Abstract: An apparatus comprising a device and a resistor. The device generally comprises (i) a gate configured to receive an input voltage, (ii) a drain coupled to a first supply voltage, and (iii) a source coupled to an output. The resistive element is generally coupled between the source and a second supply voltage. The apparatus generally provides voltage tolerance between the input voltage and the output.

Abstract: An apparatus comprising (i) an input circuit configured to provide a predetermined voltage tolerance in response to a plurality of control signals and (ii) a control circuit configured to generate the plurality of control signals in response to one or more input signals.

Abstract: An apparatus comprising (i) an input circuit configured to provide a predetermined voltage tolerance in response to a plurality of control signals and (ii) a control circuit configured to generate the plurality of control signals in response to one or more input signals.

Abstract: An apparatus having a plurality of serially cascaded delay cells each configured to generate a phase of a multi-phase signal and an intermediate signal, where (i) each of the delay cells is generally configured to respond to a bias signal and one of the intermediate signals and (ii) a first of the delay cells is generally configured to respond to an input signal.

Abstract: An apparatus comprising a plurality of serially cascaded delay cells each configured to generate a phase of a multi-phase signal and an intermediate signal, where (i) each of the delay cells is generally configured to respond to a bias signal and one of the intermediate signals and (ii) a first of the delay cells is generally configured to respond to an input signal.

Abstract: An improved wafer scale integrated circuit is described which includes non-contact power and data transmission coupling. Wireless power and data coupling reduces the mechanical stresses and strains on the wafer, and makes better use of the wafer area. An additional benefit comes from allowing better heat transfer management. In one embodiment, power is provided by inductive coupling. Data flow into and out of the wafer is accomplished optically, using optical detectors to receive and light emitting diodes to transmit. Multiple devices are integrated onto the semiconductor wafer. Systems may be incorporated using the traditional die sites. Connections between systems are made in the space between die sites.

Abstract: A method and structure for sensing data such as temperature with respect to objects such as silicon wafers undergoing fabrication or other processes involve the use of a monitor element of material and configuration similar to that of the objects being processed. A structure such as a closed loop or segment of a spiral may be formed on the surface of the monitor element, and acts as a secondary coil when brought into operative relation with a transformer structure which includes a primary coil, a current source and a sensing device. The sensing device senses variations in the electrical characteristics in the primary coil, caused by the presence of the monitor element, and can thereby determine the temperature or other desired data relating to the monitor element, which is substantially the same as comparable data for the objects being processed.

Abstract: A method and structure for sensing data such as temperature with respect to objects such as silicon wafers undergoing fabrication or other processes involve the use of a monitor element of material and configuration similar to that of the objects being processed. A structure such as a closed loop or segment of a spiral may be formed on the surface of the monitor element, and acts as a secondary coil when brought into operative relation with a transformer structure which includes a primary coil, a current source and a sensing device. The sensing device senses variations in the electrical characteristics in the primary coil, caused by the presence of the monitor element, and can thereby determine the temperature or other desired data relating to the monitor element, which is substantially the same as comparable data for the objects being processed.