Abstract: A lamination includes: a substrate made of a metal or an alloy; an intermediate layer formed on a surface of the substrate and made of nickel or an alloy including nickel; and a metal film formed by accelerating, towards a surface of the intermediate layer, a powder material of aluminum or an aluminum alloy together with a gas heated to a temperature lower than a melting point of the powder material and spraying the powder material in a solid phase to the intermediate layer and causing the powder material to be deposited on the intermediate layer.

Abstract: A conductive member includes: a conductive member main body portion that has Vickers hardness equal to or greater than 100Hv and is made of copper or a copper alloy; and a film layer that is formed on an end face of the conductive member main body portion and is made of aluminum or an aluminum alloy. The film layer is formed by accelerating a powder material of aluminum or an aluminum alloy together with a gas heated to a temperature lower than a melting point of the powder material, spraying the powder material still remaining in a solid phase onto an end face of the conductive member main body portion, and causing the powder material to be deposited thereon.

Abstract: A lamination includes a substrate formed of a metal or alloy, an intermediate layer formed on a surface of the substrate and is formed of a metal or alloy that is softer than the substrate, and a metal film deposited by accelerating a powder material of a metal or alloy together with a gas heated to a temperature lower than the melting point of the powder material and spraying it onto the intermediate layer while keeping it in a solid phase.

Abstract: A pipe embedded structure includes: a pipe made of a metal or an alloy, and having a periphery forming a circular shape; a base material made of a metal or an alloy, including a recessed portion having an inner wall on which a part of the periphery abuts and in which the pipe is fitted; and a deposited layer formed by accelerating powder formed of a metal or an alloy together with a gas in a state where the pipe is fitted into the recessed portion, and spraying and depositing the powder on surfaces of the pipe and the base material while maintaining a solid phase state of the powder, wherein a ratio h/R of a protruding amount h by which the pipe protrudes from the surface of the base material and a curvature R of the periphery is not smaller than 0.3 and not greater than 0.7.

Abstract: A pipe buried structure includes: a pipe whose outer periphery on a cross section has a flattened shape obtained by curving both ends in a longitudinal direction; a base material including a concave portion to which the pipe is fitted, the concave portion having an inner wall which abuts a portion corresponding to the longitudinal direction of the outer periphery; and a deposition layer formed by accelerating powder made of metal or alloy together with gas to spray and deposit the powder in a solid phase state on surfaces of the pipe and the base material in a state in which the pipe is fitted to the concave portion, wherein a ratio h/R between a protruding amount h by which the pipe protrudes from the surface of the base material and a curvature R at the both ends is not smaller than 0.25 and not larger than 0.5.

Abstract: A heat dissipation structure includes a ceramic substrate having an insulation quality, a metal member containing a metal or an alloy and joined to a surface of the ceramic substrate by a brazing material, a metal film layer formed by accelerating a powder containing a metal or an alloy with a gas and by spraying and depositing the powder in a solid phase state on a surface of the metal member, and a heat pipe that is in a rod shape and capable of controlling a temperature and comprises a heat absorbing unit configured to absorb heat from outside at one end of the heat pipe and a heat dissipating unit configured to dissipate heat to the outside at another end of the heat pipe, wherein the heat absorbing unit is embedded inside the metal film layer.

Abstract: A lamination includes: a substrate formed of aluminum or aluminum alloy; an intermediate layer formed of any one metal or nonmetal selected from the group consisting of silver, gold, chromium, iron, germanium, manganese, nickel, silicon, and zinc, or an alloy containing the any one metal, on a surface of the substrate; and a film layer formed by accelerating powder material of copper or copper alloy together with gas heated to a temperature lower than a melting point of the powder material and spraying and depositing a solid-phase powder material onto a surface of the intermediate layer.

Abstract: A lamination includes a substrate formed of a metal or alloy, an intermediate layer formed on a surface of the substrate and is formed of a metal or alloy that is softer than the substrate, and a metal film deposited by accelerating a powder material of a metal or alloy together with a gas heated to a temperature lower than the melting point of the powder material and spraying it onto the intermediate layer while keeping it in a solid phase.

Abstract: It is possible to obtain a laminate having high adhesion strength between ceramic and a metal coating by providing the following: an insulating ceramic substrate; an intermediate layer formed on the surface of the ceramic substrate and having a metal-containing principal component metal layer and an active ingredient layer including metal, a metal oxide, or a metal hydride; and a metal coating formed on the surface of the intermediate layer by accelerating a metal-containing powder with gas, and depositing the same on the surface thereof by spraying while in a solid state.