Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.

Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having a compressed density of 0.9 or less. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.

Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Abstract: Curable, one-package, stable adhesive compositions are provided comprising: (a) a resin component comprising a polyepoxide, (b) a polyamine having at least two primary amine, secondary amine, and/or ketimine functional groups; and (c) a curing component comprising dicyandiamide and an accelerator. At least a portion of the polyepoxide in the resin component is reacted with carboxy-terminated butadiene acrylonitrile polymer. The accelerator comprises a reaction product comprising a renewable polyol, a diisocyanate, and a dialkyl monoamine containing alkyl groups with at least two carbon atoms each. The compositions are suitable for use as adhesive compositions over a wide temperature range.

Abstract: Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having a compressed density of 0.9 or less. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.

Abstract: Curable, one-package, stable adhesive compositions are provided comprising: (a) a resin component comprising a polyepoxide, (b) a polyamine having at least two primary amine, secondary amine, and/or ketimine functional groups; and (c) a curing component comprising dicyandiamide and an accelerator. At least a portion of the polyepoxide in the resin component is reacted with carboxy-terminated butadiene acrylonitrile polymer. The accelerator comprises a reaction product comprising a renewable polyol, a diisocyanate, and a dialkyl monoamine containing alkyl groups with at least two carbon atoms each. The compositions are suitable for use as adhesive compositions over a wide temperature range.

Abstract: Disclosed herein are 2K structural adhesive compositions comprising (a) a first component comprising (i) an epoxy-adduct formed as a reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid; and (ii) a second epoxy compound; and (b) a second component that reacts with the first component. In one embodiment, the second component is an amine compound. These adhesives may be used to bond together substrate materials such as two half shells of wind turbine blades.

Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct.

Abstract: Liquid compositions are disclosed that include a photocatalytic material and a hydrophilic binder that includes an essentially completely hydrolyzed organosilicate. Also disclosed are methods of making such compositions, methods of coating a substrate with a hydrophilic composition, and substrates coated with such compositions. The compositions may, for example, be embodied as stable one-pack compositions.

Abstract: Liquid compositions are disclosed that include a photocatalytic material and a hydrophilic binder that includes an essentially completely hydrolyzed organosilicate. Also disclosed are methods of making such compositions, methods of coating a substrate with a hydrophilic composition, and substrates coated with such compositions. The compositions may, for example, be embodied as stable one-pack compositions.

Abstract: A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6? (mm) or less, a cross-sectional area is 35 mm2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.

Abstract: Multi-layer coatings are disclosed that include (a) a first layer deposited from at least one composition that includes a polymeric composition, and (b) a second layer applied over at least a portion of the first layer in which the second layer is deposited from at least one liquid composition that includes (i) a photocatalytic material, and (ii) a binder that is hydrophilic and comprises an essentially completely hydrolyzed organosilicate. Also disclosed are substrates coated with such multi-layer coatings, methods of applying such multi-layer coatings to a substrate and methods of making a painted surface easy-to-clean.

Abstract: Multi-layer coatings are disclosed that include (1) a first layer comprising an inorganic oxide network, and (2) a second layer applied over at least a portion of the first layer, wherein the second layer is deposited from at least one liquid composition that is hydrophilic and includes an essentially completely hydrolyzed organosilicate. Also disclosed are substrates coated with such multi-layer coatings, methods of applying such multi-layer coatings to a substrate and methods for improving the anti-fouling, self-cleaning, easy-to-clean, and/or anti-fogging properties of an article.

Abstract: Additives comprising dispersed silica nanoparticles are disclosed. The silica nanoparticles are dispersed in an aminoplast, such as a modified aminoplast formed from the reaction between an aminoplast, a modifying component, and optionally a siloxane. The resulting additives can be added to coating compositions to provide improved mar and/or scratch resistance.

Abstract: Additives comprising dispersed silica nanoparticles are disclosed. The silica nanoparticles are dispersed in an aminoplast, such as a modified aminoplast formed from the reaction between an aminoplast, a modifying component, and optionally a siloxane. The resulting additives can be added to coating compositions to provide improved mar and/or scratch resistance.

Abstract: A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6- (mm) or less, a cross-sectional area is 35 mm 2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.

Abstract: A session control method for radio terminals that implements a Multimedia Integrated network by Radio Access Innovation (MIRAI) such that selection of a radio access network does not impose a burden on each of the radio access networks, and an interface setup method for setting up IP connection quickly during switching of the radio access network. The Multimedia Integrated network by Radio Access Innovation (MIRAI) 10 includes heterogeneous radio access networks 11, Internet 12, and multimode radio terminals 13, and the heterogeneous radio access networks 11 includes a PHS network 11a, a wireless LAN 11b, a paging network 11c, and a cellular phone network 11d. The Internet 12 includes a CCN server 12a, which sends session-related information to the radio terminal 13 via the paging network 11c. The radio terminal 13 selects a radio IF and application that are appropriate for communication based on the session-related information, and establishes a session.