Abstract: Provided is a measurement apparatus including a first timing detecting section that detects first change timings of a signal under measurement, a second timing detecting section that detects second change timings of the signal under measurement, a buffer section that buffers data indicating the first change timings detected by the first timing detecting section and data indicating the second change timings detected by the second timing detecting section, and a calculating section that acquires, from the buffer section, the data indicating the first change timings and the data indicating the second change timings, calculates a temporal relationship between the first change timings and the second change timings, and outputs the temporal relationship.

Abstract: Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 10 is characterized in that an insulation layer 16 is formed on either the top or bottom side of a metal core 11, while an opening 12 formed in the metal core 11 is used as a cavity area 15a for mounting a component, wherein a reinforcement pattern 30 is formed on the surface of an insulation layer facing the bottom of the cavity area 15a in the insulation layer 16. The reinforcement pattern 30 is made of the same material as the wiring patterns 28c, 29c formed on the insulation layer 16, and also formed simultaneously with these wiring patterns 28c, 29c.

Abstract: Provided is an apparatus comprising a delaying section that generates a plurality of delayed signals by delaying a single first input signal by different delay amounts; a first acquiring section that acquires each of a plurality of input second input signals at a first phase of a reference clock; a second acquiring section that acquires each of the plurality of second input signals at a second phase of the reference clock, which is different from the first phase; and a change point detecting section that detects a change point of one of the first input signal and a second input signal, based on values of the plurality of signals acquired by the first acquiring section and values of the plurality of signals acquired by the second acquiring section.

Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

Abstract: A method of manufacturing a semiconductor package, includes the steps of: forming a substrate on which a semiconductor chip is to be mounted; and mounting the semiconductor chip on the substrate through connection bumps, the substrate forming step including a first step of forming a plurality of electrode pads to be bonded to the connection bumps on a part of a support plate, a second step of forming one or more wiring layers on the support plate including the electrode pads with an insulation layer interposed between them, thereby forming a substrate having the electrode pads formed thereon on one side thereof, and a third step of removing the substrate from the support plate, wherein a plurality of first convex portions are formed on the support plate prior to the first step, and the electrode pads are formed on the first convex portions at the first step.

Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

Abstract: An encoding apparatus includes a receiving section receiving syntax information defined by an encoding standard, a first encoding section encoding the received syntax information to generate encoded information, a transferring section transferring transmission encoded information based on the encoded information generated by the first encoding section, a second encoding section encoding reproduced encoded information reproduced from the transferred transmission encoded information, a conversion section converting the encoded information encoded by the first encoding section into redefined encoded information, to generate the transmission encoded information in accordance with the transfer capacity of the transferring section and the processing speed of encoding in each of the first encoding section and the second encoding section so as not to cause delay in encoding in the first encoding section or the second encoding section, and an inverse conversion section inversely converting the converted redefined enco

Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

Abstract: Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.

Abstract: Provided is a measurement apparatus comprising a first timing detecting section that detects first change timings of a signal under measurement; a second timing detecting section that detects second change timings of the signal under measurement; a buffer section that buffers data indicating the first change timings detected by the first timing detecting section and data indicating the second change timings detected by the second timing detecting section; and a calculating section that acquires, from the buffer section, the data indicating the first change timings and the data indicating the second change timings, calculates a temporal relationship between the first change timings and the second change timings, and outputs the temporal relationship.

Abstract: Provided is an apparatus comprising a delaying section that generates a plurality of delayed signals by delaying a single first input signal by different delay amounts; a first acquiring section that acquires each of a plurality of input second input signals at a first phase of a reference clock; a second acquiring section that acquires each of the plurality of second input signals at a second phase of the reference clock, which is different from the first phase; and a change point detecting section that detects a change point of one of the first input signal and a second input signal, based on values of the plurality of signals acquired by the first acquiring section and values of the plurality of signals acquired by the second acquiring section.

Abstract: The present invention is applied to a decoder based on the ITU-T H.264 method, for example, and detects continuous numbers of a syntax element of a specific value, such as a value 0, and decodes the syntax element on the basis of the detection result.

Abstract: In a client 20, an operation accepting section 22 obtains a primary address entered in an address entry field, and a transmitting section 21 sends the primary address to a mail server 10. In the mail server 10, a receiving section 19 receives the primary address; a message generating section 13 generates a message including out-of-office information corresponding to the primary address; and a transmitting section 11 sends the message to the client 20. In the client 20, a receiving section 29 receives the message, and a display section 24 displays an out-of-office message that a user corresponding to the primary address is away, and thereafter displays detailed information including buttons for setting an alternative address according to a click operation on a specific portion. An address updating section 26a displays an alternative address in the address entry field according to a button click operation.

Abstract: An electronic part-incorporated multilayer substrate is provided. The multi-layer substrate includes a core formed with a plurality of holes capable of containing an electronic part, a bottom insulating resin layer formed on a bottom surface of the core, a top insulating resin layer formed on a top surface of the core, a wiring layer selectively formed on an outer surface of the bottom insulating resin layer or top insulating resin layer, and an electronic part contained in any of the holes. Both of the bottom and top insulating resin layers have a structure that is a combination of a resin which is changed to cohesiveness when heated and which undergoes smaller plastic deformation when heated to a higher temperature and an insulating resin layer which has a thickness sufficient to maintain insulation between the electronic part or a conductor of the core and the wiring layer and which inherently undergoes small plastic deformation.

Abstract: Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.

Abstract: Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.

Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

Abstract: A multilayer printed wiring board (PWB) including via holes with satisfactory quality without defective shapes like swelling or recession on the end faces is provided. The multilayer PWB includes a build-up board of plural insulation layers as the main structure. In each of the insulation layers, via holes (columnar conductors) for electrically connecting between conductor circuits on the base layer or adjacent layers are formed. The via holes are formed by patterning metal foil with conductivity. The height “H” of the via holes (dimension in the thickness direction of the via hole forming layer) depends on the thickness “D” of the original metal foil only. Accordingly, the via holes can be formed without carrying out filling with conductive paste or electrolytic plating. Thus, multilayer PWB having via holes with satisfactory quality without defective shapes like swelling or recession on the end faces can be manufactured.

Abstract: A testing apparatus including a plurality of testing module slots to which different types of testing modules for testing a device under test are optionally mounted, includes an operation order holding unit for holding information indicating that a test operation by a first testing module should be performed before a test operation by a second testing module, a trigger return signal receiving unit for receiving a trigger return signal from the first testing module, the trigger return signal indicating that the first testing module has completed the test operation thereof, when the test operation of the first testing module has been completed, and a trigger signal supplying unit for supplying a trigger signal to the second testing module, the trigger signal indicating that the second testing module should start the test operation thereof, when the trigger return signal receiving unit receives the trigger return signal.