Patents by Inventor Masatosi Mitomi

Masatosi Mitomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100282497
    Abstract: Release papers (2A, 2B) are bonded to one face of a circuit board (1) via adhesive layers (3A, 3B), so as to cover the adhesive layers. The circuit board (1) is formed of a flexible multilayer board. A nonadhesive portion (4) having no adhesive layers is formed on the portion of the circuit board face located between the adjacent release papers (2A, 2B), and pull-tabs (2Ap, 2Bp) for removing the respective release papers are formed at the end portions of the respective release papers (2A, 2B) located at the nonadhesive portion (4). The pull-tabs are designed so as to face each other preferably at the adhesive portion (4), and the top end portions of the pull-tabs overlap with each other on the circuit board face. With this arrangement, it is possible to recognize the order of removing the respective release papers from the circuit board face.
    Type: Application
    Filed: February 7, 2008
    Publication date: November 11, 2010
    Applicant: SUMITOMO BAKELITE Co., Ltd.
    Inventors: Hiroaki Hashido, Masatosi Mitomi
  • Publication number: 20100147581
    Abstract: A flexible substrate (200) includes a recessed portion formed on a right edge portion of a first linear portion (210) continuously extending backward from a left end portion of an intermediate linear portion (230). In the case of inserting the flexible substrate (200) for example through a hollow hinge portion (101) openably and closably connecting a first and a second device body (110), (120) of an opening/closing type electronic device (100), upon inserting the first linear portion (210) through the first opening (112) of the first cylindrical hinge portion (118), constituting a part of the hollow hinge portion (101), the recessed portion of the first linear portion (210) is located so as to oppose a right end inner surface of the first opening (112), with a gap therebetween.
    Type: Application
    Filed: May 23, 2008
    Publication date: June 17, 2010
    Applicant: SUMITOMO BAKELITE CO., LTD
    Inventor: Masatosi Mitomi