Patents by Inventor Matthew P Elwin

Matthew P Elwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9852940
    Abstract: A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: December 26, 2017
    Assignee: Infineon Technologies Americas Corp.
    Inventors: Martin Standing, Andrew Sawle, Matthew P. Elwin, David P. Jones, Martin Carroll, Ian Glenville Wagstaffe
  • Patent number: 9852939
    Abstract: A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: December 26, 2017
    Assignee: Infineon Technologies Americas Corp.
    Inventors: Martin Standing, Andrew Sawle, Matthew P. Elwin, David P. Jones, Martin Carroll, Ian Glenville Wagstaffe
  • Patent number: 8368211
    Abstract: A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: February 5, 2013
    Assignee: International Rectifier Corporation
    Inventors: Martin Standing, Andrew Sawle, Matthew P Elwin, David P Jones, Martin Carroll, Ian Glenville Wagstaffe