Patents by Inventor Masato Shishikura

Masato Shishikura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8987655
    Abstract: An optical module includes a light-receiving element configured to convert an incident optical signal to an electric signal. The light-receiving element includes a mesa part configured to laminate at least a first semiconductor layer, a light absorption semiconductor layer that absorbs an optical signal entering from a light reception surface, and a second semiconductor layer. The light-receiving element also includes an electrode part disposed on a top of the mesa part and a wiring part that covers a part of a side surface of the mesa part. The optical module includes a lens configured to condense an optical signal from an optical fiber onto the light reception surface. The wiring part is disposed at a position based on an intensity distribution of the optical signal on the light reception surface.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: March 24, 2015
    Assignee: Oclaro Japan, Inc.
    Inventors: Michihide Sasada, Hiroshi Hamada, Masato Shishikura
  • Patent number: 8079125
    Abstract: An object of the present invention is to provide a technique making it possible to easily manufacture a multi-channel optical module in which optical elements are air-sealed. In the optical module, a package 111 with optical elements mounted thereon is sealed with a transparent plate 109. Above a sealing window of the package, a lens plate 105 having holes 104 or grooves 201 and engagement pins 101 are engaged and optically aligned with each other.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: December 20, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Takuma Ban, Yasunobu Matsuoka, Masato Shishikura
  • Patent number: 7991290
    Abstract: To provide an optical transceiver module comprising an optical prism for optical communications which has mounting portions, a light emitting portion, light receiving portions, a substrate and a sub-mount that are used as the basis of the optical transceiver module, whose configuration is compact with reduced components which are accurately mounted. A sub-mount is provided on the substrate. The composite optical prism is formed with an optical lens provided with mounting supports and a wavelength division film in an integrated fashion. By using marks on the sub-mount for alignment, the composite optical prism can be mounted accurately on the sub-mount. In addition, the light receiving portions and the light emitting portion can be mounted accurately by using marks for alignment provided on the substrate and the sub-mount.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: August 2, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Ken'ichi Tanaka, Masato Shishikura, Kenro Sekine, Toshiki Sugawara, Yasunobu Matsuoka
  • Patent number: 7991248
    Abstract: There are provided a substrate mounted with a photoelectric hybrid circuit having an optical path conversion mirror structure and optical waveguide wiring by reducing the number of parts and the number of fabrication steps, as well as most effectively implement high-density wiring for an optical connection between the optical waveguide and the photoelectric conversion element or optical waveguide array connector that are formed on the substrate, and a device.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: August 2, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yasunobu Matsuoka, Masato Shishikura
  • Patent number: 7921436
    Abstract: An optical device integrated head having high light utilizing efficiency by decreasing the propagation loss caused from an optical source to a recording medium, conducting by mounting according to compact active alignment method for efficiently guiding a light generated from a laser device to the top end of a head, in which a light source device mounted on a submount has a mirror portion having an inclinated surface to at least a portion of one edge thereof for reflecting an output light from the optical source device at the inclinated surface, a structural member including a lens structure for further allowing a light to pass through the submount, and an optical waveguide disposed passing through a slider for mounting the submount, and the optical source and the slider are positioned by using active alignment of light in a chip-on carrier structure having the optical source device mounted on the submount.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: April 5, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Junichiro Shimizu, Masato Shishikura
  • Publication number: 20100166363
    Abstract: There are provided a substrate mounted with a photoelectric hybrid circuit having an optical path conversion mirror structure and optical waveguide wiring by reducing the number of parts and the number of fabrication steps, as well as most effectively implement high-density wiring for an optical connection between the optical waveguide and the photoelectric conversion element or optical waveguide array connector that are formed on the substrate, and a device.
