Patents by Inventor Masayuki Ikeno

Masayuki Ikeno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10738190
    Abstract: A resin composition includes: (a) a supported platinum catalyst having a structure shown by the following general formula (1) in which a platinum complex is supported on a surface of an inorganic oxide; and (b) a thermoplastic matrix resin. The resin composition is usable as an addition-reaction catalyst capable of imparting sufficient storability and quick curability to an addition-reaction curable composition. In the formula, L represents a ligand selected from carbon monoxide, an olefin compound, an amine compound, a phosphine compound, an N-heterocyclic carbene compound, a nitrile compound, and an isocyanide compound; and n represents the number of Ls and an integer from 0 to 2.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: August 11, 2020
    Assignees: SHIN-ETSU CHEMICAL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masayuki Ikeno, Takeshi Miyao, Takeharu Toyoshima, Jun-chul Choi, Norihisa Fukaya, Hiroyuki Yasuda
  • Patent number: 10590322
    Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: March 17, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Masayuki Ikeno, Nobuaki Matsumoto, Kohei Masuda, Takafumi Sakamoto
  • Patent number: 10566280
    Abstract: In one embodiment, a semiconductor device includes a first insulator. The device further includes a metal layer that includes a first metal layer provided on a surface of the first insulator, and a second metal layer provided on a surface of the first metal layer and containing a first metallic element and oxygen or containing aluminum and nitrogen, or includes a third metal layer provided on the surface of the first insulator and containing a second metallic element, aluminum and nitrogen. The device further includes an interconnect material layer provided on a surface of the metal layer.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: February 18, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Satoshi Wakatsuki, Masayuki Kitamura, Takeshi Ishizaki, Hiroshi Itokawa, Daisuke Ikeno, Kei Watanabe, Atsuko Sakata
  • Publication number: 20190279932
    Abstract: In one embodiment, a semiconductor device includes a first insulator. The device further includes a metal layer that includes a first metal layer provided on a surface of the first insulator, and a second metal layer provided on a surface of the first metal layer and containing a first metallic element and oxygen or containing aluminum and nitrogen, or includes a third metal layer provided on the surface of the first insulator and containing a second metallic element, aluminum and nitrogen. The device further includes an interconnect material layer provided on a surface of the metal layer.
    Type: Application
    Filed: August 14, 2018
    Publication date: September 12, 2019
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Satoshi WAKATSUKI, Masayuki KITAMURA, Takeshi ISHIZAKI, Hiroshi ITOKAWA, Daisuke IKENO, Kei WATANABE, Atsuko SAKATA
  • Publication number: 20190135978
    Abstract: Provided is a novel polyoxyalkylene compound which contains, at a molecular chain terminal, at least one reactive silicon-containing group represented by formula (1) per molecule and which has a main chain that is a polyoxyalkylene polymer. Also provided are: a process for producing the novel polyoxyalkylene compound; a room-temperature-curable composition which includes the compound as a main component and can contain any of various crosslinking agents; a sealing material; and an article. (In formula (1), R1 and R2 are each a monovalent hydrocarbon group, a hydrogen atom, or a triorganosiloxy group; n is 2 or larger; m is 1 or larger; and the broken line is a linking bond.
    Type: Application
    Filed: February 28, 2017
    Publication date: May 9, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takahiro YAMAGUCHI, Masayuki IKENO, Isao IWASAKI, Takafumi SAKAMOTO
  • Publication number: 20190100649
    Abstract: A resin composition includes: (a) a supported platinum catalyst having a structure shown by the following general formula (1) in which a platinum complex is supported on a surface of an inorganic oxide; and (b) a thermoplastic matrix resin. The resin composition is usable as an addition-reaction catalyst capable of imparting sufficient storability and quick curability to an addition-reaction curable composition. In the formula, L represents a ligand selected from carbon monoxide, an olefin compound, an amine compound, a phosphine compound, an N-heterocyclic carbene compound, a nitrile compound, and an isocyanide compound; and n represents the number of Ls and an integer from 0 to 2.
    Type: Application
    Filed: February 28, 2017
    Publication date: April 4, 2019
    Applicants: SHIN-ETSU CHEMICAL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masayuki IKENO, Takeshi MIYAO, Takeharu TOYOSHIMA, Jun-chul CHOI, Norihisa FUKAYA, Hiroyuki YASUDA
  • Patent number: 10174058
    Abstract: Provided is a compound for imparting a thermal plasticity to an organic silicon resin. The compound is a novel vinyl silane compound represented by the following formula (1): wherein A independently represents a divalent hydrocarbon group having 1 to 6 carbon atoms; Y independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: January 8, 2019
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Taiki Katayama, Masayuki Ikeno, Misaki Takai, Takafumi Sakamoto
  • Publication number: 20180334467
    Abstract: Provided is a compound for imparting a thermal plasticity to an organic silicon resin. The compound is a novel vinyl silane compound represented by the following formula (1): wherein A independently represents a divalent hydrocarbon group having 1 to 6 carbon atoms; Y independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms.
