Patents by Inventor Masaya SHIMAMURA

Masaya SHIMAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190237409
    Abstract: A method of manufacturing a plurality of identical electronic component modules includes: preparing an assembly substrate that includes a plurality of electronic components mounted thereon; digging a first groove along the dicing lines from a top surface of a sealing member that seals each electronic component, the first groove penetrating the sealing member and reaching an intermediate depth within a base substrate; widening an upper portion of the first grove to define a second groove that is continuous with the lower portion of the first groove; forming a shielding film by depositing a film made of a conductive material on the top surface of the sealing member and on inner walls of the first and second grooves that include the sidewalls of the sealing member; and thereafter, cutting the base substrate at a bottom of the lower portion of the first groove along dicing lines.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 1, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286816
    Abstract: To provide an electronic component module capable of forming a shielding film in a state of an assembly substrate and enhancing productivity. An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion; a contact portion provided to the substrate, the contact portion being configured to be electrically connected with the conductive pattern, the contact portion having a vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface; and a shielding film covering the upper surface and the side surface of the sealing portion and the contact portion.
    Type: Application
    Filed: March 23, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286817
    Abstract: Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.
    Type: Application
    Filed: March 26, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286796
    Abstract: An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.
    Type: Application
    Filed: March 23, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo Kitazaki, Takehiko Kai, Masaya Shimamura, Mikio Aoki, Jin Mikata, Taiji Ito
  • Publication number: 20180159209
    Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 7, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Jin MIKATA, Masaya SHIMAMURA, Mikio AOKI, Takehiko KAI, Taiji ITO
  • Publication number: 20180159217
    Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 7, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Jin MIKATA, Masaya SHIMAMURA, Mikio AOKI, Takehiko KAI, Taiji ITO
  • Publication number: 20180159216
    Abstract: Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 7, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Patent number: 9807916
    Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: October 31, 2017
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo Kitazaki, Masaya Shimamura, Eiji Mugiya, Takehiko Kai
  • Patent number: 9560740
    Abstract: A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: January 31, 2017
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo Kitazaki, Eiji Mugiya, Masaya Shimamura
  • Patent number: 9456488
    Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: September 27, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masaya Shimamura, Takehiko Kai, Eiji Mugiya, Tetsuo Saji, Hiroshi Nakamura
  • Patent number: 9455209
    Abstract: A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion.
    Type: Grant
    Filed: January 6, 2014
    Date of Patent: September 27, 2016
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Eiji Mugiya, Masaya Shimamura, Kenzo Kitazaki, Takehiko Kai
  • Publication number: 20160095267
    Abstract: A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.
    Type: Application
    Filed: September 22, 2015
    Publication date: March 31, 2016
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Eiji MUGIYA, Masaya SHIMAMURA
  • Patent number: 9101050
    Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: August 4, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masaya Shimamura, Kenzo Kitazaki, Eiji Mugiya, Tatsuro Sawatari, Tetsuo Saji, Hiroshi Nakamura
  • Patent number: 9101044
    Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: August 4, 2015
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Masaya Shimamura, Kenzo Kitazaki, Yutaka Nagai, Hiroshi Nakamura, Tetsuo Saji, Eiji Mugiya
  • Patent number: 9055682
    Abstract: There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: June 9, 2015
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Eiji Mugiya, Kenzo Kitazaki, Masaya Shimamura
  • Patent number: 9018039
    Abstract: A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: April 28, 2015
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Eiji Mugiya, Takehiko Kai, Masaya Shimamura, Tetsuo Saji, Hiroshi Nakamura
  • Publication number: 20150070849
    Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Masaya SHIMAMURA, Takehiko KAI, Eiji MUGIYA, Tetsuo SAJI, Hiroshi NAKAMURA
  • Publication number: 20150070851
    Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
    Type: Application
    Filed: November 26, 2013
    Publication date: March 12, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Kenzo KITAZAKI, Masaya SHIMAMURA, Eiji MUGIYA, Takehiko KAI
  • Publication number: 20150062835
    Abstract: A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.
    Type: Application
    Filed: December 10, 2013
    Publication date: March 5, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Takehiko KAI, Eiji MUGIYA, Masaya SHIMAMURA, Kenzo KITAZAKI, Hiroshi NAKAMURA, Tetsuo SAJI
  • Publication number: 20150049439
    Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.
    Type: Application
    Filed: November 26, 2013
    Publication date: February 19, 2015
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Masaya SHIMAMURA, Kenzo KITAZAKI, Eiji MUGIYA, Tatsuro SAWATARI, Tetsuo SAJI, Hiroshi NAKAMURA