Patents by Inventor Masashi Miyazaki

Masashi Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210132764
    Abstract: To realize a display device with a built-in touch sensor, the display device having a small-scale circuit and being capable of performing accurate touch detection even when an operation means except for a finger (e.g., stylus pen) is in use. When a detection target is an operation means except for a finger (e.g., stylus pen), touch detection is performed in a first scanning period in a state where each a plurality of sensor electrodes arranged side by side in a first direction (e.g., a direction in which scanning signal lines extend) are connected electrically, and touch detection is performed in a second scanning period in a state where each a plurality of sensor electrodes arranged side by side in a second direction (e.g., a direction in which video signal lines extend) are connected electrically.
    Type: Application
    Filed: July 6, 2018
    Publication date: May 6, 2021
    Inventors: MASASHI MAYUMI, SHINICHI MIYAZAKI
  • Publication number: 20210126284
    Abstract: A halide solid electrolyte material according to the present disclosure is represented by the chemical formula Li6-4b+2ab(Zr1-aMa)bX6 (I), wherein M denotes at least one element selected from the group consisting of Mg, Ca, Sr, Ba, and Zn, X denotes at least one halogen element, and two mathematical formulae 0<a<1 and 0<b<1.5 are satisfied.
    Type: Application
    Filed: December 10, 2020
    Publication date: April 29, 2021
    Inventors: MASASHI SAKAIDA, TETSUYA ASANO, AKIHIRO SAKAI, YUSUKE NISHIO, AKINOBU MIYAZAKI
  • Patent number: 10957652
    Abstract: A circuit board includes a core layer including a plurality of metal layers laminated one over another, a bottommost metal layer of the plurality of metal layers being thickest, and a topmost metal layer of the plurality of metal layer being thinnest; an upper insulating layer and an upper conductive pattern provided over a top surface of the core layer; and a lower insulating layer and a lower conductive pattern provided below a bottom surface of the core layer, wherein the topmost metal layer of the core metal layer is patterned to have a prescribed shaped section that serves as wiring and that is connected to the upper conductive pattern, wherein a metal ratio that is defined as a ratio of an area that is formed of metal relative to an entire area in a plan view is higher in the bottommost metal layer than in the topmost metal layer.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: March 23, 2021
    Assignee: TAIYO YUDENCO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yoshiki Hamada
  • Patent number: 10939562
    Abstract: A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: March 2, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yutaka Hata, Hiroyuki Kobayashi
  • Patent number: 10840845
    Abstract: A vehicle drive control device that controls a vehicle drive device in which a first engagement device, a rotating electrical machine, and a second engagement device are provided in this order from an input side in a mechanical power transmission path connecting an input to an output, the input being drive-coupled to an internal combustion engine serving as a vehicle drive power source, and the output being drive-coupled to wheels, wherein each of the first engagement device and the second engagement device can be changed between an engaged state in which drive power is transmitted and a disengaged state in which drive power is not transmitted, the vehicle control device including an electronic control unit.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: November 17, 2020
    Assignee: AISIN AW CO., LTD.
    Inventors: Masakazu Sato, Yomei Hakumura, Masashi Miyazaki, Masayoshi Yanagida
  • Publication number: 20200315032
    Abstract: A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other
    Type: Application
    Filed: March 4, 2020
    Publication date: October 1, 2020
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi SUGIYAMA, Masashi MIYAZAKI, Yutaka HATA, Hiroyuki KOBAYASHI
  • Patent number: 10785876
    Abstract: An intermediate printed board has a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards, respectively. The intermediate printed board includes a metal core substrate including: a metal layer; and a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards; an insulating layer formed so as to cover a surface of the metal core substrate; and a conductive pattern formed on the insulating layer.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: September 22, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki
  • Patent number: 10742855
    Abstract: A circuit board includes a flexible wiring board having a first section in one end and a second section next to the first section in a plan view; a plate-shaped reinforcing member embedded in the flexible wiring board in the first section; and a first multilayer wiring layer on a top surface of the flexible wiring board in the first section, the first multilayer wiring layer having an opening that exposes a portion of a top surface of the reinforcing member for mounting a device thereon.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: August 11, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yutaka Hata
  • Publication number: 20200220479
    Abstract: An inverter control device that controls an inverter connected to a direct-current power supply and connected to an alternating-current rotating electrical machine to convert electric power between direct current and alternating current of a plurality of phases, the inverter control device including an electronic control unit that is configured to perform, in a state in which one switching element of a plurality of switching elements included in the inverter has a turn-off failure in which the switching element always goes into an off state, torque reduction control for reducing torque of the rotating electrical machine or deceleration control for outputting torque in a reverse direction from a rotation direction of the rotating electrical machine by performing switching control of the plurality of switching elements.
    Type: Application
    Filed: September 28, 2018
    Publication date: July 9, 2020
    Applicant: AISIN AW CO., LTD.
