Abstract: A water-and-hot-water mixing device includes a mixing valve unit which mixes hot water and water and discharges mixed water therefrom, an operation part which sets a predetermined temperature, a mixed water thermistor which detects a temperature of mixed water, a hot-water thermistor which detects a temperature of hot water supplied to the mixing valve unit, and a controller which performs a feedback control of a discharge water temperature by controlling the mixing valve unit. The controller starts the feedback control when the controller determines that a change amount of the temperature of the hot water per unit time detected by the hot-water thermistor is not more than a fixed value and the temperature of the hot water detected by the hot-water thermistor is not lower than the predetermined temperature.

Abstract: A water-and-hot-water mixing device includes a mixing valve unit which mixes hot water and water and discharges mixed water therefrom, an operation part which sets a predetermined temperature, a mixed water thermistor which detects a temperature of mixed water, a hot-water thermistor which detects a temperature of hot water supplied to the mixing valve unit, and a controller which performs a feedback control of a discharge water temperature by controlling the mixing valve unit. The controller starts the feedback control when the controller determines that a change amount of the temperature of the hot water per unit time detected by the hot-water thermistor is not more than a fixed value and the temperature of the hot water detected by the hot-water thermistor is not lower than the predetermined temperature.

Abstract: A negative photosensitive polymer composition, which comprises a thermosetting polymer precursor which can be cured through cyclodehydration upon heating, and a photosensitive heat cure accelerator which is capable of accelerating a curing upon irradiation of light (cyclodehydration accelerating property). This photosensitive heat cure accelerator may be a compound which is capable of increasing molecular weight and raising volatilization temperature upon irradiation of light, or a compound which is capable of generating a carboxyl group upon irradiation of light thereby exhibiting a heat cure-accelerating property, and is formed of an aromatic hydrocarbon or aromatic heterocyclic compound having at least one hydroxyl group, substituted or unsubstituted amino group or mercapto group.

Abstract: A resist comprising a sulfonyl compound represented by the following general formula (1): ##STR1## wherein R.sup.1 is a hydrogen atom, a halogen atom, nitro group, cyano group or a monovalent organic group, R.sup.2 is a halogen atom, nitro group, cyano group or a monovalent organic group, R.sup.3 is a bivalent organic group, and n is an integer of 2 or more. The R.sup.3 in the general formula (1) is preferably a bivalent organic group represented by the general formula (2): ##STR2## wherein R.sup.21, R.sup.22, R.sup.23, R.sup.24, R.sup.25 and R.sup.26 may be the same or different and are individually a hydrogen atom, a halogen atom, nitro group, cyano group or a monovalent organic group, and Z is a bivalent organic group.

Abstract: A polyimide precursor composition, which comprises, a polyamic acid having a repeating unit represented by the following general formula (PA), and at least one kinds of cure accelerator selected from the group consisting of a substituted or unsubstituted nitrogen-containing heterocyclic compound exhibiting an acid dissociation index "pKa" of a proton complex ranging from 0 to 8 in an aqueous solution thereof, or an N-oxide compound of said nitrogen-containing heterocyclic compound (AC1), a substituted or unsubstituted amino acid compound (AC2), and an aromatic hydrocarbon compound or an aromatic heterocyclic compound having a molecular weight of 1,000 or less and two or more hydroxyl groups (AC3): ##STR1## wherein .phi. is a quadrivalent organic group, .phi. is a bivalent organic group, R is a substituted or unsubstituted hydrocarbon group, organosilicic group or hydrogen atom.

Abstract: Disclosed herein is a polyamic acid composition which comprises an aromatic carboxylic acid compound having phenolic hydroxyl groups, polyamic acid, and a photosensitizer made of a diazide compound, and which can form a polyimide film pattern having a high resolution and capable of firmly adhering to a substrate.

Abstract: Disclosed herein is a polyamic acid composition which comprises an aromatic carboxylic acid compound having phenolic hydroxyl groups, polyamic acid, and a photosensitizer made of a diazide compound, and which can form a polyimide film pattern having a high resolution and capable of firmly adhering to a substrate.

Abstract: A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40.

Abstract: Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.

Abstract: Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.

Abstract: A photosensitive composition contains a polyimide constituted by a repeating unit having a hydroxyl group and a repeating unit having a siloxane bond, or a repeating unit having a hydroxyl group, a repeating unit having a siloxane bond, and a repeating unit other than these two repeating units, and a photosensitive agent consisting of an ester compound or an amide-ester compound of naphthoquinonediazidesulfonic acid or benzoquinonediazidesulfonic acid. The photosensitive composition is used as a passivation film of a semiconductor device or a photoresist.

