Abstract: A method for transfecting nucleic acid to cell comprising a step for forming a nucleic acid complex by bringing a double-stranded nucleic acid molecule into contact with a nucleic acid carrier having an amino acid sequence of alternating a basic amino acid and a hydrophobic amino acid, which has a peptide chain that forms a ?-sheet structure in which a side chain of a positively charged basic amino acid is disposed on one surface side and a side chain of a hydrophobic amino acid is disposed on the opposite surface side in the presence of the double-stranded nucleic acid molecule having a double helix structure, and by binding the double-stranded nucleic acid molecule and the peptide chain through either one or both of the electrostatic interaction between the side chains of the basic amino acid and phosphate groups and hydrogen bonds between the double stranded-nucleic acid molecule and the peptide chain and a nucleic acid complex used for the same are disclosed.

Abstract: An image forming apparatus includes a printing unit that prints at least one object image using a color material; a color information acquiring unit that acquires color information of the object image; and a control unit that starts one of colorimetry of the object image using the color information acquired by the color information acquiring unit and color adjustment of the printing unit after a variation amount of color information of the object image measured at different points of time is equal to or smaller than a predetermined threshold.

Abstract: An apparatus includes: a light source; a two-dimensional image sensor that receives reflected light from a subject including specular light of the source and outputs an image of the subject; and an optical member arranged in an optical path of light emitted from the source to the subject. When a specular position of the source in the subject arranged apart from the two-dimensional image sensor by a certain distance is defined as a first specular position, whereas a specular position of the source in the optical member is defined as a second specular position, a relative positional relation of the optical member and the source with respect to the two-dimensional image sensor is determined so that a difference between an incident angle from the source toward the first specular position and an incident angle from the source toward the second specular position is a reference value or more.

Abstract: An image processing device includes a first storage unit, a calculating unit, a second storage unit, and an interpolation calculating unit. The first storage unit is configured to store values at lattice points on a plurality of unit cubes to which a color space made up of the plurality of color components is segmentalized. The calculating unit is configured to calculate a difference between a first lattice-point value stored in the first storage unit and a color component value mapped to color coordinates of the first lattice point for each of the lattice points. The second storage unit is configured to store the calculated difference on a lattice-point-by-lattice-point basis. The interpolation calculating unit is configured to calculate a second image data by reading out the stored differences designated by a first image data and performing interpolation calculation using the read-out second lattice-point values.

Abstract: A glossiness determining device includes: a light source; a two-dimensional sensor that receives reflected light containing a specular reflection component of a subject illuminated by the light source, and outputs an image of the subject; and a determining unit that determines glossiness of the subject by using a saturated image, which is the image of the subject output by the two-dimensional sensor and in which pixel values of a partial area are saturated.

Abstract: A content distribution server receives from an information processing device, a first password generated from first data indicating a key and server specific information specific to the server with the use of a predetermined function. Then, the received first password and processing designation information designating processing are transmitted to a terminal. The terminal generates a second password from second data indicating a key matching with the key indicated by the first data and the server specific information obtained from the information processing device, with the use of the function. Then, the first password from the server and the generated second password are checked against each other, and whether or not to perform processing designated by the processing designation information from the server is determined based on a result of checking.

Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.

Abstract: An image processing device included in the invention comprises: a first storage unit configured to store predetermined values as values at lattice points on a plurality of unit cubes to which a color space made up of the plurality of color components is segmentalized; a calculating unit configured to calculate a second lattice-point value that is a difference between a first lattice-point value stored in the first storage unit and a color component value mapped to color coordinates of the first lattice point for each of the lattice points; a second storage unit configured to store the calculated second lattice-point values on a lattice-point-by-lattice-point basis; and an interpolation calculating unit configured to calculate a second image data by reading out the second lattice-point values designated by a first image data from the second storage unit and performing interpolation calculation using the read-out second lattice-point values.

Abstract: A method for transacting nucleic acid to cell comprising a step for forming a nucleic acid complex by bringing a double-stranded nucleic acid molecule into contact with a nucleic acid carrier having an amino acid sequence of alternating a basic amino acid and a hydrophobic amino acid, which has a peptide chain that forms a ?-sheet structure in which a side chain of a positively charged basic amino acid is disposed on one surface side and a side chain of a hydrophobic amino acid is disposed on the opposite surface side in the presence of the double-stranded nucleic acid molecule having a double helix structure, and by binding the double-stranded nucleic acid molecule and the peptide chain through either one or both of the electrostatic interaction between the side chains of the basic amino acid and phosphate groups and hydrogen bonds between the double stranded-nucleic acid molecule and the peptide chain and a nucleic acid complex used for the same are disclosed.

Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.

Abstract: A heat-dissipating structure for an optical isolator is capable of suppressing an increase in temperature caused by light absorption in a magnetic garnet crystalline film by radiation fins extending from the inside of an external heat conducting cover. The heat-dissipating structure for the optical isolator is formed by housing a magnetic garnet crystalline film (12), first and second heat conductive plates (6, 7, 8 and 9) and magnet 18 in the external heat conducting cover, placing the radiation fins (10 and 11) on the second heat conductive plate, attaching the first heat conductive plates (6 and 7) onto either side of the magnetic garnet crystalline film, arranging the second heat conductive plates (8 and 9) on the outer surface of the first heat conductive plates, and passing the radiation fins through guide openings (2a and 2b) in the isolator holder 2 to the outside of the external heat conductive cover from the extracting opening (3c) to be brought into contact with the outer grooves (4d and 5d).

Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.

Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.

Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.

Abstract: A heat-dissipating structure for an optical isolator is capable of suppressing an increase in temperature caused by light absorption in a magnetic garnet crystalline film by radiation fins extending from the inside of an external heat conducting cover. The heat-dissipating structure for the optical isolator is formed by housing a magnetic garnet crystalline film (12), first and second heat conductive plates (6, 7, 8 and 9) and magnet 18 in the external heat conducting cover, placing the radiation fins (10 and 11) on the second heat conductive plate, attaching the first heat conductive plates (6 and 7) onto either side of the magnetic garnet crystalline film, arranging the second heat conductive plates (8 and 9) on the outer surface of the first heat conductive plates, and passing the radiation fins through guide openings (2a and 2b) in the isolator holder 2 to the outside of the external heat conductive cover from the extracting opening (3c) to be brought into contact with the outer grooves (4d and 5d).

Abstract: It is intended to provide a modified DNA or RNA, the cytoplasmic localization of which has been established, and an siRNA, which is localized in the cytoplasm, shows a high activity and, therefore, is appropriately usable as a genetic drug, by using a means generally applicable to DNAs of various types regardless of original tissues. A cytoplasmic localization DNA or RNA modified with a peptide can be constructed by modifying a DNA fragment with an active hydrogen-containing group on a solid support, fusing a peptide having an active hydrogen-containing group therewith and then removing from the solid support. On the other hand, a cytoplasmic localization siRNA can be obtained by introducing chemical modification group(s) into the 5?-terminus of at least one of the sense chain and the antisense chain constituting the double-strand, or a dangling end of the antisense chain, or both of them.

Abstract: A method for varnish application to a dynamoelectric stator is disclosed. The method includes a varnish treatment process and application by preheating the stator; adjusting a viscosity of the varnish; dripping the varnish onto a coil end of the stator from radially outside the stator while rotating the preheated stator around a central axis; and hardening the varnish dripped onto the coil end by heating the stator. The varnish viscosity is adjusted so that said varnish dripped onto said coil end passes through the coil end from radially outside to radially inside, and the varnish is dripped onto said coil end along a direction which is perpendicular to the central axis of the collective coils.

Abstract: The present invention provides a method for manufacturing a dynamoelectric stator enabling coil ends to be impregnated with varnish simply and to a high fill factor by adjusting varnish viscosity at a temperature of a stator during varnish application to a predetermined range. The configuration includes a varnish treatment process including: a preheating process in which the stator is preheated; a varnish application process in which a varnish adjusted so as to have a viscosity of 16 to 105 mPa·s at a temperature of the stator during varnish application is dripped onto a coil end from radially outside the stator while rotating the preheated stator around a central axis; and a varnish heat hardening process in which the varnish is hardened by heating the stator to which the varnish has been applied.

Abstract: A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order, and further applying silver plating (105) selectively to part of an inner part that is to be enclosed with a package of the semiconductor device. The lead frame (100) may also include a base of the package. The silver plating contributes to an excellent light reflectance and wire bonding efficiency of the inner part, whereas the gold flash plating contributes to an excellent resistance to corrosion and soldering efficiency of an outer part that is outside the package.

Abstract: The present invention provides a bar code scanning device that is compatible, in terms of communication and data, with information equipment conforming to PCMCIA standards, that is mounted in a card housing of a compact flash card size, and that has a laser beam scanning section integrated thereinto and which applies a scanning beam to an interior of the card housing through a window to obtain bar code information from light obtained when the scanning beam from the window is reflected.