Patents by Inventor Masato Sakata

Masato Sakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10292602
    Abstract: A blood flow index calculating method includes: obtaining, by a camera, an image capturing a first site of a living body and a second site of the living body; extracting an area of the first site of the living body and an area of the second site of the living body, by a processor; detecting a pulse wave pattern of the first site of the living body from the area of the first site of the living body and detecting a pulse wave pattern of the second site of the living body from the area of the second site of the living body, by the processor; first calculating a delay amount from the pulse wave pattern of the first site and the pulse wave pattern of the second site, by the processor; and second calculating an index related to blood flow by using the delay amount, by the processor.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: May 21, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Masato Sakata, Daisuke Uchida, Akihiro Inomata, Hidenori Sekiguchi
  • Patent number: 9986922
    Abstract: A pulse wave detection method includes obtaining an image obtained by photographing a subject with an imaging device, extracting intensities representative of signal components of a specific frequency band for respective wavelength components among signals of a plurality of wavelength components included in the image, calculating, using the intensities extracted for the respective wavelength components, a weight coefficient by which a signal is multiplied when the signals are calculated between the wavelength components to minimize an arithmetic value of the signal components in the specific frequency band after multiplication, multiplying at least one of the signals of the respective wavelength components by the weight coefficient, performing arithmetic operation on the signals between the wavelength components after multiplication by the weight coefficient, and detecting pulse waves of the subject using a signal after the arithmetic operation.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: June 5, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Daisuke Uchida, Masato Sakata, Hidenori Sekiguchi, Akihiro Inomata
  • Patent number: 9962126
    Abstract: A pulse wave detection apparatus detects a signal, and calculates a correlation coefficient between waveforms of the signal included in a first window and a second window having a predetermined duration, the correlation coefficient being smaller when a difference between dispersion of the amplitude value in the first window and dispersion of the amplitude value in the second window becomes larger.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: May 8, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Kazuho Maeda, Masato Sakata, Daisuke Uchida, Akihiro Inomata
  • Publication number: 20170112382
    Abstract: A pulse-wave detection device acquires an image. Furthermore, the pulse-wave detection device executes face detection on the image. Furthermore, the pulse-wave detection device sets the identical region of interest in the frame, of which the image is acquired, and the previous frame to the frame in accordance with a result of the face detection. Moreover, the pulse-wave detection device detects a pulse wave signal based on a difference in brightness obtained between the frame and the previous frame.
    Type: Application
    Filed: January 3, 2017
    Publication date: April 27, 2017
    Applicant: FUJITSU LIMITED
    Inventors: YASUYUKI NAKATA, Akihiro Inomata, Takuro Oya, Masato Sakata
  • Publication number: 20160007865
    Abstract: A blood flow index calculating method includes: obtaining, by a camera, an image capturing a first site of a living body and a second site of the living body; extracting an area of the first site of the living body and an area of the second site of the living body, by a processor; detecting a pulse wave pattern of the first site of the living body from the area of the first site of the living body and detecting a pulse wave pattern of the second site of the living body from the area of the second site of the living body, by the processor; first calculating a delay amount from the pulse wave pattern of the first site and the pulse wave pattern of the second site, by the processor; and second calculating an index related to blood flow by using the delay amount, by the processor.
    Type: Application
    Filed: September 23, 2015
    Publication date: January 14, 2016
    Inventors: Masato Sakata, DAISUKE UCHIDA, Akihiro Inomata, Hidenori Sekiguchi
  • Publication number: 20150173630
    Abstract: A pulse wave detection method includes obtaining an image obtained by photographing a subject with an imaging device, extracting intensities representative of signal components of a specific frequency band for respective wavelength components among signals of a plurality of wavelength components included in the image, calculating, using the intensities extracted for the respective wavelength components, a weight coefficient by which a signal is multiplied when the signals are calculated between the wavelength components to minimize an arithmetic value of the signal components in the specific frequency band after multiplication, multiplying at least one of the signals of the respective wavelength components by the weight coefficient, performing arithmetic operation on the signals between the wavelength components after multiplication by the weight coefficient, and detecting pulse waves of the subject using a signal after the arithmetic operation.
    Type: Application
    Filed: March 4, 2015
    Publication date: June 25, 2015
    Inventors: DAISUKE UCHIDA, Masato Sakata, Hidenori Sekiguchi, Akihiro Inomata
  • Publication number: 20140276114
    Abstract: A pulse wave detection apparatus detects a signal, and calculates a correlation coefficient between waveforms of the signal included in a first window and a second window having a predetermined duration, the correlation coefficient being smaller when a difference between dispersion of the amplitude value in the first window and dispersion of the amplitude value in the second window becomes larger.
