Abstract: Embodiments disclosed herein represent powder based additive manufacturing processes which provide a microstructure having improved mechanical properties. The methods may include the use of ultrasonic excitation in combination with the active control of a substrate's temperature to provide some level of control over the microstructure and hence the properties.

Abstract: A meta-solid-state battery includes a first layer disposed on a first current collector, a second layer disposed on a second current collector, and third layer disposed between the first layer and the second layer. The first layer and the second layer are the cathode and anode electrodes. The third layer includes a first meta-solid-state electrolyte material. Each of the cathode and anode electrodes contain: an active material in an amount ranging from approximately 70% to 99.98% by weight, a carbon additive in an amount ranging from approximately 0.010% to 20% by weight, and a second meta-solid-state electrolyte material in an amount ranging from approximately 0.010% to 10% by weight. The first and second meta-solid-state electrolyte material include a gel polymer.

Abstract: A device is designed to remove blockages in a lumen such as a thrombus, blood clot, or embolus. The device comprises a manipulating wire and a structure that can conduct electrical current to a lumen blockage. The electrical current is preferably in radio frequency (RF). The RF electric current in the blockage can excite the contents such as proteins of the blockage, so that cross-linking density and interfacial adsorption of the entire blockage is enhanced. The enhanced cross-linking density can result in increased fracture resistance of the blockage such that fracture of the blockage during the removal process is unlikely. The enhanced interfacial adsorption results in increased interfacial fracture resistance between the device and blockage so that the blockage can be securely captured during the removal process without using radially applied force.

Abstract: A meta-solid-state battery includes a first layer disposed on a first current collector, a second layer disposed on a second current collector, and third layer disposed between the first layer and the second layer. The first layer and the second layer are the cathode and anode electrodes. The third layer includes a first meta-solid-state electrolyte material. Each of the cathode and anode electrodes contain: an active material in an amount ranging from approximately 70% to 99.98% by weight, a carbon additive in an amount ranging from approximately 0.010% to 20% by weight, and a second meta-solid-state electrolyte material in an amount ranging from approximately 0.010% to 10% by weight. The first and second meta-solid-state electrolyte material include a gel polymer.

Abstract: A meta-solid-state battery includes a first layer disposed on a first current collector, a second layer disposed on a second current collector, and third layer disposed between the first layer and the second layer. The first layer and the second layer are the cathode and anode electrodes. The third layer includes a first meta-solid-state electrolyte material. Each of the cathode and anode electrodes contain: an active material in an amount ranging from approximately 70% to 99.98% by weight, a carbon additive in an amount ranging from approximately 0.010% to 20% by weight, and a second meta-solid-state electrolyte material in an amount ranging from approximately 0.010% to 10% by weight. The first and second meta-solid-state electrolyte material include a gel polymer.

Abstract: Embodiments disclosed herein represent powder based additive manufacturing processes which provide a microstructure having improved mechanical properties. The methods may include the use of ultrasonic excitation in combination with the active control of a substrate's temperature to provide some level of control over the microstructure and hence the properties.

Abstract: A device is designed to remove blockages in a lumen such as a thrombus, blood clot, or embolus. The device comprises a manipulating wire and a structure that can conduct electrical current to a lumen blockage. The electrical current is preferably in radio frequency (RF). The RF electric current in the blockage can excite the contents such as proteins of the blockage, so that cross-linking density and interfacial adsorption of the entire blockage is enhanced. The enhanced cross-linking density can result in increased fracture resistance of the blockage such that fracture of the blockage during the removal process is unlikely. The enhanced interfacial adsorption results in increased interfacial fracture resistance between the device and blockage so that the blockage can be securely captured during the removal process without using radially applied force.

Abstract: An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent.

Abstract: A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.

Abstract: An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent.

Abstract: A conductive thin film device includes a substrate and a thin film structure applied to the substrate. The thin film structure is applied as a first layer and forms a one-dimensional nanomaterial networked layer deposited on the substrate. A coating layer overlays the one-dimensional nanomaterial networked layer and can be made from graphene or graphene oxide. The coating layer at least partially covers the nanomaterial networked layer, thereby forming the device as a double-layer structure.

Abstract: The claimed biocompatible device is designed to remove vessel occlusions such as a thrombus, blood clot, or embolus. The claimed devices maybe used to treat occlusions in the brain, in the vasculature, and in tissues and organs. The device is in a form of a wire or wire-like structure which can capture the occlusion with minimal contact force with the vessel wall by an application of electricity, or electrical, chemical, or microwave generated heat to enable capture of the occlusion by the device. The device, compared to conventional mechanical thrombectomy devices, captures the occlusion and reduces occlusion fragmentation without large radial force and vessel wall friction that can damage the vessel wall.

Abstract: Monodispersed silver nanowires are formed by a process utilizing a polyol. A capping agent is mixed in the polyol to form a substantially homogeneous solution. The solution is heated to a level below a boiling point of the polyol. The solution is diluted with a diluent which may consist of water and/or alcohol, and the solution is centrifuged to produce the silver nanowires.

Abstract: An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Abstract: A heat dissipation structure with aligned carbon nanotube arrays formed on both sides. The carbon nanotube arrays in between a heat source and a cooler are used as thermal interface material extending and dissipating heat directly from a heat source surface to a cooler surface. In some embodiments, an adhesive material can be used to dispense around carbon nanotube arrays and assemble the heat dissipation structure in between a heat source and a cooler. In some other embodiments, carbon nanotube arrays are formed on at least one of a heat source surface and a cooler surface and connect them together by further growing. The carbon nanotube arrays can be exposed to the environment instead of being in between a heat source and a solid cooler, and can serve as fins to enlarge heat dissipation area and improve thermal convection.

Abstract: Wetting and print transfer from a printing patterned transfer surface is enhanced by applying an ultraviolet radiation responsive material to the patterned transfer surface. Ultraviolet activation of the ultraviolet responsive coating is performed during a transfer of printing material to a substrate. The technique increases precision of the printing process and is useful for transfer of printing material to a substrate in order to establish printed circuit components such as circuit traces and printed circuit elements on the substrate. In a particular configuration the ultraviolet radiation responsive material can be made of azobenzene material or free radical initiators.

Abstract: A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.

Abstract: An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Abstract: A conductive thin film device includes a substrate and a thin film structure applied to the substrate. The thin film structure is applied as a first layer and forms a one-dimensional nanomaterial networked layer deposited on the substrate. A coating layer overlays the one-dimensional nanomaterial networked layer and can be made from graphene or graphene oxide. The coating layer at least partially covers the nanomaterial networked layer, thereby forming the device as a double-layer structure.

Abstract: An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.