Abstract: A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.

Abstract: A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.

Abstract: A flat cable has a plurality of parallelly disposed fine-conductive wires and insulating wires. The conductive wires are divided by the insulating wires into channels which are respectively connected to terminals of different devices. The channels may be arranged easily by changing the interposing position of the insulating wires. Since the conductive wires have a fixed resistance, desired resistance may be obtained by only increasing or decreasing the number of the conductive wires in a channel.