Patents by Inventor Matthew Meitl

Matthew Meitl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210311140
    Abstract: A multi-element sensor for measuring a magnetic field. The multi-element sensor comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element comprises a sensor substrate and a magnetic sensor. The magnetic sensing element is mounted on the electronic circuit and contact pads are provided on the magnetic sensor. The contact pads of the magnetic sensing element are electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material, and the contact pads are disposed next to an edge or at a corner of the sensor substrate.
    Type: Application
    Filed: June 18, 2021
    Publication date: October 7, 2021
    Inventors: Christian SCHOTT, Matthew MEITL, Christopher BOWER
  • Patent number: 11139797
    Abstract: A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: October 5, 2021
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok
  • Patent number: 11137641
    Abstract: A light-emitting diode (LED) structure includes an LED substrate having a first side and a second side opposing the first side. One or more light-emitting diodes are disposed on the first side and arranged to emit light through the LED substrate. In certain embodiments, a wire-grid polarizer is disposed on the second side and arranged to polarize light emitted from the one or more light-emitting diodes. A plurality of different colored LEDs or an LED with one or more color-conversion materials can be provided on the LED substrate to provide white light. A spatially distributed plurality of the LED structures can be provided in a backlight for a liquid crystal display. A polarization-preserving transmissive diffuser can diffuse light emitted from the LED toward the liquid crystal layer and a polarization-preserving reflective diffuser can diffuse light emitted from the LED away from the liquid crystal layer.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: October 5, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Ronald S. Cok, Christopher Bower, Matthew Meitl
  • Patent number: 11127812
    Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: September 21, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, Carl Prevatte, Ronald S. Cok
  • Patent number: 11088268
    Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: August 10, 2021
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
  • Publication number: 20210225815
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 22, 2021
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Patent number: 11067643
    Abstract: A multi-element sensor for measuring a magnetic field. The multi-element sensor comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit and comprises a fractured tether. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: July 20, 2021
    Assignees: MELEXIS TECHNOLOGIES NV, X-CELEPRINT LIMITED
    Inventors: Christian Schott, Matthew Meitl, Christopher Bower
  • Publication number: 20210167100
    Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.
    Type: Application
    Filed: February 4, 2021
    Publication date: June 3, 2021
    Inventors: Christopher Bower, Etienne Menard, Matthew Meitl, Joseph Carr
  • Patent number: 11024608
    Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: June 1, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Andrew Bower, Salvatore Bonafede, Erich Radauscher, Carl Ray Prevatte, Jr., António José Marques Trindade, Tanya Yvette Moore
  • Publication number: 20210120650
    Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.
    Type: Application
    Filed: December 29, 2020
    Publication date: April 22, 2021
    Inventors: Matthew Meitl, Ronald S. Cok, Christopher Bower
  • Patent number: 10985143
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: April 20, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Patent number: 10964583
    Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: March 30, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
  • Patent number: 10943931
    Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: March 9, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Etienne Menard, Matthew Meitl, Joseph Carr
  • Patent number: 10930623
    Abstract: A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: February 23, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Ronald S. Cok, Christopher Bower, Matthew Meitl, Carl Prevatte, Jr.
  • Patent number: 10917953
    Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: February 9, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Matthew Meitl, Ronald S. Cok, Christopher Bower
  • Patent number: 10833225
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: November 10, 2020
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Patent number: 10832935
    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: November 10, 2020
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
  • Publication number: 20200335381
    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, JR.
  • Patent number: 10782002
    Abstract: A light-emitting diode (LED) optical component comprises a component substrate and an disposed on the component substrate. The LED emits light when provided with electrical power. An optical element is disposed at least partly in contact with the component substrate such that at least a portion of the emitted light is incident on the optical element. A second optical element can optionally be disposed between the LED and the component substrate or on a side of the component substrate opposite the LED. An LED optical system includes a system substrate on which one or more LED optical components are disposed. The system substrate can be or include one or more optical elements.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: September 22, 2020
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok, Brent Fisher
  • Patent number: 10777521
    Abstract: A printable component structure includes a chiplet having a semiconductor structure with a top side and a bottom side, one or more top electrical contacts on the top side of the semiconductor structure, and one or more bottom electrical contacts on the bottom side of the semiconductor structure. One or more electrically conductive spikes are in electrical contact with the one or more top electrical contacts. Each spike protrudes from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: September 15, 2020
    Assignee: X Display Company Technology Limited
    Inventors: Matthew Meitl, Christopher Bower, Ronald S. Cok