Abstract: Provided is an oxygen-curable silicone composition that cures at room temperature, the reaction being triggered by oxygen in the atmosphere, without requiring heat or UV irradiation at the time of use, and exhibits good mechanical strength after curing. A composition including (A) an organopolysiloxane (1) (R1 represents an alkyl group or the like but has at least one acryloyloxy group or the like in the molecule, R2 represents an oxygen atom or the like, and m and n represent numbers that satisfy 1?m+n 1,000.), (B) a silicone resin including (a) a unit of formula (2), (b) an R13SiO1/2 unit, and (c) an SiO4/2 unit, the molar ratio of [(a)+(b)]/(c) being 0.4-1.2, and the silicone resin having 0.005 mol/100 g or more Si-OH groups (R1 and R2 are the same as above. R3 represents an acryloyloxyalkyl group or the like, p represents 0-10, and 1 represents a number that satisfies 1-3.), and (C) an organoborane complex (3) (R4-R6 represent hydrocarbon groups.).

Abstract: A semiconductor device according to the present disclosure includes a first insulating film, a second insulating film, and a tungsten film provided between the first insulating film and the second insulating film, the tungsten film having a crystal particle, wherein a thickness T of the tungsten film in a first direction from the first insulating film toward the second insulating film and an average particle size APS of the crystal particle satisfy APS/T?2 is satisfied.

Abstract: Provided is a novel polyoxyalkylene compound which contains, at a molecular chain terminal, at least one reactive silicon-containing group represented by formula (1) per molecule and which has a main chain that is a polyoxyalkylene polymer. Also provided are: a process for producing the novel polyoxyalkylene compound; a room-temperature-curable composition which includes the compound as a main component and can contain any of various crosslinking agents; a sealing material; and an article. (In formula (1), R1 and R2 are each a monovalent hydrocarbon group, a hydrogen atom, or a triorganosiloxy group; n is 2 or larger; m is 1 or larger; and the broken line is a linking bond).

Abstract: A resin composition includes: (a) a supported platinum catalyst having a structure shown by the following general formula (1) in which a platinum complex is supported on a surface of an inorganic oxide; and (b) a thermoplastic matrix resin. The resin composition is usable as an addition-reaction catalyst capable of imparting sufficient storability and quick curability to an addition-reaction curable composition. In the formula, L represents a ligand selected from carbon monoxide, an olefin compound, an amine compound, a phosphine compound, an N-heterocyclic carbene compound, a nitrile compound, and an isocyanide compound; and n represents the number of Ls and an integer from 0 to 2.

Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.

Abstract: Provided is a novel polyoxyalkylene compound which contains, at a molecular chain terminal, at least one reactive silicon-containing group represented by formula (1) per molecule and which has a main chain that is a polyoxyalkylene polymer. Also provided are: a process for producing the novel polyoxyalkylene compound; a room-temperature-curable composition which includes the compound as a main component and can contain any of various crosslinking agents; a sealing material; and an article. (In formula (1), R1 and R2 are each a monovalent hydrocarbon group, a hydrogen atom, or a triorganosiloxy group; n is 2 or larger; m is 1 or larger; and the broken line is a linking bond.

Abstract: A resin composition includes: (a) a supported platinum catalyst having a structure shown by the following general formula (1) in which a platinum complex is supported on a surface of an inorganic oxide; and (b) a thermoplastic matrix resin. The resin composition is usable as an addition-reaction catalyst capable of imparting sufficient storability and quick curability to an addition-reaction curable composition. In the formula, L represents a ligand selected from carbon monoxide, an olefin compound, an amine compound, a phosphine compound, an N-heterocyclic carbene compound, a nitrile compound, and an isocyanide compound; and n represents the number of Ls and an integer from 0 to 2.

Abstract: Provided is a compound for imparting a thermal plasticity to an organic silicon resin. The compound is a novel vinyl silane compound represented by the following formula (1): wherein A independently represents a divalent hydrocarbon group having 1 to 6 carbon atoms; Y independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms.

Abstract: Provided is a compound for imparting a thermal plasticity to an organic silicon resin. The compound is a novel vinyl silane compound represented by the following formula (1): wherein A independently represents a divalent hydrocarbon group having 1 to 6 carbon atoms; Y independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms.

Abstract: Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH) or —Si(CH3)2(CH2—CH?CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.

Abstract: There is provided a wiring harness in which a plurality of cables are bound by a plurality of protectors provided at intervals in a longitudinal direction, the wiring harness arranged along an arranging path of a fixed portion. The cables are collectively held by the protectors. The lengths of the plurality of cables between the protectors are made different such that the cables are bent between the protectors.

Abstract: The present invention pertains to an ultraviolet-ray-curable organopolysiloxane composition containing: (A) (A-1) a straight-chain organopolysiloxane containing an alkenyl group, and (A-2) a three-dimensional-network-shaped organopolysiloxane resin containing an R12R2SiO1/2 unit, an R13SiO1/2 unit, an SiO2 unit, and an alkenyl group; (B) an organohydrogenpolysiloxane; (C) a photoactive platinum complex curing catalyst; and (D) an organopolysiloxane oligomer containing an R12R2SiO1/2 unit or the R12R2SiO1/2 unit and an R13R2SiO1/2 unit, also containing an R1SiO3/2 unit, not containing an SiO2 unit, and also containing an alkenyl group. As a result, this ultraviolet-ray-curable organopolysiloxane composition retains high strength and does extremely well suppressing heat-induced expansion or contraction; hence, it is possible to transfer a pattern and print with high dimensional accuracy.