    Type: Application
    Filed: December 6, 2013
    Publication date: September 18, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Kazuho MAEDA, Masato SAKATA, Daisuke UCHIDA, Akihiro INOMATA
  • Patent number: 8059640
    Abstract: A multistage switch control circuit allows unit switches to be set at a higher speed than conventional multistage switch control circuits. Higher-order half first and second control elements are connected to a first section of a bus to form a first cluster, while lower-order half third and fourth control elements are connected to a second section of the bus to form a second cluster. A bus switch which functions as a cluster formation means is arranged between the first section and the second section of the bus to perform the connection/separation of the first section and the second section. The first to fourth control elements transmit switch control signals to corresponding unit switches, respectively, in each stage.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: November 15, 2011
    Assignee: National University Corporation Akita University
    Inventors: Hitoshi Obara, Masato Sakata
  • Publication number: 20100098070
    Abstract: A multistage switch control circuit allows unit switches to be set at a higher speed than conventional multistage switch control circuits. Higher-order half first and second control elements are connected to a first section of a bus to form a first cluster, while lower-order half third and fourth control elements are connected to a second section of the bus to form a second cluster. A bus switch which functions as a cluster formation means is arranged between the first section and the second section of the bus to perform the connection/separation of the first section and the second section. The first to fourth control elements transmit switch control signals to corresponding unit switches, respectively, in each stage.
    Type: Application
    Filed: December 20, 2007
    Publication date: April 22, 2010
    Inventors: Hitoshi Obara, Masato Sakata
  • Patent number: 6963676
    Abstract: An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn—Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn—Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: November 8, 2005
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Satoru Zama, Toshio Mugishima, Kengo Mitose, Yoshikazu Tsuzuki, Masato Sakata
  • Publication number: 20050041934
    Abstract: An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn—Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn—Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.
    Type: Application
    Filed: September 27, 2004
    Publication date: February 24, 2005
    Applicant: The Furukawa Electric Co, Ltd.
    Inventors: Satoru Zama, Toshio Mugishima, Kengo Mitose, Yoshikazu Tsuzuki, Masato Sakata
  • Patent number: 6440778
    Abstract: An optical semiconductor element package including a housing, electric signal input and output wiring boards, and external leads. The housing has a metal frame and a metal bottom plate, for storing optical semiconductor elements. The electric signal input and output wiring boards are arranged in the housing at positions so that the optical semiconductor elements are not existent right above and right below the boards. The external leads are drawn to the outside through the side wall of the metal frame. The wiring boards are connected to the external leads and to the optical semiconductor elements by bonding wires. The input and output of an electric signal between the outside and the optical semiconductor elements are carried out through the bonding wires, the wiring boards and the external leads.
    Type: Grant
    Filed: July 11, 2000
    Date of Patent: August 27, 2002
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Takahiro Okada, Hideaki Murata, Masato Sakata
  • Patent number: 6225953
    Abstract: An antenna device (A3) for a portable telephone includes a whip antenna (1) having a larger-diameter portion (52) formed near its upper end by means of forming. The guide ring (7) consisting essentially of a synthetic resin fits on the whip antenna (1), such that the guide ring (7) abuts against the larger-diameter portion (52) to rest at a position below the larger-diameter portion. The whip antenna (1) and the guide ring (7) are coated with a coating layer (19) consisting essentially of a synthetic resin. The coating layer (19) has a main portion (54) coating the whip antenna (1) below the guide ring (7), and a joint portion (56) coating the guide ring (7) and the larger-diameter portion (52). A helical antenna (25) is arranged such that it is electrically connected to a metal terminal (62) and is mechanically connected to the whip antenna (1) through the joint portion (56) and the metal terminal (62). The helical antenna (25) is coated with a block (31) consisting essentially of a synthetic resin.
    Type: Grant
    Filed: September 2, 1999
    Date of Patent: May 1, 2001
    Assignee: The Furukawa Electric Co. Ltd.
    Inventors: Yoshikazu Kamei, Masayuki Nakamura, Masato Sakata
  • Patent number: 6123464
    Abstract: A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340.degree. C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240.degree. C. to 260.degree. C. for 5 minutes or more after the soldering step.
    Type: Grant
    Filed: February 10, 1999
    Date of Patent: September 26, 2000
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hideaki Murata, Takeshi Aikiyo, Kazuto Ono, Masato Sakata, Yukio Kazama
  • Patent number: 6123552
    Abstract: There is provided an IC socket having a plurality of contact pins 1. The plural contact pins 1 are arranged in a matrix form so that the pitch thereof at one end agrees with the electrode pitch of a semiconductor device 13 to be mounted and the pitch at the other end agrees with the pitch of the electrical connection terminals of an external connection body to be connected.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: September 26, 2000
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Masato Sakata, Satoru Zama, Hitoshi Yuzawa, Kazuto Ono
  • Patent number: 5804865
    Abstract: A package for optical semiconductor device comprising a metallic frame having a side wall provided with an optical fiber-securing portion for securing an optical fiber to be introduced through the side wall, and a metallic bottom plate for mounting the optical semiconductor device thereon. The metallic frame is provided at a lower portion of the side wall thereof with securing parts for securing the package to a substrate, each securing part outwardly extending in a direction parallel with the metallic bottom plate. The level of bottom face of the metallic bottom plate is made lower than that of the bottom face of the securing parts. The securing parts are integrally formed with the metallic frame.
    Type: Grant
    Filed: May 22, 1997
    Date of Patent: September 8, 1998
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Masato Sakata, Yukio Kazama, Kazuto Ono, Hideaki Murata
  • Patent number: 4341260
    Abstract: A method is disclosed for the production of amorphous metal tapes by rolling and cooling a molten metal stream between the contact faces of one roll and one metal belt. Tapes having controlled dimensions may be obtained.
    Type: Grant
    Filed: April 29, 1980
    Date of Patent: July 27, 1982
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Toyoaki Ishibachi, Masato Sakata