Abstract: A liquid metal (LM) dispensing apparatus and method for design and fabrication thereof. Components of the LM dispensing apparatus are designed and tooled based on a target pinout (e.g., a number of, arrangement of, and dimensions of, holes in a substrate to have LM injected therein) and desired LM material. Embodiments employ detachably attached needles using a locking means to provide leak-free interchangeability of the needles. The flexibility with needles makes replacing damaged needles more perfunctory. Embodiments contour the LM reservoir to enhance uniform LM flow to the needles and dispense or inject LM from multiple detachably attached needles concurrently.

Abstract: In one embodiment, a direct injection device includes a head, a plunger, a reservoir, and multiple needles. The head controls extrusion of liquid stored in the reservoir of the direct injection device. For example, the head causes the plunger to compress the liquid in the reservoir, which causes the liquid to be extruded through the needles.

Abstract: An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the electronic component by melting the metal powder onto the electronic component. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; and a porous coating that includes grains of metal powder formed onto the substrate by melting the metal powder onto the substrate. An electronic package that includes a substrate; an electronic component mounted to a surface of the substrate; an initial mold covering the electronic component; and a porous coating that includes grains of metal powder formed onto the initial mold by melting the metal powder onto the initial mold.