Abstract: According to an embodiment, a substrate with an electrode is a substrate with an electrode 32 for manufacturing an organic device 10 including a first electrode 14, an organic functional layer 16, and a second electrode 18. The substrate with an electrode includes a support substrate 34, a first electrode provided on an inner side of a device formation area DA on a surface 34a of the support substrate 34, and an antistatic conductive portion 36 provided on the surface described above and electrically connected to the first electrode.

Abstract: A manufacturing method for a functional film provided on an upper surface of a long substrate, includes coating an ink containing a material of the functional film on the upper surface of the substrate to form a coating film, and drying the coating film while conveying the substrate. The drying process includes a first process in which the substrate is conveyed for a first distance and a temperature of the substrate is raised from a first temperature to a second temperature during conveyance. In the first process, assuming that the first distance is d1 (m), the first temperature is T1 (° C.), and the second temperature is T2 (° C.), the following expression is satisfied: (T2?T1)/d1?10 (1a). A maximum value of an instantaneous temperature change rate of the substrate is 5° C./sec or less.

Abstract: An organic EL element comprises a supporting substrate 12 having a first side surface 12b and a second side surface 12c located opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL body 16 disposed on the first electrode, a second electrode 18 disposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfaces 18a and 20a of the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfaces 18b and 20b of the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.

Abstract: An organic EL element includes a support substrate, an organic EL portion that is disposed on the support substrate and is formed by stacking a first electrode layer, an organic functional layer, and a second electrode layer, a sealing member that seals the organic EL portion, and one or more moisture absorbing portions that have moisture absorption characteristics. The moisture absorbing portion is disposed in an outer edge portion of a light emitting area of the organic EL portion in which the first electrode layer, the organic functional layer, and the second electrode layer are sequentially continuously superimposed when viewed in a stacking direction of the organic EL portion. An area of the moisture absorbing portion disposed on the light emitting area is smaller than an area of the light emitting area.

Abstract: A method for producing an organic electronic device according to an embodiment includes: a device base formation step; a dehydration step of dehydrating a protective film-bearing sealing member under a pressure of 1000 Pa or more while conveying the protective film-bearing sealing member 10 in which a protective film 30 is laminated on a sealing member 20; and a sealing member bonding step of peeling off the protective film 30 from the protective film-bearing sealing member which has been subjected to the dehydration step and bonding the sealing member 20 to a device base. In the dehydration step, an atmosphere gas G1 having a dew point of ?40° C. or lower is caused to flow from a downstream side to an upstream side in a conveyance direction of the protective film-bearing sealing member.

Abstract: A manufacturing method of an organic electronic device of the present invention, includes: a removing step of removing a volatile component from a flexible base material; a fixing step of fixing the flexible base material onto a support substrate via an adhesive layer; and a forming step of forming a device main body sequentially including a first electrode layer, at least one organic functional layer, and a second electrode layer on the flexible base material that is fixed onto the support substrate, on a side opposite to the support substrate, in this order, in which a vapor pressure of the volatile component is greater than or equal to 101325 Pa within a temperature range from 20° C. to a melting point of a parent resin of the flexible base material.

Abstract: A method for manufacturing an organic device 10 according to an embodiment includes: a film forming step of continuously forming first to N-th layers (N is an integer of 2 or more) on a first electrode layer 14 formed on a main surface 12a of a flexible substrate while continuously conveying the flexible substrate 12, wherein in the film forming step, the first to N-th layers are sequentially formed on the first electrode layer by supplying materials of the first to N-th layers from first to N-th film forming sources to the flexible substrate through first to N-th shielding parts arranged between the first to N-th film forming sources and the flexible substrate, the first to N-th shielding parts are fixed in a conveyance direction of the flexible substrate in a state of being spaced apart from the flexible substrate, and a shielding area due to at least one shielding part of the first to N-th shielding parts is different from a shielding area due to other shielding part.