    Inventors: Masashi MIYAZAKI, Subrata SAHA, Isao FUJIWARA, Yuki SUGIYAMA
  • Publication number: 20200185332
    Abstract: A circuit board includes a core layer including a plurality of metal layers laminated one over another, a bottommost metal layer of the plurality of metal layers being thickest, and a topmost metal layer of the plurality of metal layer being thinnest; an upper insulating layer and an upper conductive pattern provided over a top surface of the core layer; and a lower insulating layer and a lower conductive pattern provided below a bottom surface of the core layer, wherein the topmost metal layer of the core metal layer is patterned to have a prescribed shaped section that serves as wiring and that is connected to the upper conductive pattern, wherein a metal ratio that is defined as a ratio of an area that is formed of metal relative to an entire area in a plan view is higher in the bottommost metal layer than in the topmost metal layer.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 11, 2020
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi SUGIYAMA, Masashi MIYAZAKI, Yoshiki HAMADA
  • Patent number: 10674601
    Abstract: A printed wiring board for camera module includes: first and second mounting regions for first and second image pickup devices respectively provided on one and the other sides in a front surface of the printed wiring board, the first and second mounting regions respectively provided with first and second conductive patterns configured to be electrically connected to the first and second image pickup devices, respectively, and a component mounting region provided between the first mounting region and the second mounting region, the component mounting region provided with a third conductive pattern, the third conductive pattern configured to be electrically connected to a signal processing component, amounting density of the third conductive pattern in the component mounting region being higher than that of the first conductive pattern in the first mounting region or a mounting density of the second conductive pattern in the second mounting region, in a plan view.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: June 2, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Hiroyuki Kobayashi
  • Patent number: 10607940
    Abstract: A semiconductor module includes a metal core layer that includes: a first metal layer and a second metal layer on the first metal layer, wherein a portion of the second metal layer is removed to expose a surface of the first metal layer, the removed portion of the second metal layer defining a cavity in the metal core layer having the exposed surface of the first metal layer as a bottom surface, and at least one of a side wall and the bottom surface of the cavity has a smoother surface profile than a surface of the first metal layer that is not exposed by the cavity and under the second metal layer; and a semiconductor element provided in the cavity, affixed to the bottom surface of the cavity with a fixing material containing a resin component.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: March 31, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yoshiki Hamada
  • Patent number: 10602608
    Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: March 24, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yutaka Hata
  • Publication number: 20200036315
    Abstract: A vehicle drive control device that controls a vehicle drive device in which a first engagement device, a rotating electrical machine, and a second engagement device are provided in this order from an input side in a mechanical power transmission path connecting an input to an output, the input being drive-coupled to an internal combustion engine serving as a vehicle drive power source, and the output being drive-coupled to wheels, wherein each of the first engagement device and the second engagement device can be changed between an engaged state in which drive power is transmitted and a disengaged state in which drive power is not transmitted, the vehicle control device including an electronic control unit
    Type: Application
    Filed: January 23, 2018
    Publication date: January 30, 2020
    Applicant: AISIN AW CO., LTD.
    Inventors: Masakazu SATO, Yomei HAKUMURA, Masashi MIYAZAKI, Masayoshi YANAGIDA
  • Publication number: 20200013690
    Abstract: Provided is a circuit board including: a metal core layer having a first main surface capable of supporting a mounting component and a second main surface which is opposite to the first main surface; a first exterior coating base material which is arranged facing the first main surface; and a second exterior coating base material which is arranged facing the second main surface and includes a heat dissipation layer having a via which is connected to the second main surface.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 9, 2020
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Yutaka HATA, Masashi MIYAZAKI, Yuichi SUGIYAMA
  • Patent number: 10499494
    Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape and is disposed closer to one of the pair of the wiring layers than to another of the pair of the wiring layers in a vertical direction.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: December 3, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi Sugiyama, Masashi Miyazaki, Yutaka Hata
  • Publication number: 20190104237
    Abstract: A circuit board includes a flexible wiring board having a first section in one end and a second section next to the first section in a plan view; a plate-shaped reinforcing member embedded in the flexible wiring board in the first section; and a first multilayer wiring layer on a top surface of the flexible wiring board in the first section, the first multilayer wiring layer having an opening that exposes a portion of a top surface of the reinforcing member for mounting a device thereon.
    Type: Application
    Filed: September 26, 2018
    Publication date: April 4, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi SUGIYAMA, Masashi MIYAZAKI, Yutaka HATA
  • Publication number: 20190069397
    Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 28, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi SUGIYAMA, Masashi MIYAZAKI, Yutaka HATA
  • Publication number: 20190069398
    Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape and is disposed closer to one of the pair of the wiring layers than to another of the pair of the wiring layers in a vertical direction.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 28, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi SUGIYAMA, Masashi MIYAZAKI, Yutaka HATA
  • Publication number: 20190053380
    Abstract: An intermediate printed board has a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards, respectively. The intermediate printed board includes a metal core substrate including: a metal layer; and a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards; an insulating layer formed so as to cover a surface of the metal core substrate; and a conductive pattern formed on the insulating layer.
    Type: Application
    Filed: August 6, 2018
    Publication date: February 14, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Yuichi SUGIYAMA, Masashi MIYAZAKI