Abstract: A damage control unit includes: a switching judgment unit to judge the CPU configuration which performs smoothing of the damage ratio, according to the damage ratio of the CPUs; and a switching unit to perform switching of I/O signals of all the CPUs. The switching judgment unit observes the damage ratio calculated from values such as the temperature, voltage, current consumption amount, operation ratio, the number of accesses to the resources in the CPU, at all times or at some extent of time intervals and notifies the switching unit of the CPU configuration to be changed by using the calculation method for smoothing the damage ratio of each CPU. The switching unit makes a connection to the I/O signals of all the CPUs and a system bus and switches the I/O signal of the CPU to be switched according to the notification from the switching judgment unit.

Abstract: A light receiving circuit (114) includes a light inputting circuit (113) which converts one-system optical signal to be outputted from an optical transmission path (101) to an electrical signal and inverts a potential of the electrical signal each time the optical signal is detected, and a buffer circuit (110) which amplifies the electrical signal converted by the light inputting circuit and outputs the same. According to such configuration, since one-system optical signal may be inputted to the light receiving circuit, a system circuit configuration can be avoided to be complicated.

Abstract: Small-scale measuring circuits (111-1qum) are arranged in m columns×q rows. The small-scale measuring circuits of each row (111-11m, 121-12m, 1q1-1qm) are connected in series. The respective rows are connected in parallel. Supplying reference signals B having different parameter values to the small-scale measuring circuits (111-11m, . . . ) connected in series makes it possible to improve the measurement range or measurement resolution. Supplying reference signals B having the same parameter to the respective rows can reduce a noise component depending on the transistor size. According to this invention, using a plurality of small-scale measuring circuits in accordance with required measurement performance concerning a measurement range, resolution, noise reduction, or the like can implement the desired performance while minimizing the area of each measuring circuit.

Abstract: An information processing device comprises a plurality of processing units on which OSs and execution environments operate, and shared peripheral devices shared by the plurality of processing units. The information processing device is provided with a failure concealing device for concealing a failure which has occurred in a processing unit. The failure concealing device determines a substitutional processing unit that will act as a substitute for a failed processing unit so that the OS and execution environment which have operated on the failed processing unit will operate on the substitutional processing unit, switches the OS and execution environment which have operated on the failed processing unit so that they will operate on the substitutional processing unit, and switches a shared resource used by the failed processing unit such that it is available to the substitutional processing unit.

Abstract: A control signal input circuit for supplying control signals to a plurality of controlled circuits comprises N pieces of control signal preservation/output circuits provided one by one corresponding to plural-bit signals for delivering input data as it is when a trigger signal is at a first level, and holding previously delivered output data when the trigger signal is at a second level, and a controlled circuit selector circuit for setting the trigger signal for S pieces of the control signal preservation/output circuits to the first level, and setting the trigger signal for the rest of the control signal preservation/output circuits to the second level.

Abstract: An interpolated signal generating circuit (101) generates interpolated signals (SIG1-SIGN) of two consecutive discrete signals (SIG). N measuring circuits (501) measure interpolated signals. Since the interpolated signals are measurement targets, N-times oversampling measurement can also be performed for the discrete signals. With the oversampling measurement, the frequency spectra of the signal components of the discrete signals are maintained, and only the frequency spectrum of a noise component due to a quantization error increases to a high-frequency band, thereby reducing a noise component per unit frequency. Therefore, removing a high-frequency component from a measurement result from each measuring circuit using a low-pass filter (502) makes it possible to improve the signal-to-noise ratio of the measurement result as compared with a case in which no oversampling is performed.

Abstract: A phase difference measuring device according to this invention has an object of shortening the measuring time, and includes a plurality of phase difference measuring circuits (104, 105, 106) formed in a row, and phase difference conversion circuits (101, 102, 103) each connected between adjacent phase difference measuring circuits. The phase difference measuring circuit receives first and second signals, respectively gives the first and second signals first and second delay amounts cumulatively a plurality of number of times, and, whenever giving the delay amounts, compares the phases of the first and second signals given the delay amounts, thereby determining which one of the phases leads the other.

Abstract: A semiconductor device comprising a signal transmission line of a microstrip structure, capable of increasing the characteristic impedance of the signal transmission line and reducing coupling between a plurality of signal lines. In a signal transmission line of a microstrip structure composed of a signal line and a ground plate, the capacitance between wires is reduced and the characteristic impedance can be increased by forming holes in the signal line or in the ground plate. The coupling between a plurality of signal lines can also be reduced.

Abstract: A semiconductor integrated circuit apparatus, and more particularly a technology for measuring and managing a physical amount of factors that exert an influence upon an operation of a semiconductor integrated circuit is provided; more particularly, a semiconductor integrated circuit that is an object of measurement, and a measurement circuit which measures a physical factor that exerts an influence upon the actual operation of the semiconductor integrated circuit, such as jitter or noise jitter, and noise of this semiconductor integrated circuit are provided on an identical chip; also, a measurement result of the measurement circuit of the present invention is analyzed, and is fed back to a circuit for adjusting the semiconductor integrated circuit that is the object of measurement.

Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.

Abstract: A programmable semiconductor device has a switch element in an interconnection layer, wherein in at least one of the inside of a via, interconnecting a wire of a first interconnection layer and a wire of a second interconnection layer, a contact part of the via with the wire of the first interconnection layer and a contact part of the via with the wire of the second interconnection layer, there is provided a variable electrical conductivity member, such as a member of an electrolyte material. The via is used as a variable electrical conductivity type switch element or as a variable resistance device having a contact part with the wire of the first interconnection layer as a first terminal and having a contact part with the wire of the second interconnection layer as a second terminal.