Abstract: A manufacturing method for an electronic device 1 includes: a bonding step S09 of bonding a band-shaped sealing member 11, extending in one direction, along the one direction such that a portion of each of a first electrode layer 5 and a second electrode layer 9 in each electronic device part 10 is exposed and that the sealing member straddles a plurality of electronic device parts 10; a cutting step S05 of making a cut in a sealing body 20 that is a parent material of the sealing member 11 and has a larger dimension in the width direction, orthogonal to the one direction, than the sealing member 11 so as to form a width being the width of the sealing member 11, before the bonding step S09; and a separation step S08 of separating the sealing member 11 from the sealing body 20 in which the cut has been made, after the cutting step S05 and before the bonding step S09. In the bonding step S09, the sealing member 11, separated from the sealing body 20 in the separation step S08, is bonded.

Abstract: An organic electronic device manufacturing method according to one embodiment comprises: a device base forming step of forming a device base in which a first electrode, a device functional part including an organic layer, and a second electrode are provided in this order on a substrate; a dehydration step S22 of heating and dehydrating a protective film-equipped sealing member, in which a protective film is laminated, via an adhesive layer, on a sealing member having a sealing base, the adhesive layer laminated on an one surface of the sealing base, and a resin layer laminated on an other surface of the sealing base, while the protective film-equipped sealing member 10 is conveyed using at least one roll; and a sealing member bonding step of removing the protective film from the protective film-equipped sealing member after subjected to the dehydration step, and then bonding the sealing member to the device base through the adhesive layer, wherein in the dehydration step, a temperature of a roll surface of th

Abstract: A vapor deposition source 14 according to one embodiment includes a crucible 20 that contains a vapor deposition material 6 to be heated and evaporated by irradiation with an electron beam EB, and a heater 22 disposed to surround an edge 20b of the crucible 20 closer to an opening 20a thereof. This configuration allows the edge of the crucible to be heated by the heater, and thus allows the vapor deposition material crawling up toward the edge to be evaporated. As a result, the vapor deposition material can be kept from flowing out and being deposited due to the vapor deposition material crawling up to the edge of the crucible.

Abstract: According to an embodiment, a method for manufacturing an organic electronic device includes: a step of forming an organic functional layer 16 on a first electrode layer 14 provided for each of device formation regions DA set in a flexible substrate 10 in a first direction; a step of forming a second electrode layer 20 on the flexible substrate, on which the organic functional layer is formed, over the plurality of device formation regions in the first direction in such a way as to cover each organic functional layer; a step of forming a hole 22 by removing, in a second direction crossing the first direction, the second electrode layer provided between a boundary of the device formation region and a function exhibiting design region A1 in the organic functional layer in the first direction or on the second electrode layer on the boundary out of the second electrode layers; and a step of providing a sealing member 26 sealing the function exhibiting design region on the organic functional layer in such a way as

Abstract: A method for manufacturing an organic electronic device according to an embodiment includes: a device base material forming step of forming a device base material 40 in which a first electrode 42, an organic layer-containing device function part 43, and a second electrode 44 are sequentially provided on a substrate 41; a dehydration step of dehydrating a protective film-attached sealing member 10 in which a protective film 30 is layered, via an adhesive layer 22, on a sealing member 20 having the adhesive layer layered on a sealing base material 21; and a sealing member bonding step of bonding the sealing member via the adhesive layer to the device base material after the protective film is peeled from the protective film-attached sealing member having been subjected to the dehydration step, wherein the peel strength of the adhesive layer to the protective film in the protective film-attached sealing member is from 0.06 N/20 mm to 0.3 N/20 mm.

Abstract: A production method for an organic EL element includes a step of forming an organic EL section on an organic EL section arrangement area in a first electrode section while conveying an electrode-attached substrate in a first direction, a step of forming a band-shaped conductive film along the first direction to cover the organic EL section and at least a part of an external connection area in the first electrode section while conveying the electrode-attached substrate on which the organic EL section is formed in the first direction, and a step of forming a groove section that separates the conductive film into a first part and a second part being a second electrode section by removing the conductive film in a predetermined area in a second direction while conveying the electrode-attached substrate on which the conductive film is formed in the first direction, and extends in the first direction.

