Abstract: An image forming apparatus includes an image carrier to carry a toner image, intermediate, primary, and secondary transfer members, and a voltage application member. The voltage application member applies a voltage to the image carrier. The secondary transfer member is in contact with an outer circumferential surface of the intermediate transfer member. The toner image carried on the image carrier is primarily transferred onto the intermediate transfer member in a state where the voltage application member applies the voltage to the image carrier. The intermediate transfer member has a volume resistivity from 5×107 ?·cm to 2×1011 ?·cm inclusive. A relation ?s1/?s2?1.5 is satisfied, where ?s1 denotes a surface resistivity which is measured from the outer circumferential surface of the intermediate transfer member and ?s2 denotes a surface resistivity which is measured from an inner circumferential surface of the intermediate transfer member.

Abstract: There is provided a three-dimensional object printing apparatus including an imaging device fixed to a base and imaging an object located inside an imaging range, a first robot supporting a head having a nozzle for discharging a liquid and changing a position and a posture of the head, and a second robot supporting a three-dimensional workpiece and changes a position and a posture of the workpiece. The three-dimensional object printing apparatus performs a material feeding step of causing the second robot to move the workpiece from an outside to an inside of the imaging range, and a printing step of causing the head to discharge the liquid to the workpiece while at least one of the first robot and the second robot relatively moves the head and the workpiece inside the imaging range.

Abstract: [Problem] To provide a cross-polymer having excellent softness, tensile properties, transparency and anti-blocking properties, and a medical single-layer tube using the same. [Solution] A cross-copolymer containing, by 75-95 mass %, main chains comprising aromatic vinyl/olefin-based copolymers comprising 8.99-15.99 mol % of aromatic vinyl monomer units, 84-91 mol % of olefin monomer units and 0.01-0.5 mol % of aromatic polyene monomer units; and by 5-25 mass %, cross-chains comprising polymers comprising aromatic vinyl monomer units; wherein, based on differential scanning calorimetry (DSC) in which the cross-copolymer is cooled to ?50° C. in a 30 mL/min nitrogen flow, then heated to 180° C. at a temperature increase rate of 10° C./min, re-cooled to ?50° C., and heated to 180° C. at a temperature increase rate of 10° C./min, the cross-copolymer has a top temperature of melting peak of 60-80° C., and a heat of fusion of 45-75 J/g, as calculated from the area of the DSC curve between ?20° C. and 130° C.

Abstract: [Problem] To provide a thermoplastic elastomer resin composition that excels in tensile breaking strength, softness, oil resistance and scratch resistance, and that has good heat fusion ability with respect to polyolefin resins. [Solution] A thermoplastic elastomer resin composition consisting of: 15 to 89 mass % of a cross-copolymer having a polymer consisting of aromatic vinyl monomer units as a cross-chain structure on an aromatic vinyl-olefin-aromatic polyene copolymer main chain consisting of 9.99 to 29.99 mol % of aromatic vinyl monomer units, 70 to 90 mol % of olefin monomer units and 0.01 to 0.5 mol % of aromatic polyene monomer units; 1 to 55 mass % of a hydrogenated block copolymer; and 10 to 60 mass % of a polypropylene resin.

Abstract: A multiprocessor system includes plural processing parts configured to execute a program stored in a program memory; a common resource shared by the processing parts; a resource status table in which an occupation status of the common resource is written; a resource access table in which address areas are associated with occupation manners of the common resource on a function basis of the program stored in the program memory; and a controlling part configured to determine whether to permit execution of a function which involves occupation of the common resource by one of the processing parts using the resource status table and the resource access table.

Abstract: To provide a novel cross copolymer and resin composition which are improved in heat resistance and compatibility over conventional ethylene/aromatic vinyl compound copolymers and which have low crystallinity, are excellent in softness, transparency and compatibility and show mechanical properties similar to soft vinyl chloride resins, as compared with conventional cross copolymers.

