and each temperature equalizing wall 8 gradually narrows towards the upstream end.

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.

Abstract: A half cut portion is provided with a receiving base for receiving a tube, and a cutter for cutting the tube. The receiving base is provided with a stroke adjusting lever on an upper portion of the receiving base, and the stroke adjusting lever is provided with a cam face in which an amount of projecting is varied by being rotated. The cutter butts to the cam face and a depth of a half cut is set according to a displacement of the amount of projecting of the cam face from the receiving base.

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract: A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization.