Patents by Inventor Masashi KATAKAI

Masashi KATAKAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10043726
    Abstract: An embedded component substrate includes: a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer therebetween; and a second electrode provided on a bottom surface of the core layer with a second insulating layer therebetween, wherein a cavity is formed in the embedded component substrate from a top surface thereof to expose the second insulating layer at a bottom of the cavity, wherein a placement region is defined on the bottom of the cavity, for accommodating an electronic component; and wherein the embedded component substrate further includes a pad electrode on a portion of the second insulating layer, exposed by the cavity, surrounding the placement region located on the bottom of the cavity, the pad electrode vertically protruding from a top surface of the exposed second insulating layer upwardly and being configured to electrically connect to the electronic component.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: August 7, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yutaka Hata, Masashi Katakai
  • Publication number: 20160293537
    Abstract: An embedded component substrate includes: a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer therebetween; and a second electrode provided on a bottom surface of the core layer with a second insulating layer therebetween, wherein a cavity is formed in the embedded component substrate from a top surface thereof to expose the second insulating layer at a bottom of the cavity, wherein a placement region is defined on the bottom of the cavity, for accommodating an electronic component; and wherein the embedded component substrate further includes a pad electrode on a portion of the second insulating layer, exposed by the cavity, surrounding the placement region located on the bottom of the cavity, the pad electrode vertically protruding from a top surface of the exposed second insulating layer upwardly and being configured to electrically connect to the electronic component.
    Type: Application
    Filed: March 23, 2016
    Publication date: October 6, 2016
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi SUGIYAMA, Masashi MIYAZAKI, Yutaka HATA, Masashi KATAKAI