Patents by Inventor Masashi Kaji

Masashi Kaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210283246
    Abstract: An examination system that recognizes a glycosylated antigen in Dane particles of hepatitis B virus (HBV) and a neutralizing antibody that recognizes the glycosylated antigen and that exhibits an infection-inhibiting activity. It was elucidated that Dane particles are associated with specific glycan structures, and this enabled the construction of a new detection system for infectious, i.e., nucleic acid-containing, hepatitis B virus particles and the provision of a neutralizing antibody that recognizes a glycosylated antigen and that exhibits an infection-inhibiting activity.
    Type: Application
    Filed: June 6, 2019
    Publication date: September 16, 2021
    Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, UNIVERSITY OF TOYAMA
    Inventors: Hisashi NARIMATSU, Kiyohiko ANGATA, Hiroyuki KAJI, Atsushi KUNO, Takashi SATO, Yasunori CHIBA, Akira TOGAYACHI, Hiroki SHIMIZU, Maki SOGABE, Takanori WAGATSUMA, Masashi MIZOKAMI, Masaaki KORENAGA, Kazuto TAJIRI, Tatsuhiko OZAWA
  • Publication number: 20190176762
    Abstract: A heater includes a heat generation element which includes a heater wire which spreads in a planar manner, and a metal plate serving as a heat dissipation element which includes a material having a high thermal conductivity, which is placed on a vehicle windowpane side of the heat generation element, which is heated by heat from the heat generation element, and which irradiates heat to the vehicle windowpane side. The vehicle windowpane is heated by the heat irradiated from the metal plate serving as the heat dissipation element.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 13, 2019
    Inventors: Kenichi OOJI, Hitoshi SHIMADA, Kazuya SHIBATA, Noritaka TERASAWA, Masashi KAJI
  • Patent number: 10126548
    Abstract: In a vehicle mirror, a heat generating body of a heater generates heat so as to heat a mirror body. A central side portion and an outer peripheral side portion of the heat generating body configure a thick portion and a thin portion, and the thin portion generates a smaller amount of heat than the thick portion, such that a heating density of the mirror body by the heat generating body is lower on an outer peripheral side portion of the mirror body than at a central side portion of the mirror body. Accordingly, the temperature of an outer peripheral portion of the mirror body can be suppressed from rising suddenly on progression from the outer peripheral side toward the central side of the mirror body, thereby enabling stress arising in the outer peripheral portion of the mirror body to be suppressed.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: November 13, 2018
    Assignees: KABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO, TOKYO COSMOS ELECTRIC CO., LTD
    Inventors: Masakazu Aoki, Masashi Kaji
  • Publication number: 20160214537
    Abstract: In a vehicle mirror, a heat generating body of a heater generates heat so as to heat a mirror body. A central side portion and an outer peripheral side portion of the heat generating body configure a thick portion and a thin portion, and the thin portion generates a smaller amount of heat than the thick portion, such that a heating density of the mirror body by the heat generating body is lower on an outer peripheral side portion of the mirror body than at a central side portion of the mirror body. Accordingly, the temperature of an outer peripheral portion of the mirror body can be suppressed from rising suddenly on progression from the outer peripheral side toward the central side of the mirror body, thereby enabling stress arising in the outer peripheral portion of the mirror body to be suppressed.
    Type: Application
    Filed: January 21, 2016
    Publication date: July 28, 2016
    Inventors: Masakazu AOKI, Masashi KAJI
  • Patent number: 9309481
    Abstract: A lubricant oil composition which is excellent in deposition resistance, corrosion resistance and wear resistance, despite its low phosphorus content and low sulfuric acid ash content, is provided by using a succinimide compound in combination with at least one selected from specific sulfur-containing compounds, specific heterocyclic compounds and reaction products thereof.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: April 12, 2016
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Hideki Kamano, Masashi Kaji
  • Patent number: 8816038
    Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: August 26, 2014
    Assignee: Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Patent number: 8546510
    Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: October 1, 2013
    Assignee: Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Masashi Kaji, Koichiro Ogami, Kazuhiko Nakahara, Tomomi Fukunaga
  • Publication number: 20130129264
    Abstract: A lubricant oil composition containing an organic molybdenum compound which contains at least either one of a nitrogen (N) atom and an oxygen (O) atom in the molecule thereof and which may optionally contain a sulfur (S) atom, wherein a sulfur content of the organic molybdenum compound is 0.5% by mass or less based on the organic molybdenum compound. The lubricant oil composition, when used as a lubricant oil for a low-friction sliding material, exhibits an extremely low friction coefficient. A sliding mechanism having excellent low-friction property and wear resistance can be provided by combining the lubricant oil composition and a sliding member having a DLC film on its sliding face.
    Type: Application
    Filed: June 1, 2011
    Publication date: May 23, 2013
    Applicants: NIPPON ITF, INC., IDEMITSU KOSAN CO., LTD.
    Inventors: Nobuaki Watanabe, Masashi Kaji, Masanori Tsujioka, Koji Miyake
  • Publication number: 20130005624
    Abstract: A lubricant oil composition which is excellent in deposition resistance, corrosion resistance and wear resistance, despite its low phosphorus content and low sulfuric acid ash content, is provided by using a succinimide compound in combination with at least one selected from specific sulfur-containing compounds, specific heterocyclic compounds and reaction products thereof.