    Type: Application
    Filed: February 22, 2007
    Publication date: July 1, 2010
    Inventors: Yasunobu Matsuoka, Masato Shishikura
  • Patent number: 7680367
    Abstract: In the optical connection between multi-layered optical waveguides and photoelectric converting elements or optical waveguide array connectors formed on a substrate, the optical coupling efficiency is to be prevented from degrading due to deviation of the optical axis positions between optical elements and the optical waveguide layers that is caused by a radiation due to a beam expansion or by a deviation of positioning layers in producing the optical waveguides. There are stacked, on a substrate, optical waveguide layers, each of which comprises a clad layer and a core having a higher refractive index than the clad layer, and optical elements formed on the uppermost optical waveguide layer. The optical elements are positioned such that they correspond to the optical path conversion mirrors of the cores of the underlaying optical waveguide layer.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: March 16, 2010
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yasunobu Matsuoka, Masato Shishikura
  • Patent number: 7657136
    Abstract: A photoelectric integrated circuit device, in which photonic devices provided on the same substrate as the LSI are densely arranged along the four sides of the LSI, and characteristic degradation of the laser diode or photo detector due to heat generation can be prevented, furthermore optical wiring is easily performed on the board.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: February 2, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yasunobu Matsuoka, Masato Shishikura
  • Patent number: 7612881
    Abstract: The present invention provides a method for high precision alignment of a surface emitting laser and a lens in an optical module in which optical coupling between a surface emitting laser and other optical devices such as an optical fiber is realized via lenses, and a structure for providing the method. A lens member 101, in which the lenses 105 are arrayed at a depth t1 from a reference plane 102 and an alignment mark is provided at a depth t2 (t1<t2) is prepared. Then alignment is performed for the lens 105 and the surface emitting laser 106 mounted on the board 110 for a photonic device.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: November 3, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Takuma Ban, Yasunobu Matsuoka, Masato Shishikura
  • Publication number: 20090080830
    Abstract: In the optical connection between multi-layered optical waveguides and photoelectric converting elements or optical waveguide array connectors formed on a substrate, the optical coupling efficiency is to be prevented from degrading due to deviation of the optical axis positions between optical elements and the optical waveguide layers that is caused by a radiation due to a beam expansion or by a deviation of positioning layers in producing the optical waveguides. There are stacked, on a substrate, optical waveguide layers, each of which comprises a clad layer and a core having a higher refractive index than the clad layer, and optical elements formed on the uppermost optical waveguide layer. The optical elements are positioned such that they correspond to the optical path conversion mirrors of the cores of the underlaying optical waveguide layer.
    Type: Application
    Filed: November 16, 2005
    Publication date: March 26, 2009
    Inventors: Yasunobu Matsuoka, Masato Shishikura
  • Publication number: 20090003761
    Abstract: A photoelectric integrated circuit device, in which photonic devices provided on the same substrate as the LSI are densely arranged along the four sides of the LSI, and characteristic degradation of the laser diode or photo detector due to heat generation can be prevented, furthermore optical wiring is easily performed on the board.
    Type: Application
    Filed: September 29, 2004
    Publication date: January 1, 2009
    Inventors: Yasunobu Matsuoka, Masato Shishikura
  • Publication number: 20080316872
    Abstract: An optical device integrated head having high light utilizing efficiency by decreasing the propagation loss caused from an optical source to a recording medium, conducting by mounting according to compact active alignment method for efficiently guiding a light generated from a laser device to the top end of a head, in which a light source device mounted on a submount has a mirror portion having an inclinated surface to at least a portion of one edge thereof for reflecting an output light from the optical source device at the inclinated surface, a structural member including a lens structure for further allowing a light to pass through the submount, and an optical waveguide disposed passing through a slider for mounting the submount, and the optical source and the slider are positioned by using active alignment of light in a chip-on carrier structure having the optical source device mounted on the submount.
    Type: Application
    Filed: February 14, 2008
    Publication date: December 25, 2008
    Inventors: Junichiro SHIMIZU, Masato Shishikura
  • Publication number: 20080036103
    Abstract: An object of the present invention is to provide a technique making it possible to easily manufacture a multi-channel optical module in which optical elements are air-sealed. In the optical module, a package 111 with optical elements mounted thereon is sealed with a transparent plate 109. Above a sealing window of the package, a lens plate 105 having holes 104 or grooves 201 and engagement pins 101 are engaged and optically aligned with each other.
    Type: Application
    Filed: June 15, 2007
    Publication date: February 14, 2008
    Inventors: Takuma Ban, Yasunobu Matsuoka, Masato Shishikura
  • Publication number: 20070146881
    Abstract: To provide an optical transceiver module comprising an optical prism for optical communications which has mounting portions, a light emitting portion, light receiving portions, a substrate and a sub-mount that are used as the basis of the optical transceiver module, whose configuration is compact with reduced components which are accurately mounted. A sub-mount is provided on the substrate. The composite optical prism is formed with an optical lens provided with mounting supports and a wavelength division film in an integrated fashion. By using marks on the sub-mount for alignment, the composite optical prism can be mounted accurately on the sub-mount. In addition, the light receiving portions and the light emitting portion can be mounted accurately by using marks for alignment provided on the substrate and the sub-mount.
    Type: Application
    Filed: November 21, 2006
    Publication date: June 28, 2007
    Inventors: Ken'ichi Tanaka, Masato Shishikura, Kenro Sekine, Toshiki Sugawara, Yasunobu Matsuoka
  • Publication number: 20070058904
    Abstract: The present invention provides a method for high precision alignment of a surface emitting laser and a lens in an optical module in which optical coupling between a surface emitting laser and other optical devices such as an optical fiber is realized via lenses, and a structure for providing the method. A lens member 101, in which the lenses 105 are arrayed at a depth t1 from a reference plane 102 and an alignment mark is provided at a depth t2 (t1<t2) is prepared. Then alignment is performed for the lens 105 and the surface emitting laser 106 mounted on the board 110 for a photonic device.
