Abstract: A self-threading and tensioning device for use with a semiconductor bonder, or the like, is disclosed. A first pneumatic stream is used to obtain the self-threading of the thin (e.g. 1 mil.) bonding wire. A second pneumatic stream provides the tensioning of the wire during the bonding process.

Abstract: A method and apparatus for aligning the streets of a semiconductor wafer for sawing or scribing with a single motion control switch. One end of a street is first aligned with a reticle in the Y-direction with this motion control switch. The wafer is then moved in the X-direction while the operator with the same control switch, controls the rotation of the wafer so as to align the street with the reticle. Automatic Y-direction alignment is provided during this rotation by determining the Y-direction misalignment which occurs from the rotation, and by automatically moving the wafer saw blade assembly in the Y-direction to provide the necessary compensation.

Abstract: A magazine and driving means particularly adaptable for handling semiconductor lead frames, or the like, in an automatic processing device such as a bonder is described. The magazines slidingly engage buttons on the front panel of the bonder or other device. In-line teeth defining a rack are formed on the exterior of each of the magazines. The magazines are driven directly by indexing pins which are connected to a geneva movement. Missing teeth at the ends of the racks allow the magazines to feed-through, thus providing automatic, uninterrupted operation from magazine-to-magazine.

Abstract: A height sensor is disclosed which permits a tool to sense the height of a semiconductor die, or the like, above a work surface such as a bonding table. A tool arm moves transverse to the work surface and is interconnected to a cam by a second arm. The second arm is disengageable from the first arm and disengages the first arm when the tool contacts the semiconductor die. Sensing means are provided to detect the separation of the two arms.

Abstract: A lead wire capillary bonding tool formed from a rod with a core, the rod having a shaped end upon which tungsten carbide or refractory metal is vapor deposited and then the core removed.