    Type: Application
    Filed: March 10, 2011
    Publication date: January 3, 2013
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Hideki Kamano, Masashi Kaji
  • Patent number: 8268940
    Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: September 18, 2012
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Akira Mori, Kiwamu Tokuhisa, Kazuhiko Nakahara, Masashi Kaji
  • Publication number: 20100063217
    Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
    Type: Application
    Filed: March 6, 2008
    Publication date: March 11, 2010
    Inventors: Akira Mori, Kiwamu Tokuhisa, Kazuhiko Nakahara, Masashi Kaji
  • Publication number: 20100016498
    Abstract: Disclosed is an epoxy resin composition that cures with high thermal conductivity and low thermal expansion and is capable of dissipating heat efficiently and displaying good dimensional stability when applied to encapsulation of semiconductor devices or to printed wiring boards. The epoxy resin composition is formulated from epoxy resins 50 wt % or more of which is a diphenyl ether type epoxy resin represented by the following general formula (1) (wherein n is a number of ?0 and m is an integer of 1-3) and curing agents 20 wt % or more of which is a diphenyl ether type phenolic resin represented by the following general formula (2) (wherein n is a number of ?0 and m is an integer of 1-3).
    Type: Application
    Filed: May 8, 2006
    Publication date: January 21, 2010
    Inventors: Masashi Kaji, Koichiro Ogami, Kazuhiko Nakahara
  • Publication number: 20100016473
    Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.
    Type: Application
    Filed: November 8, 2007
    Publication date: January 21, 2010
    Applicant: NIPPON STEEL CHEMICAL CO., LTD
    Inventors: Masashi Kaji, Koichiro Ogami, Kazuhiko Nakahara, Tomomi Fukunaga
  • Publication number: 20090036631
    Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.
    Type: Application
    Filed: January 10, 2007
    Publication date: February 5, 2009
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Patent number: 7259213
    Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: August 21, 2007
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Masashi Kaji, Hisashi Yamada
  • Publication number: 20050131167
    Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.
    Type: Application
    Filed: February 10, 2003
    Publication date: June 16, 2005
    Inventors: Masashi Kaji, Hisashi Yamada
  • Patent number: 6903180
    Abstract: This invention relates to novel epoxy resins and epoxy resin compositions comprising said epoxy resins or cured articles thereof. The cured articles have excellent properties in respect to flame retardance, adhesiveness, moisture resistance and heat resistance and can be used in applications such as lamination, molding, casting and adhesion. The epoxy resins of this invention are represented by the following formula (3) wherein Y1 denotes a glycidyloxyarylmethyl group represented by —CH2—Ar—OG, Y2 and Y3 denote independently a glycidyl group or the aforementioned glycidyloxyarylmethyl group, Ar denotes a phenylene group which can be substituted with up to two hydrocarbon groups and G denotes a glycidyl group.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: June 7, 2005
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Publication number: 20030069357
    Abstract: This invention relates to an aromatic oligomer which is useful as a modifier of epoxy resin compositions, to a phenolic resin composition comprising said aromatic oligomer and to an epoxy resin composition comprising said aromatic oligomer and is useful for encapsulating electric and electronic parts and as a circuit board material. The aromatic oligomer of this invention is obtained by polymerizing monomers mainly consisting of aromatic olefins comprising 20 wt % or more of acenaphthylenes and shows a softening point of 80-250° C. The phenolic resin composition or epoxy resin composition of this invention is obtained by incorporating 3-200 parts by weight of the aromatic oligomer per 100 parts by weight of phenolic resin or epoxy resin. The cured epoxy resin of this invention is obtained by curing the epoxy resin composition.
    Type: Application
    Filed: October 8, 2002
    Publication date: April 10, 2003
    Inventors: Masashi Kaji, Kiyokazu Yonekura
  • Patent number: 5834570
    Abstract: An epoxy resin composition of this invention is obtained by solidifying epoxy resins represented by the following general formula (1) (wherein G is glycidyl group and R.sup.1 to R.sup.8 are hydrogen atoms, halogen atoms or hydrocarbon groups with 1 to 6 carbon atoms, and n is an integer of 0 to 10) by crystallization and adding epoxy resin curing agents to the resulting solid. It shows good flow and low moisture absorption, cures with excellent heat resistance at soldering temperature and is useful for a variety of applications, in particular, for encapsulating semiconductor devices.
    Type: Grant
    Filed: August 27, 1997
    Date of Patent: November 10, 1998
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Masashi Kaji, Takanori Aramaki, Kazuhiko Nakahara, Hisayuki Nagino
  • Patent number: 5223602
    Abstract: This invention relates to naphthol aralkyl resins of the general formula (I) ##STR1## in which A is a naphthalene nucleus, R is hydrogen or methyl, and n is an integer from 0 to 15 and cured products thereof, which are highly heat- and moisture-resistant, possess excellent impact strength and other mechanical properties, and are useful for such applications as lamination, molding, casting, and adhesion.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: June 29, 1993
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Masashi Kaji, Takanori Aramaki, Norito Nakahara, Yasuharu Yamada