Abstract: Disclosed is a curable resin composition comprising (a) at least one maleimide compound selected from the group consisting of N-(alkenylphenyl)maleimide derivatives, and dimers and polymers thereof and (b) one or more kinds of epoxy resins, each having at least one epoxy group in the unit molecule thereof. The resin composition may contain, besides the above two components, an amino compound as a further component (c). The resin composition may comprise a prepolymer of any two components among the three components (a), (b) and (c) and the remaining component. The resin compositions are useful as molding materials, for the fabrication of laminates, and as varnishes, including insulation varnishes and impregnating varnishes.

Abstract: Disclosed are novel alkenylphenylmaleimide derivatives having the general formula ##STR1## where R is an alkenyl radical of from 3 to 12 carbon atoms, R' is a hydrogen atom, a halogen atom, or a straight-chain or branched alkyl radical of from 1 to 4 carbon atoms, and n is a whole number of from 1 to 4, and linear dimers thereof as well as a process for the preparation of such maleimide compounds.

Abstract: Disclosed is a curable resin composition comprising (a) at least one maleimide compound selected from the group consisting of N-(alkenylphenyl)maleimide derivatives, and dimers and polymers thereof and (b) one or more kinds of epoxy resins, each having at least one epoxy group in the unit molecule thereof. The resin composition may contain, besides the above two components, an amino compound as a further component (c). The resin composition may comprise a prepolymer of any two components among the three components (a), (b) and (c) and the remaining component. The resin compositions are useful as molding materials, for the fabrication of laminates, and as varnishes, including insulation varnishes and impregnating varnishes.

Abstract: Maleimide compounds represented by the general formula (I) ##STR1## where R and R' are a hydrogen atom, a halogen atom, or an alkyl radical of from 1 to 4 carbon atoms, and n and n' are a whole number of from 1 to 4; and a process for the preparation of the maleimide compounds, in which a maleamic acid represented by the general formula (II) ##STR2## where R and R' are a hydrogen atom, a halogen atom, or an alkyl radical of from 1 to 4 carbon atoms, and n and n' are a whole number of from 1 to 4, is contacted with a dehydrating agent in an organic solvent.

Abstract: Disclosed are novel alkenylphenylmaleimide derivatives having the general formula ##STR1## where R is an alkenyl radical of from 3 to 12 carbon atoms, R' is a hydrogen atom, a halogen atom, or a straight-chain or branched alkyl radical of from 1 to 4 carbon atoms, and n is a whole number of from 1 to 4, and linear dimers thereof as well as a process for the preparation of such maleimide compounds.

Abstract: Disclosed is a thermosetting resin composition comprising (a) a bismaleimide and/or a polymaleimide and (b) at least one member selected from alkenylaniline derivatives, linear dimers thereof, and polymers thereof. In addition to components (a) and (b), this resin composition can contain (c) a polymerizable unsaturated substance.

Abstract: N-(hydroxyphenyl) maleimides of the general formula ##STR1## where R' stands for H, CH.sub.3, C.sub.2 H.sub.5, F, Cl, Br or I and n is an integer of 1-5 are produced by treating the corresponding maleamic acid or by treating the ester of said N-(hydroxyphenyl) maleimide at a temperature of 0.degree.-150.degree. C. in the presence of at least one dehydrating agent selected for the group consisting of oxides and oxyacids of sulfur or phosphorus and alkali metal and alkaline earth metal salts of the said oxyacids. The corresponding maleamic acid can be obtained by reacting an aminophenol having one or more hydroxyl groups on its phenyl nucleus with maleic anhydride. The esters of the N-(hydroxyphenyl maleimide) can be obtained by reacting said aminophenol and said maleic anhydride in the presence of a conventional acid anhydride dehydrating agent and a conventional imide-forming cyclization catalyst.

Abstract: N-(hydroxyphenyl) maleimides of the general formula ##STR1## where R' stands for H, CH.sub.3, C.sub.2 H.sub.5, F, Cl, Br or I and n is an integer of 1-5 are produced by treating the corresponding maleamic acid or by treating the ester of said N-(hydroxyphenyl) maleimide at a temperature of 0-150.degree. C. in the presence of at least one dehydrating agent selected from the group consisting of oxides and oxyacids of sulfur or phosphorus and alkali metal and alkaline earth metal salts of the said oxyacids. The corresponding maleamic acid can be obtained by reacting an aminophenol having one or more hydroxyl groups on its phenyl nucleus with maleic anhydride. The esters of the N-(hydroxyphenyl maleimide) can be obtained by reacting said aminophenol and said maleic anhydride in the presence of a conventional acid anhydride dehydrating agent and a conventional imide-forming cyclization catalyst.