Patents by Inventor Matthew F. Cali

Matthew F. Cali has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8327370
    Abstract: A computer-implemented method, apparatus, and computer program product are disclosed for optimizing the fractional allocation of a computing resource among multiple partitions in a data processing system. Multiple processing attributes are defined. A policy is generated for a first partition. The policy includes the definition of the processing attributes. Current values are determined for the first partition for the processing attributes. The policy and the current values are then used to determine a fractional portion of the resource to be allocated to the first partition.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: December 4, 2012
    Assignee: International Business Machines Corporation
    Inventors: Balaji Venkata Atyam, Franck Barillaud, Matthew F. Cali, Anita Govindjee
  • Patent number: 5489900
    Abstract: A strain sensitive columnar transducer for a data entry keyboard contains a column upstanding from the keyboard. Strain sensitive orthogonally oriented patterns are formed on a single flexible planar sheet which is sliced to place each of the patterns on a separate tab. The planar sheet is forced over the column so that the patterns lie up against the sides of the column to measure force exerted on the column.
    Type: Grant
    Filed: June 3, 1994
    Date of Patent: February 6, 1996
    Assignee: International Business Machines Corporation
    Inventors: Matthew F. Cali, Jerome J. Cuomo, Donald J. Mikalsen, Joseph D. Rutledge, Edwin J. Selker
  • Patent number: 5321886
    Abstract: A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: June 21, 1994
    Assignee: International Business Machines Corporation
    Inventors: Pedro A. Chalco, Matthew F. Cali, Laertis Economikos, James L. Speidell
  • Patent number: 5310967
    Abstract: A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: May 10, 1994
    Assignee: International Business Machines Corporation
    Inventors: Pedro A. Chalco, Matthew F. Cali, Laertis Economikos, James L. Speidell
  • Patent number: 5289632
    Abstract: A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: March 1, 1994
    Assignee: International Business Machines Corporation
    Inventors: Pedro A. Chalco, Matthew F. Cali, Laertis Economikos, James L. Speidell
  • Patent number: 5281025
    Abstract: A temperature sensing device for accurately measuring the temperature of a microbonding device tip. The temperature sensing device consists of an array of thin-film thermocouples produced by thin-film patterning techniques on a substrate card. Each thermocouple is composed of two circuit lines of dissimilar metals A & B. The dissimilar metals are superimposed at a junction point. A third metal C is deposited between the metals A and B to prevent premature degradation of the thermocouple junction. A common line is used for one of the two metals connecting to the junctions. This allows almost twice as many thermocouples than conventional layout techniques.
    Type: Grant
    Filed: January 14, 1993
    Date of Patent: January 25, 1994
    Assignee: International Business Machines Corp.
    Inventors: Matthew F. Cali, Pedro A. Chalco