Patents by Inventor Masuhiro Natsuhara

Masuhiro Natsuhara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180174878
    Abstract: A wafer holding unit includes a disk-shaped ceramic substrate having a wafer mounting surface on an upper surface of the substrate, an RF electrode, for example, embedded within the substrate, a metal terminal inserted from a lower surface of the substrate, and a connecting terminal which electrically connects the RF electrode and the metal terminal with each other. The connecting terminal is constituted by a ceramic member and a metal layer. The ceramic member is made of the same material as the substrate and preferably has a truncated conical shape. The metal layer covers a surface of the ceramic member. An upper end of the metal layer is connected to the RF electrode, while a lower end of the metal layer is connected to the metal terminal with a metal member interposed therebetween.
    Type: Application
    Filed: July 1, 2016
    Publication date: June 21, 2018
    Inventors: Koichi KIMURA, Shigenobu SAKITA, Kenji SHINMA, Daisuke SHIMAO, Katsuhiro ITAKURA, Masuhiro NATSUHARA, Akira MIKUMO
  • Patent number: 7999210
    Abstract: A heating device for manufacturing semiconductor capable of uniformly heating a wafer or other materials to be treated, and in particular a heating device in a coater-developer used for heat-hardening of resin film for photolithography and for heat-calcining of low-dielectric constant insulating film, is provided. A device of this invention comprises a ceramic holder 1 having a resistive heating element 2 embedded therein, which holds and heats a wafer 6 or another material to be treated; a cylindrical support member 4 which supports the ceramic holder 1; and a chamber 5 which houses these. The support member 4 and ceramic holder 1 are not hermetically sealed, or alternatively the atmospheres within the cylindrical support member 4 and within the chamber 5 are maintained to be substantially the same by adjusting the introduction and evacuation of gas.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: August 16, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Kuibira, Masuhiro Natsuhara, Hirohiko Nakata
  • Patent number: 7855569
    Abstract: The invention provides a wafer-prober wafer holder that allows positional precision and temperature uniformity to be increased, and also allows the chip to be heated and cooled rapidly, and a wafer prober device provided with the same. The wafer-prober wafer holder of the invention is constituted by a chuck top having a chuck top conducting layer on its surface, and a support member for supporting the chuck top, and has a cavity in a portion between the chuck top and the support member. The chuck top preferably is provided with a heating member.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: December 21, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masuhiro Natsuhara, Katsuhiro Itakura, Hirohiko Nakata
  • Patent number: 7837798
    Abstract: An apparatus for manufacturing a semiconductor or liquid crystal is provided with a reaction chamber housing a ceramic holder with an embedded resistive heating element, and a cylindrical support member one end of which supports the ceramic holder and the other end of which side is fixed to the reaction chamber. One end of the cylindrical support member is hermetically bonded to the ceramic holder; and a partition plate and sealing material hermetically seal the other end of which side. Embodiments include partitioning the space within the cylindrical support member with the ceramic holder, and the partition plate and depressurizing to vacuum or to a reduced pressure atmosphere of an inert gas.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: November 23, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Kuibira, Masuhiro Natsuhara, Hirohiko Nakata
  • Patent number: 7806984
    Abstract: An apparatus for manufacturing a semiconductor or liquid crystal has, within a reaction chamber 1 to which a reactive gas is supplied, a ceramic holder 2 having a resistive heating element 7 embedded therein; and further comprises a ceramic cylindrical support member 3 one end of which supports the ceramic holder 2 and the other end of which is fixed to a portion of the reaction chamber 1, and an inert gas supply tube 4 and inert gas evacuation tube 5 each having an opening inside the cylindrical support member 3. It is preferable that the inert gas within the cylindrical support member 3 be maintained at less than 0.1 MPa (one atmosphere). By means of such an arrangement, oxidation and corrosion of electrodes provided on the rear surface of the ceramic holder can be prevented, without an oxidation-resistant seal or corrosion-resistant seal being applied.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: October 5, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Kuibira, Masuhiro Natsuhara, Hirohiko Nakata
  • Publication number: 20100242844
    Abstract: A holder for semiconductor manufacturing equipment is provided, in which electrical leakage and sparks do not occur across the electrode terminals and lead wires to supply power to a resistive heating element embedded in a holder, and the thermal uniformity in the holder is within ±1.0%. The holder for semiconductor manufacturing equipment, that is provided in a chamber to which reactive gas is supplied, comprises a ceramic holder 1 which holds a treated material 10 on a surface thereof and is provided with a resistive heating element 2 for heating the material to be treated, and a support member 6 one end of which supports the ceramic holder 1 at a position other than the surface holding the material to be treated, and the other end of which is fixed to the chamber.
