Abstract: In one embodiment, a sensor system includes an active thermal sensor pixel matrix, a plurality of presence sensors, and an image acquisition controller. The pixel matrix includes a plurality of pixels arranged in a plurality of rows and a plurality of columns and a boundary defining a perimeter. The plurality of presence sensors is disposed at least partially within the boundary of the pixel matrix. The image acquisition controller is coupled to the pixel matrix and the plurality of presence sensors. The image acquisition controller is configured to: (i) receive signals from the presence sensors; (ii) identify, based on the signals, a scan region, wherein the scan region is a portion of the pixel matrix that is in contact with or adjacent to a specimen; and (iii) obtain image data only from pixels that are within the scan region for generating an image of the specimen.

Abstract: In one embodiment, a sensor system includes an active thermal sensor pixel matrix, a plurality of presence sensors, and an image acquisition controller. The pixel matrix includes a plurality of pixels arranged in a plurality of rows and a plurality of columns and a boundary defining a perimeter. The plurality of presence sensors is disposed at least partially within the boundary of the pixel matrix. The image acquisition controller is coupled to the pixel matrix and the plurality of presence sensors. The image acquisition controller is configured to: (i) receive signals from the presence sensors; (ii) identify, based on the signals, a scan region, wherein the scan region is a portion of the pixel matrix that is in contact with or adjacent to a specimen; and (iii) obtain image data only from pixels that are within the scan region for generating an image of the specimen.

Abstract: In one embodiment, a sensor system includes an active thermal sensor pixel matrix, a plurality of presence sensors, and an image acquisition controller. The pixel matrix includes a plurality of pixels arranged in a plurality of rows and a plurality of columns and a boundary defining a perimeter. The plurality of presence sensors is disposed at least partially within the boundary of the pixel matrix. The image acquisition controller is coupled to the pixel matrix and the plurality of presence sensors. The image acquisition controller is configured to: (i) receive signals from the presence sensors; (ii) identify, based on the signals, a scan region, wherein the scan region is a portion of the pixel matrix that is in contact with or adjacent to a specimen; and (iii) obtain image data only from pixels that are within the scan region for generating an image of the specimen.

Abstract: A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal or amorphous structures, different crystalline orientations, different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

Abstract: A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal structures, or different crystalline orientations, or different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

Abstract: In one aspect, a sensor includes an image acquisition controller and a pixel array. The pixel array includes a first set of pixels electrically coupled to the controller and a second set of pixels electrically coupled to the controller. The sensor is configured to operate in a first mode and a second mode. When operating in the first mode, the controller is configured to acquire signals from only the first set of pixels for generating a low-resolution image. When operating in the second mode, the controller is configured to acquire signals from both the first set of pixels and the second set of pixels for generating a high-resolution image.

Abstract: In one aspect, a sensor includes an image acquisition controller and a pixel array. The pixel array includes a first set of pixels electrically coupled to the controller and a second set of pixels electrically coupled to the controller. The sensor is configured to operate in a first mode and a second mode. When operating in the first mode, the controller is configured to acquire signals from only the first set of pixels for generating a low-resolution image. When operating in the second mode, the controller is configured to acquire signals from both the first set of pixels and the second set of pixels for generating a high-resolution image.

Abstract: A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal structures, or different crystalline orientations, or different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

Abstract: A fingerprint sensing device includes a substrate; a plurality of pixels arranged in a grid of rows and columns, each pixel having an active thermal sensing element therein; a first metal layer forming first addressing lines for addressing the active thermal sensing elements; a second metal layer above the first metal layer and forming second addressing lines for addressing the active thermal sensing elements; an electrically conductive ESD protection layer; and an insulating layer disposed between the ESD protection layer and the active thermal sensing elements. The ESD protection layer is electrically connected to a bias potential. The ESD protection layer is disposed in a pattern such that it partially overlaps each pixel, the ESD protection layer at least partially overlapping the active thermal sensing element of each pixel.

Abstract: A fingerprint sensing device includes a substrate; a plurality of pixels arranged in a grid of rows and columns, each pixel having an active thermal sensing element therein; a first metal layer forming first addressing lines for addressing the active thermal sensing elements; a second metal layer above the first metal layer and forming second addressing lines for addressing the active thermal sensing elements; an electrically conductive ESD protection layer; and an insulating layer disposed between the ESD protection layer and the active thermal sensing elements. The ESD protection layer is electrically connected to a bias potential. The ESD protection layer is disposed in a pattern such that it partially overlaps each pixel, the ESD protection layer at least partially overlapping the active thermal sensing element of each pixel.

Abstract: A decoder for sequentially enabling outputs in response to clock signal inputs is described including X number of logic stages corresponding to X number of outputs of the decoder. Each of the logic stages has a plurality of inputs, wherein each logic stage includes fewer than log2X inputs for receiving the clock signal inputs.

Abstract: An active sensor apparatus includes an array of sensor elements arranged in a plurality of columns and rows of sensor elements. The sensor apparatus includes a plurality of column and row thin film transistor switches for selectively activating the sensor elements, and a plurality of column and row thin film diodes for selectively accessing the sensor elements to obtain information from the sensor elements. The thin film transistor switches and thin film diodes are formed on a common substrate.

Abstract: A decoder for sequentially enabling outputs in response to clock signal inputs is described including X number of logic stages corresponding to X number of outputs of the decoder. Each of the logic stages has a plurality of inputs, wherein each logic stage includes fewer than log2X inputs for receiving the clock signal inputs.

Abstract: A decoder for sequentially enabling outputs in response to clock signal inputs is described including X number of logic stages corresponding to X number of outputs of the decoder. Each of the logic stages has a plurality of inputs, wherein each logic stage includes fewer than log2X inputs for receiving the clock signal inputs.

Abstract: An active matrix display includes at least one data driver circuit comprising a column data line and a parallel column current line; a plurality of pixels connected in series to both the column data line and the parallel column current line comprising at least one pixel that is responsive to the column data line to drive a selected pixel current to the at least one pixel; and a loopback control circuit at the head of the column and external to the plurality of pixels that senses a voltage difference between an input column current in the current line and a voltage of a load drawing on the current line and that adjusts a data programming voltage according to the difference.

Abstract: A decoder for sequentially enabling outputs in response to clock signal inputs is described including X number of logic stages corresponding to X number of outputs of the decoder. Each of the logic stages has a plurality of inputs, wherein each logic stage includes fewer than log2X inputs for receiving the clock signal inputs.

Abstract: An active sensor apparatus includes an array of sensor elements arranged in a plurality of columns and rows of sensor elements. The sensor apparatus includes a plurality of column and row thin film transistor switches for selectively activating the sensor elements, and a plurality of column and row thin film diodes for selectively accessing the sensor elements to obtain information from the sensor elements. The thin film transistor switches and thin film diodes are formed on a common substrate.

Abstract: An active matrix display includes at least one data driver circuit comprising a column data line and a parallel column current line; a plurality of pixels connected in series to both the column data line and the parallel column current line comprising at least one pixel that is responsive to the column data line to drive a selected pixel current to the at least one pixel; and a loopback control circuit at the head of the column and external to the plurality of pixels that senses a voltage difference between an input column current in the current line and a voltage of a load drawing on the current line and that adjusts a data programming voltage according to the difference.