Abstract: A multiprocessor system includes plural processing parts configured to execute a program stored in a program memory; a common resource shared by the processing parts; a resource status table in which an occupation status of the common resource is written; a resource access table in which address areas are associated with occupation manners of the common resource on a function basis of the program stored in the program memory; and a controlling part configured to determine whether to permit execution of a function which involves occupation of the common resource by one of the processing parts using the resource status table and the resource access table.

Abstract: Disclosed is a thermoplastic resin composition comprising a cross-copolymer which meets specific requirements; and a polyphenylene ether resin, wherein the cross-copolymer is contained in an amount of 5 to 95 mass % and the polyphenylene ether resin is contained in an amount of 95 to 5 mass %. The thermoplastic resin composition has excellent heat resistant, excellent softness, excellent flexibility, excellent stretching properties, and excellent scratch-abrasion resistance.

Abstract: Disclosed is a thermoplastic resin composition comprising a cross-copolymer which meets specific requirements; and a polyphenylene ether resin, wherein the cross-copolymer is contained in an amount of 5 to 95 mass % and the polyphenylene ether resin is contained in an amount of 95 to 5 mass %. The thermoplastic resin composition has excellent heat resistant, excellent softness, excellent flexibility, excellent stretching properties, and excellent scratch-abrasion resistance.

Abstract: To provide a novel cross copolymer and resin composition which are improved in heat resistance and compatibility over conventional ethylene/aromatic vinyl compound copolymers and which have low crystallinity, are excellent in softness, transparency and compatibility and show mechanical properties similar to soft vinyl chloride resins, as compared with conventional cross copolymers.

Abstract: Provided are a tape substrate having excellent oil resistance as well as balanced properties of flexibility, a hand cutting property and heat resistance, and an adhesive tape using the tape substrate. The tape substrate contains an ethylene-aromatic vinyl compound copolymer with an isotactic stereoregularity. Furthermore, the ethylene-aromatic vinyl compound copolymer is one having an alternating structure of ethylene and the aromatic vinyl compound represented by the formula (1) below, and an isotactic diad index m of Ph (an aromatic group) in the structure of the copolymer being more than 0.75: where Ph is an aromatic group and xa is the number of repeating units and an integer of at least 2.

Abstract: A semiconductor device includes a current mirror circuit having a plurality of transistors; a current source configured to supply a constant reference current to the current mirror circuit through a node; and a compensating circuit configured to supply a compensation current to the node to compensate for at least a part of gate leakage currents of the plurality of transistors. The compensating circuit may supply the compensation current equal to a summation of the gate leakage currents.

Abstract: A semiconductor device includes a current mirror circuit having a plurality of transistors; a current source configured to supply a constant reference current to the current mirror circuit through a node; and a compensating circuit configured to supply a compensation current to the node to compensate for at least a part of gate leakage currents of the plurality of transistors. The compensating circuit may supply the compensation current equal to a summation of the gate leakage currents.

Abstract: A semiconductor device includes a current mirror circuit having a plurality of transistors; a current source configured to supply a constant reference current to the current mirror circuit through a node; and a compensating circuit configured to supply a compensation current to the node to compensate for at least a part of gate leakage currents of the plurality of transistors. The compensating circuit may supply the compensation current equal to a summation of the gate leakage currents.

Abstract: In an automotive headlamp 10, a lens flange portion 24 is caused to extend from a circumferential edge 23 of a lens surface 18 formed into a configuration which follows the outline of an external surface 19 of a vehicle body toward a lamp housing 11, a surface-roughening process is applied to a surface 25 of an end portion of the lens flange portion 24 to make irregular the surface 25 of the end portion, and a leg portion 28 is caused to extend from a location 27 which deviates from the surface 25 of the end portion in such a manner as to bypass the surface 25 of the end portion, so that the leg portion 28 fits in the lamp housing 11.