    Type: Application
    Filed: August 22, 2016
    Publication date: November 22, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Taiki KATAYAMA, Masayuki IKENO, Misaki TAKAI, Takafumi SAKAMOTO
  • Publication number: 20180163113
    Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.
    Type: Application
    Filed: May 25, 2016
    Publication date: June 14, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira UTA, Masayuki IKENO, Nobuaki MATSUMOTO, Kohei MASUDA, Takafumi SAKAMOTO
  • Patent number: 9762040
    Abstract: There is provided a wiring harness in which a plurality of cables are bound by a plurality of protectors provided at intervals in a longitudinal direction, the wiring harness arranged along an arranging path of a fixed portion. The cables are collectively held by the protectors. The lengths of the plurality of cables between the protectors are made different such that the cables are bent between the protectors.
    Type: Grant
    Filed: May 30, 2011
    Date of Patent: September 12, 2017
    Assignees: YAZAKI CORPORATION, SUZUKI MOTOR CORPORATION
    Inventors: Tatsuo Ogawa, Masayuki Ikeno, Keisuke Kato
  • Patent number: 9714344
    Abstract: The present invention pertains to an ultraviolet-ray-curable organopolysiloxane composition containing: (A) (A-1) a straight-chain organopolysiloxane containing an alkenyl group, and (A-2) a three-dimensional-network-shaped organopolysiloxane resin containing an R12R2SiO1/2 unit, an R13SiO1/2 unit, an SiO2 unit, and an alkenyl group; (B) an organohydrogenpolysiloxane; (C) a photoactive platinum complex curing catalyst; and (D) an organopolysiloxane oligomer containing an R12R2SiO1/2 unit or the R12R2SiO1/2 unit and an R13R2SiO1/2 unit, also containing an R1SiO3/2 unit, not containing an SiO2 unit, and also containing an alkenyl group. As a result, this ultraviolet-ray-curable organopolysiloxane composition retains high strength and does extremely well suppressing heat-induced expansion or contraction; hence, it is possible to transfer a pattern and print with high dimensional accuracy.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: July 25, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yuka Mayumi, Masayuki Ikeno
  • Patent number: 9631062
    Abstract: A silicone gel composition including: an organopolysiloxane shown by the following general formula: RaR1bSiO(4-a-b)/2, having one or more alkenyl groups bound to a silicon atom in one molecule, wherein the amount is 100 parts by mass; an organohydrogenpolysiloxane shown by the following general formula: R2cHdSiO(4-c-d)/2, having two or more hydrogen atoms bound to a silicon atom in one molecule, wherein the amount is such that 0.6 to 3 hydrogen atoms bound to a silicon atom is contained relative to one alkenyl group bound to a silicon atom in the component; a platinum-based catalyst, wherein the amount is an effective amount; and a carbon nanotube, wherein the amount is 0.01 to 3 parts by mass. This provides a silicone gel composition which can be a silicone gel cured product with low elastic modulus, low stress, and excellent heat resistance at 230° C., when it is cured.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: April 25, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masayuki Ikeno, Kazuyasu Sato
  • Publication number: 20160230005
    Abstract: The present invention pertains to an ultraviolet-ray-curable organopolysiloxane composition containing: (A) (A-1) a straight-chain organopolysiloxane containing an alkenyl group, and (A-2) a three-dimensional-network-shaped organopolysiloxane resin containing an R12R2SiO1/2 unit, an R13SiO1/2 unit, an SiO2 unit, and an alkenyl group; (B) an organohydrogenpolysiloxane; (C) a photoactive platinum complex curing catalyst; and (D) an organopolysiloxane oligomer containing an R12R2SiO1/2 unit or the R12R2SiO1/2 unit and an R13R2SiO1/2 unit, also containing an R1SiO3/2 unit, not containing an SiO2 unit, and also containing an alkenyl group. As a result, this ultraviolet-ray-curable organopolysiloxane composition retains high strength and does extremely well suppressing heat-induced expansion or contraction; hence, it is possible to transfer a pattern and print with high dimensional accuracy.
    Type: Application
    Filed: August 19, 2014
    Publication date: August 11, 2016
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yuka MAYUMI, Masayuki IKENO
  • Publication number: 20160229983
    Abstract: A silicone gel composition including: an organopolysiloxane shown by the following general formula: RaR1bSiO(4-a-b)/2, having one or more alkenyl groups bound to a silicon atom in one molecule, wherein the amount is 100 parts by mass; an organohydrogenpolysiloxane shown by the following general formula: R2cHdSiO(4-c-d)/2, having two or more hydrogen atoms bound to a silicon atom in one molecule, wherein the amount is such that 0.6 to 3 hydrogen atoms bound to a silicon atom is contained relative to one alkenyl group bound to a silicon atom in the component; a platinum-based catalyst, wherein the amount is an effective amount; and a carbon nanotube, wherein the amount is 0.01 to 3 parts by mass. This provides a silicone gel composition which can be a silicone gel cured product with low elastic modulus, low stress, and excellent heat resistance at 230° C., when it is cured.