    Type: Application
    Filed: March 31, 2010
    Publication date: September 30, 2010
    Applicant: Sumitono Electric Industries, Ltd.
    Inventors: Akira KUIBIRA, Masuhiro Natsuhara, Hirohiko Nakata
  • Publication number: 20090283034
    Abstract: A wafer holder is provided that can be used in wafer processes at room temperature or lower and that is particularly suited for use in a CVD apparatus. The wafer holder 1 has a wafer-mounting surface. The wafer holder 1 is made of ceramic and has a flow channel 3 that allows coolant to flow to the interior of the wafer holder in order to cool the wafer holder 1, and is furthermore preferably provided with a high-frequency generating electrode 2. The wafer holder 1 can be manufactured having a flow channel 3 formed in one of the ceramic substrates, at least another ceramic substrate is joined to the ceramic substrate so as to cover the flow channel 3, and a ceramic plate in which a high-frequency generating electrode 2 is formed is preferably additionally joined to the other substrates.
    Type: Application
    Filed: May 21, 2007
    Publication date: November 19, 2009
    Applicant: Sumitomo Electric Industries, LTD.
    Inventors: Masuhiro Natsuhara, Tomoyuki Awazu, Kenji Shinma, Hirohiko Nakata
  • Patent number: 7618494
    Abstract: The object of the present invention is to prevent damage due to thermal stress induced into a substrate holding table in a substrate holding structure for holding a substrate to be processed. In the substrate holding structure having the substrate holding table arranged at the top of a support column, a flanged part is defined by an inner circumferential surface and an outer circumferential surface at a joint between the support column and the substrate holding table. The inner circumferential surface is formed of an inclined surface, which is inclined such that the inner diameter of the flanged part successively increases as approaching the lower surface of the substrate holding table. On the lower surface of the substrate holding table to which the flanged part is joined, a U-shaped groove is formed so as to correspond to the outer circumferential surface of the flanged part.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: November 17, 2009
    Assignees: Tokyo Electron Limited, Sumitomo Electric Industries, Ltd.
    Inventors: Sumi Tanaka, Tetsuya Saito, Masuhiro Natsuhara, Hirohiko Nakata
  • Patent number: 7576303
    Abstract: A wafer holder is provided having high rigidity and an enhanced heat-insulating effect that allow positional accuracy and heating uniformity to be improved, a chip to be rapidly heated and cooled, and the manufacturing cost to be reduced, and a wafer prober apparatus on which the wafer holder is mounted. The wafer holder of the present invention includes a chuck top for mounting a wafer, a support member for supporting the chuck top, and a stand for supporting the support member. The chuck top has a thermal conductivity K1 and a Young's modulus Y1; the support member has a thermal conductivity K2 and a Young's modulus Y2; and the stand has a thermal conductivity K3 and a Young's modulus Y3. K1>K2 and K1>K3; and Y3>Y1 and Y3>Y2.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: August 18, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masuhiro Natsuhara, Tomoyuki Awazu, Hirohiko Nakata, Katsuhiro Itakura
  • Patent number: 7554059
    Abstract: A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and the performance is maintained for a long period of use, and the manufacturing cost of the module is decreased. The ceramic heater includes a ceramic heater body and a cooling module cooling the heater body, and the cooling module has a structure formed by arranging a pipe in a trench formed in a plate-shaped structure.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: June 30, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tomoyuki Awazu, Akira Mikumo, Masuhiro Natsuhara, Hirohiko Nakata
  • Publication number: 20090142479
    Abstract: Wafer holder and semiconductor manufacturing equipment in which the holder is installed, the wafer holder having a wafer-carrying surface, wherein incidence of warping and cracking when the wafer holder is heated is slight. In the wafer holder having a wafer-carrying surface, electrical circuitry consisting of one or more sinter laminae is formed on the face or in the interior of the wafer holder; and by rendering pores present in the circuitry, the incidence of warping and cracking can be made very slight. The electrical circuitry is preferably any of an electrode circuit for an electrostatic chuck, a resistive-heating-element circuit, an RF-power electrode circuit, and a high-voltage-generating electrode circuit.