Abstract: According to an embodiment, a substrate with an electrode is a substrate with an electrode 32 for manufacturing an organic device 10 including a first electrode 14, an organic functional layer 16, and a second electrode 18. The substrate with an electrode includes a support substrate 34, a first electrode provided on an inner side of a device formation area DA on a surface 34a of the support substrate 34, and an antistatic conductive portion 36 provided on the surface described above and electrically connected to the first electrode.

Abstract: A method for producing an organic device 1, includes: first forming steps S02 and S03 of producing a support substrate 10 with an organic functional layer; a winding step S05 of winding the support substrate 10 with an organic functional layer and a protective film 13; a peeling step S06 of feeding out the protective film 13 and the support substrate 10 have been wound in, and peeling off the protective film 13; a heating step S07 of heating the support substrate 10 with an organic functional layer after the peeling step S06; and a second forming step S08 of forming at least one layer selected from the second electrode layer 9 and an organic functional layer 7 not formed in the first forming step S03 and being one of the organic functional layers comprising the multiple organic functional layers, after the heating step S07.

Abstract: A method of manufacturing an organic EL element (1) includes: a step of forming a first electrode layer (5), an organic functional layer (7), and a second electrode layer (9) on a substrate (3), a step of detecting a defective portion after forming the second electrode layer (9), a step of removing the second electrode layer (9) in the defective portion by irradiating the defective portion with a laser beam (L) from the second electrode layer (9) side when the defective portion has been detected, and a step of forming a sealing layer (11) after removing the second electrode layer 9 in the defective portion.

Abstract: A method for producing an organic electronic device according to an embodiment includes: a device base formation step; a dehydration step of dehydrating a protective film-bearing sealing member under a pressure of 1000 Pa or more while conveying the protective film-bearing sealing member 10 in which a protective film 30 is laminated on a sealing member 20; and a sealing member bonding step of peeling off the protective film 30 from the protective film-bearing sealing member which has been subjected to the dehydration step and bonding the sealing member 20 to a device base. In the dehydration step, an atmosphere gas G1 having a dew point of ?40° C. or lower is caused to flow from a downstream side to an upstream side in a conveyance direction of the protective film-bearing sealing member.

Abstract: A manufacturing method of an organic electronic device of the present invention, includes: a removing step of removing a volatile component from a flexible base material; a fixing step of fixing the flexible base material onto a support substrate via an adhesive layer; and a forming step of forming a device main body sequentially including a first electrode layer, at least one organic functional layer, and a second electrode layer on the flexible base material that is fixed onto the support substrate, on a side opposite to the support substrate, in this order, in which a vapor pressure of the volatile component is greater than or equal to 101325 Pa within a temperature range from 20° C. to a melting point of a parent resin of the flexible base material.

Abstract: A method for manufacturing an organic device 10 according to an embodiment includes: a film forming step of continuously forming first to N-th layers (N is an integer of 2 or more) on a first electrode layer 14 formed on a main surface 12a of a flexible substrate while continuously conveying the flexible substrate 12, wherein in the film forming step, the first to N-th layers are sequentially formed on the first electrode layer by supplying materials of the first to N-th layers from first to N-th film forming sources to the flexible substrate through first to N-th shielding parts arranged between the first to N-th film forming sources and the flexible substrate, the first to N-th shielding parts are fixed in a conveyance direction of the flexible substrate in a state of being spaced apart from the flexible substrate, and a shielding area due to at least one shielding part of the first to N-th shielding parts is different from a shielding area due to other shielding part.

Abstract: A method for producing an organic device 1, includes: first forming steps S02 and S03 of producing a support substrate 10 with an organic functional layer; a winding step S05 of winding the support substrate 10 with an organic functional layer and a protective film 13; a peeling step S06 of feeding out the protective film 13 and the support substrate 10 have been wound in, and peeling off the protective film 13; a heating step S07 of heating the support substrate 10 with an organic functional layer after the peeling step S06; and a second forming step S08 of forming at least one layer selected from the second electrode layer 9 and an organic functional layer 7 not formed in the first forming step S03 and being one of the organic functional layers comprising the multiple organic functional layers, after the heating step S07.