Patents by Inventor Matthew Meitl
Matthew Meitl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10782002Abstract: A light-emitting diode (LED) optical component comprises a component substrate and an disposed on the component substrate. The LED emits light when provided with electrical power. An optical element is disposed at least partly in contact with the component substrate such that at least a portion of the emitted light is incident on the optical element. A second optical element can optionally be disposed between the LED and the component substrate or on a side of the component substrate opposite the LED. An LED optical system includes a system substrate on which one or more LED optical components are disposed. The system substrate can be or include one or more optical elements.Type: GrantFiled: October 27, 2017Date of Patent: September 22, 2020Assignee: X Display Company Technology LimitedInventors: Christopher Bower, Matthew Meitl, Ronald S. Cok, Brent Fisher
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Patent number: 10777521Abstract: A printable component structure includes a chiplet having a semiconductor structure with a top side and a bottom side, one or more top electrical contacts on the top side of the semiconductor structure, and one or more bottom electrical contacts on the bottom side of the semiconductor structure. One or more electrically conductive spikes are in electrical contact with the one or more top electrical contacts. Each spike protrudes from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure.Type: GrantFiled: August 11, 2015Date of Patent: September 15, 2020Assignee: X Display Company Technology LimitedInventors: Matthew Meitl, Christopher Bower, Ronald S. Cok
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Patent number: 10749093Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.Type: GrantFiled: October 22, 2019Date of Patent: August 18, 2020Assignee: X Display Company Technology LimitedInventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, Jr.
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Publication number: 20200243467Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.Type: ApplicationFiled: January 31, 2020Publication date: July 30, 2020Inventors: Carl Prevatte, Christopher Bower, Ronald S. Cok, Matthew Meitl
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Patent number: 10690920Abstract: A transparent display comprises an at least partially transparent display substrate having a display area and a bezel area adjacent to each of at least one corresponding side of the display area. Light-controlling elements are disposed in, on, or over the display substrate in the display area. Display wires are disposed in, on, or over the display substrate in the display area and are electrically connected to the light-controlling elements. Bezel wires are disposed in, on, or over the display substrate in the bezel area, the bezel wires electrically connected to respective ones of the display wires. The transparent display has a bezel transparency that varies over the bezel area. Bezel wires can be spaced apart by a bezel wire spacing that is greater than a width of the bezel wires. A display wire can be a mesh wire or have a depth greater than a width.Type: GrantFiled: February 28, 2018Date of Patent: June 23, 2020Assignee: X Display Company Technology LimitedInventors: Ronald S. Cok, Christopher Andrew Bower, Matthew Meitl, Brook Raymond, Erich Radauscher
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Publication number: 20200168760Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.Type: ApplicationFiled: January 30, 2020Publication date: May 28, 2020Inventors: Brook Raymond, Christopher Andrew Bower, Matthew Meitl, Ronald S. Cok
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Publication number: 20200161291Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: October 29, 2019Publication date: May 21, 2020Inventors: John A. ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
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Patent number: 10620277Abstract: A semiconductor chip for measuring a magnetic field. The semiconductor chip comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.Type: GrantFiled: November 3, 2015Date of Patent: April 14, 2020Assignees: MELEXIS TECHNOLOGIES NV, X-CELEPRINT LIMITEDInventors: Christian Schott, Matthew Meitl, Christopher Bower
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Publication number: 20200105697Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.Type: ApplicationFiled: December 3, 2019Publication date: April 2, 2020Inventors: Carl Prevatte, Christopher Bower, Ronald S. Cok, Matthew Meitl
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Publication number: 20200098796Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.Type: ApplicationFiled: November 26, 2019Publication date: March 26, 2020Inventors: Christopher Bower, Etienne Menard, Matthew Meitl, Joseph Carr
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Patent number: 10600671Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: GrantFiled: July 3, 2019Date of Patent: March 24, 2020Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Patent number: 10593827Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.Type: GrantFiled: December 4, 2018Date of Patent: March 17, 2020Inventors: Brook Raymond, Christopher Andrew Bower, Matthew Meitl, Ronald S. Cok
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Publication number: 20200052063Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.Type: ApplicationFiled: September 23, 2019Publication date: February 13, 2020Inventors: Christopher Bower, Matthew Meitl, Carl Prevatte, Ronald S. Cok
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Publication number: 20200052176Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.Type: ApplicationFiled: October 22, 2019Publication date: February 13, 2020Inventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, JR.
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Publication number: 20200052164Abstract: A method of making a flexible device comprises providing a rigid substrate and a flexible substrate, disposing a layer of print adhesive on the rigid substrate, and micro-transfer printing micro-devices onto the print adhesive. Each of the micro-devices comprises a micro-device substrate separate, independent, and distinct from the rigid substrate and from the flexible substrate. A bonding layer is provided to bond the flexible substrate to the micro-devices such that (i) the bonding layer is disposed between the flexible substrate and the micro-devices and (ii) the micro-devices are disposed between the rigid substrate and the flexible substrate (e.g., forming a device structure). The flexible substrate is separated from the rigid substrate so that the micro-devices remain bonded to the flexible substrate providing a flexible device. The micro-devices can comprise at least a portion of a micro-device tether.Type: ApplicationFiled: October 16, 2019Publication date: February 13, 2020Inventors: Brook Raymond, Christopher Andrew Bower, Ronald S. Cok, Matthew Meitl
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Publication number: 20200006540Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.Type: ApplicationFiled: June 21, 2019Publication date: January 2, 2020Applicant: The Board of Trustees of the University of IllinoisInventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
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Patent number: 10522575Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.Type: GrantFiled: November 15, 2018Date of Patent: December 31, 2019Assignee: X-Celeprint LimitedInventors: Christopher Bower, Etienne Menard, Matthew Meitl, Joseph Carr
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Patent number: 10522710Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.Type: GrantFiled: July 3, 2019Date of Patent: December 31, 2019Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Carl Prevatte, Salvatore Bonafede
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Publication number: 20190385886Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.Type: ApplicationFiled: August 19, 2019Publication date: December 19, 2019Inventors: Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte
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Patent number: 10510937Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.Type: GrantFiled: November 9, 2018Date of Patent: December 17, 2019Assignee: X-Celeprint LimitedInventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, Jr.