    Type: Application
    Filed: February 9, 2009
    Publication date: June 4, 2009
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Masuhiro Natsuhara, Hirohiko Nakata, Manabu Hashikura
  • Publication number: 20090126903
    Abstract: A heat transfer member (20) has a support (1), and columnar bodies (2) all or some of which are disposed so as to be inclined at an angle with respect to the support (1). The columnar bodies (2) are in contact with a contacted body (21), and the columnar bodies (2) elastically deform and/or plastically deform along the shape of the contact surface with the contacted body (21) to thereby make direct contact along the wavy and rough irregularities of the contacted body (21), and to cause heat to move through the columnar bodies (2).
    Type: Application
    Filed: April 18, 2007
    Publication date: May 21, 2009
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Akira Kuibira, Masuhiro Natsuhara, Tomoyuki Awazu, Hirohiko Nakata
  • Publication number: 20090050621
    Abstract: A wafer holder that prevents positional deviation of the wafer mounted on the wafer-mounting surface of a chuck top and enables better thermal uniformity of the wafer, as well as a heater unit including the wafer holder and a wafer prober mounting these are provided. The wafer holder has a chuck top mounting and fixing the wafer and a supporter supporting the chuck top, and the chuck top has water absorption of at least 0.01% and preferably at least 0.1%. Preferable material of the chuck top is a composite of metal and ceramics, and particularly, a composite of aluminum and silicon carbide, or a composite of silicon and silicon carbide.
    Type: Application
    Filed: July 27, 2006
    Publication date: February 26, 2009
    Inventors: Tomoyuki Awazu, Katsuhiro Itakura, Masuhiro Natsuhara, Hirohiko Nakata
  • Patent number: 7495460
    Abstract: A wafer holding body used for a wafer prober for testing a semiconductor wafer includes a chuck top having a conductive layer on a surface thereof and a support body supporting the chuck top. The support body has a base portion opposing the chuck top and a side portion extending from the perimeter of the base portion to the chuck top to support the chuck top. A cavity portion is formed between the chuck top and the base portion of the support body. A reflection plate is provided in the cavity portion. A heater unit and a wafer prober includes the wafer holding body.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: February 24, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Katsuhiro Itakura, Masuhiro Natsuhara, Hirohiko Nakata
  • Publication number: 20090045829
    Abstract: It is an object of the present invention to provide a wafer prober wafer holder that is highly rigid and increases the heat insulating effect, thereby improving positional accuracy, thermal uniformity, and chip temperature ramp-up and cooling rates, as well as a wafer prober device equipped therewith. A wafer holder of the present invention includes a chuck top that mounts a wafer, and a support member that supports the chuck top, wherein, a restricting member is provided that covers an interface between the chuck top and the support member. By covering the gap between the chuck top and the support member with the restricting member, the heat insulating effect can be increased by preventing the flow of outside air through the gap into the support member, and the cooling rate can be particularly improved if cooling to a temperature below room temperature.