Abstract: A programmable semiconductor device has a switch element in an interconnection layer, wherein in at least one of the inside of a via, interconnecting a wire of a first interconnection layer and a wire of a second interconnection layer, a contact part of the via with the wire of the first interconnection layer and a contact part of the via with the wire of the second interconnection layer, there is provided a variable electrical conductivity member, such as a member of an electrolyte material. The via is used as a variable electrical conductivity type switch element or as a variable resistance device having a contact part with the wire of the first interconnection layer as a first terminal and having a contact part with the wire of the second interconnection layer as a second terminal.

Abstract: The present invention relates to a technique capable of establishing communications between cores, which can provide a large degree of freedom of clock frequencies settable in each core, and thus providing deterministic operation, small communication latency, and high reliability. An object of the present invention is to provide a semiconductor device with high reliability, by analyzing factors affecting the performance of the semiconductor device, based on the communication histories within the semiconductor device, and reflecting the analysis back to the next generation semiconductor devices. The improved semiconductor device includes a core A for transmitting data in sync with the clock signal clkA, a core B for receiving data in sync with the clock signal clkB coincided with the rising or falling of the clock signal clkA in a constant period, and a controller for controlling communications between the core A and the core B.

Abstract: A molding apparatus of a wet friction material has a pair of guide posts vertically extending on a molding apparatus main body. The pair of the guide posts passes through fifteen stages (sixteen pieces) of molding dies. A pair of pantograph-type open-close mechanisms is attached to opposite side surfaces of the molding dies. Thus, the molding dies are piled up on each other so as to come near to each other (mold clamping) and move apart from each other (mold opening). With the pantograph-type open-close link mechanism, all the molding dies are opened and closed at the same time. If the molding dies are slid at a speed of 200 mm/sec, it takes only 3.75 seconds (50 mm*15/200 mm=3.75 sec). It takes a double of that time or 7.5 seconds, that is a half of the time of a related art.

Abstract: In a wireless receiver that receives an electric signal that has undergone digital modulation, a sample-hold circuit converts a wireless modulated signal, which is a continuous time signal, to a discrete time signal, and the frequency band is converted and selected by means of a band-pass filter. A demodulation circuit carries out demodulation based on the instantaneous value of the voltage amplitude of the modulated signal. A shut-down circuit further effects adaptive control of the circuit shut-down time to minimize the circuit activation time while ensuring that the demodulation error rate of the demodulated baseband signal satisfies a value stipulated by the communication standard.

Abstract: A stacked semiconductor device includes a plurality of semiconductor chips and a conductive path extending through at least one of the semiconductor chips. The semiconductor chips are stacked together. The semiconductor chips are electrically connected by the conductive path, and the conductive path has a plurality of through-connections extending through the corresponding semiconductor chip.

Abstract: In a three-dimensional semiconductor device in which a plurality of semiconductor circuit chips are stacked and that is provided with a plurality of interchip interconnections for signal transmission between these semiconductor circuit chips, when transmitting signals, only one interchip interconnection that serves for signal transmission is selected and other interchip interconnections are electrically isolated by means of switches that are provided between the interchip interconnections and signal lines. Interchip interconnection capacitance relating to the charge and discharge of interconnections is thus minimized.

Abstract: A clock converting circuit (1) receives and then converts m-phase clocks of a frequency f having a phase difference of 1/(f×m) to n-phase clocks of the frequency f having a phase difference of 1/(f×n). A single-phase clock generating circuit (2) receives the n-phase clocks of the frequency f having a phase difference equivalent time of 1/(f×n) to generate single-phase clocks in synchronism with the rising or falling edges of the n-phase clocks. Since the frequency of the m-phase clocks inputted to the clock converting circuit (1) is ‘f’, if a desired frequency of the single-phase clocks is decided, then ‘n’ can be obtained from the equation: the frequency of the single-phase clocks is equal to (f×n). This value of ‘n’ is set to the clock converting circuit (1), thereby obtaining the n-phase clocks of the frequency f from the m-phase clocks of the frequency f to provide single-phase clocks of a desired frequency.

Abstract: A semiconductor integrated circuit apparatus, and more particularly a technology for measuring and managing a physical amount of factors that exert an influence upon an operation of a semiconductor integrated circuit is provided; more particularly, a semiconductor integrated circuit that is an object of measurement, and a measurement circuit which measures a physical factor that exerts an influence upon the actual operation of the semiconductor integrated circuit, such as jitter or noise jitter, and noise of this semiconductor integrated circuit are provided on an identical chip; also, a measurement result of the measurement circuit of the present invention is analyzed, and is fed back to a circuit for adjusting the semiconductor integrated circuit that is the object of measurement.

Abstract: A semiconductor integrated circuit apparatus, and more particularly a technology for measuring and managing a physical amount of factors that exert an influence upon an operation of a semiconductor integrated circuit is provided; more particularly, a semiconductor integrated circuit that is an object of measurement, and a measurement circuit which measures a physical factor that exerts an influence upon the actual operation of the semiconductor integrated circuit, such as jitter or noise jitter, and noise of this semiconductor integrated circuit are provided on an identical chip; also, a measurement result of the measurement circuit of the present invention is analyzed, and is fed back to a circuit for adjusting the semiconductor integrated circuit that is the object of measurement.