    Type: Application
    Filed: July 29, 2014
    Publication date: August 11, 2016
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Masayuki IKENO, Kazuyasu SATO
  • Patent number: 9365757
    Abstract: A UV-curable adhesive organopolysiloxane composition is provided comprising (A) (A-1) an alkenyl-containing linear organopolysiloxane and (A-2) a three-dimensionai network alkenyl-containing organopolysiloxane resin comprising R12R2SiO3/2, R13SiO1/2 and SiO2 units, wherein R1 is a monovalent hydrocarbon group exclusive of alkenyl and R2 is alkenyl, (B) (B-1) an alkoxy-free organohydrogenpolysiloxane and (B-2) an organohydrogenpolysiloxane containing at least one trialkoxysilyl group bonded to silicon via alkylene, (C) a photoactive platinum complex catalyst, and (D) a branched organopolysiloxane oligomer comprising R12R2SiO1/2 and/or R13SiO1/2 units and R1SiO3/2 units, but not SiO2 units.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: June 14, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yuka Mayumi, Masayuki Ikeno
  • Patent number: 9070846
    Abstract: The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH?CH2 groups in the molecule, and (B) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode formed on the substrate can be prevented, and the heat resistance of a primer itself can be improved.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: June 30, 2015
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Toshiyuki Ozai, Masanari Moteki, Masayuki Ikeno
  • Publication number: 20150124338
    Abstract: A UV-curable adhesive organopolysiloxane composition is provided comprising (A) (A-1) an alkenyl-containing linear organopolysiloxane and (A-2) a three-dimensionai network alkenyl-containing organopolysiloxane resin comprising R12R2SiO3/2, R13SiO1/2 and SiO2 units, wherein R1 is a monovalent hydrocarbon group exclusive of alkenyl and R2 is alkenyl, (B) (B-1) an alkoxy-free organohydrogenpolysiloxane and (B-2) an organohydrogenpolysiloxane containing at least one trialkoxysilyl group bonded to silicon via alkylene, (C) a photoactive platinum complex catalyst, and (D) a branched organopolysiloxane oligomer comprising R12R2SiO1/2 and/or R13SiO1/2 units and R1SiO3/2 units, but not SiO2 units.
    Type: Application
    Filed: November 4, 2014
    Publication date: May 7, 2015
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yuka MAYUMI, Masayuki IKENO
  • Patent number: 8981591
    Abstract: A safety device for a high-voltage component including a cover that covers at least a part of the high-voltage component, a low-voltage circuit that controls a conduction/shut-off state of an electric circuit for supplying power to the high-voltage component, and a selecting unit that selects the conduction/shut-off state of the low-voltage circuit by an operation accompanying an attachment/removal work of the cover.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: March 17, 2015
    Assignee: Suzuki Motor Corporation
    Inventors: Masayuki Ikeno, Junka Iwasaki, Hiromasa Minami
  • Patent number: 8952077
    Abstract: A UV curable silicone rubber composition is provided. The composition does not undergo curing failure, foaming, and other undesirable conditions even if a water-containing inorganic filler such as zeolite were added. A UV curable silicone rubber composition comprising (A) 100 parts by weight of an organopolysiloxane having at least 2 alkenyl groups per molecule represented by the average compositional formula (I): R1aSiO(4-a)/2 (I) (wherein R1 is independently a substituted or unsubstituted monovalent hydrocarbon group, and a is a positive number of 1.95 to 2.05); (B) 1 to 300 parts by weight of an inorganic filler having a water content of at least 0.5% by weight; (C) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule; and (D) a catalytic amount of a photoactive platinum complex curing catalyst.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: February 10, 2015
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Minoru Igarashi, Masayuki Yoshida, Yuka Mayumi, Tsuneo Kimura, Masayuki Ikeno
  • Patent number: 8822593
    Abstract: A curable resin composition to which at least phosphor particles and nanoparticles having a primary particle size of 1 nm or more and less than 100 nm are added, wherein the nanoparticles are dispersed in the form of secondarily aggregated particles having an average particle size of 100 nm or more and 20 ?m or less in terms of volume Q3 is provided for an optical semiconductor apparatus in which when a sealant obtained by dispersing phosphor particles in a curable resin composition having a low viscosity is filled into a package substrate, the dispersion state of the phosphor particles is not changed at the early and late stages of the fabrication, specifically the amounts of the phosphor particles to be contained at the early and late stages are the same, and the color rendering property can be stably maintained, a hardened material thereof, and an optical semiconductor apparatus.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: September 2, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Satoshi Onai, Eiichi Tabei, Masayuki Ikeno