    Type: Application
    Filed: July 31, 2006
    Publication date: February 19, 2009
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Tomoyuki Awazu, Katsuhiro Itakura, Masuhiro Natsuhara, Hirohiko Nakata
  • Publication number: 20080277841
    Abstract: A ceramic base material that is reduced in distortion caused by high-temperature heat treatment. A ceramic base material having sintering agents and satisfying the following formula: a/b?1.3, where a: the larger of c1 and c2, b: the smaller of c1 and c2, c1: the ratio “k” at a main-surface side, c2: the ratio “k” at the other main-surface side, k=s/m, s: the fluorescent X-ray-detected strength of the constituent elements of the sintering agents, m: the fluorescent X-ray-detected strength of the main-constituent elements.
    Type: Application
    Filed: July 11, 2008
    Publication date: November 13, 2008
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Masuhiro Natsuhara, Hirohiko Nakata, Motoyuki Tanaka, Yasuhiro Murase
  • Patent number: 7425838
    Abstract: According to the invention, there is provided a wafer holding member for use in a wafer prober for inspecting a semiconductor wafer, including a chuck top and a supporting member for supporting the chuck top, wherein the supporting member has a bottom portion facing to the chuck top, a cavity portion is formed between the chuck top and the bottom portion of the supporting member, and there is provided, in the cavity portion, at least a portion of a cooling mechanism for cooling at least one of the chuck top and the supporting member. Further, there is provided a wafer prober using the wafer holding member.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: September 16, 2008
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Katsuhiro Itakura, Masuhiro Natsuhara, Hirohiko Nakata
  • Patent number: 7414823
    Abstract: Affords a holder for use in semiconductor or liquid-crystal manufacturing devices—as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed—in which temperature uniformity in the processed-object retaining face is heightened. Configuring the holder with, furnished atop a ceramic susceptor, a composite of a ceramic and a metal improves the temperature uniformity in the holder's processed-object retaining face and makes for curtailing the generation of particulates and other contaminants. In addition, putting a coating on at least the retaining face improves the durability of the holder. Installing a holder of this sort in a semiconductor manufacturing device or a liquid-crystal manufacturing device contributes to making available semiconductor or liquid-crystal manufacturing devices whose productivity and throughput are excellent.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: August 19, 2008
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Manabu Hashikura, Hirohiko Nakata, Akira Kuibira, Masuhiro Natsuhara
  • Patent number: 7408131
    Abstract: A wafer holder is provided in which local heat radiation in supporting and heating wafers is kept under control and temperature uniformity of the wafer retaining surface is enhanced, and by making use of the wafer holder a semiconductor manufacturing apparatus suitable for processing larger-diameter wafers is made available. In a wafer holder (1) including within a ceramic substrate (2) a resistive heating element (3) or the like and being furnished with a lead (4) penetrating a reaction chamber (6), the lead (4) is housed in a tubular guide member (5), and an interval between the guide member (5) and the reaction chamber (6) as well as the interior of the guide member (5) are hermetically sealed. The guide member (5) and the ceramic substrate (2) are not joined together, and in the interior of the guide member (5) in which the inside is hermetically sealed, the atmosphere toward the ceramic substrate (2) is preferably substantially the same as the atmosphere in the reaction chamber (6).
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: August 5, 2008
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masuhiro Natsuhara, Hirohiko Nakata, Akira Kuibira, Manabu Hashikura
  • Patent number: 7394043
    Abstract: Ceramic susceptor whose wafer-retaining face has superior isothermal properties, and that is suited to utilization in apparatuses for manufacturing semiconductors and in liquid-crystal manufacturing apparatuses. In plate-shaped sintered ceramic body 1, resistive heating element 2 is formed. Fluctuation in pullback length L between sintered ceramic body outer-peripheral edge 1a and resistive heating element substantive-domain outer-peripheral edge 2a is within ±0.8%, while isothermal rating of the entire surface of the wafer-retaining face is ±1.0% or less. Preferable is a superior isothermal rating of ±0.5% or less that can be achieved by bringing the fluctuation in pullback length L to within ±0.5%.
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: July 1, 2008
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akira Kuibira, Masuhiro Natsuhara, Hirohiko Nakata