Abstract: A silicone gel composition including: an organopolysiloxane shown by the following general formula: RaR1bSiO(4-a-b)/2, having one or more alkenyl groups bound to a silicon atom in one molecule, wherein the amount is 100 parts by mass; an organohydrogenpolysiloxane shown by the following general formula: R2cHdSiO(4-c-d)/2, having two or more hydrogen atoms bound to a silicon atom in one molecule, wherein the amount is such that 0.6 to 3 hydrogen atoms bound to a silicon atom is contained relative to one alkenyl group bound to a silicon atom in the component; a platinum-based catalyst, wherein the amount is an effective amount; and a carbon nanotube, wherein the amount is 0.01 to 3 parts by mass. This provides a silicone gel composition which can be a silicone gel cured product with low elastic modulus, low stress, and excellent heat resistance at 230° C., when it is cured.

Abstract: A silicone gel composition including: an organopolysiloxane shown by the following general formula: RaR1bSiO(4-a-b)/2, having one or more alkenyl groups bound to a silicon atom in one molecule, wherein the amount is 100 parts by mass; an organohydrogenpolysiloxane shown by the following general formula: R2cHdSiO(4-c-d)/2, having two or more hydrogen atoms bound to a silicon atom in one molecule, wherein the amount is such that 0.6 to 3 hydrogen atoms bound to a silicon atom is contained relative to one alkenyl group bound to a silicon atom in the component; a platinum-based catalyst, wherein the amount is an effective amount; and a carbon nanotube, wherein the amount is 0.01 to 3 parts by mass. This provides a silicone gel composition which can be a silicone gel cured product with low elastic modulus, low stress, and excellent heat resistance at 230° C., when it is cured.

Abstract: The present invention pertains to an ultraviolet-ray-curable organopolysiloxane composition containing: (A) (A-1) a straight-chain organopolysiloxane containing an alkenyl group, and (A-2) a three-dimensional-network-shaped organopolysiloxane resin containing an R12R2SiO1/2 unit, an R13SiO1/2 unit, an SiO2 unit, and an alkenyl group; (B) an organohydrogenpolysiloxane; (C) a photoactive platinum complex curing catalyst; and (D) an organopolysiloxane oligomer containing an R12R2SiO1/2 unit or the R12R2SiO1/2 unit and an R13R2SiO1/2 unit, also containing an R1SiO3/2 unit, not containing an SiO2 unit, and also containing an alkenyl group. As a result, this ultraviolet-ray-curable organopolysiloxane composition retains high strength and does extremely well suppressing heat-induced expansion or contraction; hence, it is possible to transfer a pattern and print with high dimensional accuracy.

Abstract: A UV-curable adhesive organopolysiloxane composition is provided comprising (A) (A-1) an alkenyl-containing linear organopolysiloxane and (A-2) a three-dimensionai network alkenyl-containing organopolysiloxane resin comprising R12R2SiO3/2, R13SiO1/2 and SiO2 units, wherein R1 is a monovalent hydrocarbon group exclusive of alkenyl and R2 is alkenyl, (B) (B-1) an alkoxy-free organohydrogenpolysiloxane and (B-2) an organohydrogenpolysiloxane containing at least one trialkoxysilyl group bonded to silicon via alkylene, (C) a photoactive platinum complex catalyst, and (D) a branched organopolysiloxane oligomer comprising R12R2SiO1/2 and/or R13SiO1/2 units and R1SiO3/2 units, but not SiO2 units.

Abstract: The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH?CH2 groups in the molecule, and (B) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode formed on the substrate can be prevented, and the heat resistance of a primer itself can be improved.

Abstract: A UV-curable adhesive organopolysiloxane composition is provided comprising (A) (A-1) an alkenyl-containing linear organopolysiloxane and (A-2) a three-dimensionai network alkenyl-containing organopolysiloxane resin comprising R12R2SiO3/2, R13SiO1/2 and SiO2 units, wherein R1 is a monovalent hydrocarbon group exclusive of alkenyl and R2 is alkenyl, (B) (B-1) an alkoxy-free organohydrogenpolysiloxane and (B-2) an organohydrogenpolysiloxane containing at least one trialkoxysilyl group bonded to silicon via alkylene, (C) a photoactive platinum complex catalyst, and (D) a branched organopolysiloxane oligomer comprising R12R2SiO1/2 and/or R13SiO1/2 units and R1SiO3/2 units, but not SiO2 units.

Abstract: A safety device for a high-voltage component including a cover that covers at least a part of the high-voltage component, a low-voltage circuit that controls a conduction/shut-off state of an electric circuit for supplying power to the high-voltage component, and a selecting unit that selects the conduction/shut-off state of the low-voltage circuit by an operation accompanying an attachment/removal work of the cover.

Abstract: A UV curable silicone rubber composition is provided. The composition does not undergo curing failure, foaming, and other undesirable conditions even if a water-containing inorganic filler such as zeolite were added. A UV curable silicone rubber composition comprising (A) 100 parts by weight of an organopolysiloxane having at least 2 alkenyl groups per molecule represented by the average compositional formula (I): R1aSiO(4-a)/2 (I) (wherein R1 is independently a substituted or unsubstituted monovalent hydrocarbon group, and a is a positive number of 1.95 to 2.05); (B) 1 to 300 parts by weight of an inorganic filler having a water content of at least 0.5% by weight; (C) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule; and (D) a catalytic amount of a photoactive platinum complex curing catalyst.