    Type: Application
    Filed: August 9, 2006
    Publication date: March 15, 2007
    Inventors: Takuma Ban, Yasunobu Matsuoka, Masato Shishikura
  • Publication number: 20040257579
    Abstract: The object of the invention is to enhance the sensitivity of a chemical sensor. To achieve the object, in a chemical sensor chip formed on a substrate and provided with a Mach-Zehnder interferometer, a part of an optical input waveguide or an optical output waveguide is tapered or the thickness or the width of one of waveguides branched in two from a Y-type branchpoint of the Mach-Zehnder interferometer varies in a taper.
    Type: Application
    Filed: May 25, 2004
    Publication date: December 23, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Masataka Shirai, Toshiki Sugawara, Masato Shishikura
  • Patent number: 6822271
    Abstract: In aiming at cost lowering of an optical module and an optical transmission apparatus and with the objective of providing a semiconductor light receiving element that has a good coherence with the other edge emitting/incidence type optical devices and is capable of performing the positioning easily and with a high accuracy, in the edge emitting/incidence type light receiving element in which the light absorbing layer 19 has been formed, the space region is formed so as to provide at least 100 &mgr;m2 of the marker detecting region 24, thereby facilitating detection of marker 23 on the optical device 26 and executing the positioning of the light receiving element with a high accuracy, the space region resulting from eliminating a part of the light absorbing layer 19 that absorbs the detection light of the light receiving element, the transmission amount of the detection light toward the marker detecting region that is parallel to a primary plane being equal to 30% or higher, the detection light having penetrat
    Type: Grant
    Filed: February 17, 2000
    Date of Patent: November 23, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Toshiyuki Mogi, Kazumi Kawamoto, Shinji Tsuji, Hitoshi Nakamura, Masato Shishikura, Satoru Kikuchi
  • Patent number: 6632027
    Abstract: An optical module shown in FIG. 2 is disclosed having following components. (1) A substrate on which optical parts and an optical fiber are mounted. An optical fiber is fixed in the V-groove formed on the substrate so that the optic axis of the optical parts and the fiber is adjusted. (2) A bottom plastic package having a concave surface for the substrate mounted thereon and several leads pins being fixed to the first plastic package. (3) A upper plastic package for sealing optical parts and the fiber being fixed to the bottom plastic package, the outer surface of the upper plastic package being plated by metal, and the upper plastic package and at least one of the lead pins conducted. According to this, it is possible to provide optical transmission module or optical module having advantage of capable of using plastic package and electromagnetic interference free with simplified structure.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: October 14, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Kouji Yoshida, Masato Shishikura, Toshinori Hirataka, Shinji Tsuji, Takeshi Kato
  • Publication number: 20030094667
    Abstract: In aiming at cost lowering of an optical module and an optical transmission apparatus and with the objective of providing a semiconductor light receiving element that has a good coherence with the other edge emitting/incidence type optical devices and is capable of performing the positioning easily and with a high accuracy, in the edge emitting/incidence type light receiving element in which the light absorbing layer 19 has been formed, the space region is formed so as to provide at least 100 &mgr;m2 of the marker detecting region 24, thereby facilitating detection of marker 23 on the optical device 26 and executing the positioning of the light receiving element with a high accuracy, the space region resulting from eliminating a part of the light absorbing layer 19 that absorbs the detection light of the light receiving element, the transmission amount of the detection light toward the marker detecting region that is parallel to a primary plane being equal to 30% or higher, the detection light having penetrat
    Type: Application
    Filed: February 17, 2000
    Publication date: May 22, 2003
    Inventors: TOSHIYUKI MOGI, KAZUMI KAWAMOTO, SHINJI TSUJI, HITOSHI NAKAMURA, MASATO SHISHIKURA, SATORU KIKUCHI
  • Patent number: 6488416
    Abstract: A conventional problem is to provide an optical module capable of being reflow mounted together with electronic components collectively, and, at the same time, securing a mechanical strength that can bear a large stress at the time of an attachment/detachment of the optical fiber. A solution to the above-mentioned problem can be attained by using an optical connector removable type optical module for reflow mounting having a fixing structure for fixing itself to a mount board, including a receptacle part installed to an optical module 19 to which an optical connector 1 is detachably connected; electric terminals 4 for reflow mounting that are arranged corresponding to lands 8 on a mount board 6; and stud parts 5 that are able to fit in fixing holes 7 on the mount board 6.
    Type: Grant
    Filed: September 14, 2000
    Date of Patent: December 3, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Masato Shishikura, Koji Yoshida, Kimio Tatsuno, Hirohisa Sano